A semiconductor quartz component cleaning equipment

A technology for cleaning equipment and semiconductors, applied in the directions of cleaning methods using liquids, cleaning methods and utensils, chemical instruments and methods, etc., can solve the problems of water stains, transfer, and numerous water stains on quartz parts, and reduce dumping. Falling, improve cleaning effect, good support effect

Active Publication Date: 2021-12-07
盛吉盛(宁波)半导体科技有限公司 +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned related technologies, the inventor believes that there are the following defects: for sink immersion cleaning equipment, since the quartz parts need to be completely immersed in the cleaning liquid during cleaning, the dirt dissolved in the cleaning liquid will be removed when the quartz parts are taken out. Adhesion to the pipe wall, causing numerous water spots on the quartz parts after drying
For flushing cleaning equipment, during the flushing process, with the washing of water, the dirt attached to the quartz parts will be transferred, especially for flushing equipment with brushes, the dirt is particularly easy to stay on the brushes. In the process of scraping the quartz parts, the brush will transfer the dirt to the quartz parts, resulting in obvious water spots on the cleaned quartz parts after drying

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A semiconductor quartz component cleaning equipment
  • A semiconductor quartz component cleaning equipment
  • A semiconductor quartz component cleaning equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] The following is attached Figure 1-4 The present invention is described in further detail.

[0037] The embodiment of the present application discloses a semiconductor quartz component cleaning equipment, referring to figure 1 , including a frame 1, a placement table 2, an outer tube wall cleaning device 3 and an inner tube wall cleaning device 4, the frame 1 is used as a supporting body, and it is a box-type structure. A stepped installation groove 11 is provided on the table surface of the frame 1 , and the placement platform 2 is in the shape of a circular platform, with rotating meshing teeth 21 arranged on its circumferential side wall, and the placement platform 2 is placed in the installation groove 11 .

[0038] refer to figure 2 In order to drive the placement table 2 to rotate, a rotating motor 12 is fixed on the side wall of the frame 1, a rotating worm 13 is fixed on the output shaft of the rotating motor 12, and the rotating worm 13 enters the installat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to semiconductor processing equipment, and discloses a cleaning equipment for semiconductor quartz components, which includes a frame, a placement table rotatably mounted on the frame and with a lifting opening in the center, and is arranged on the frame and located on one side of the placement table. The outer pipe wall cleaning device and the inner pipe wall cleaning device installed in the frame and below the lifting port, the inner pipe wall cleaning device includes a lifting platform, a top nozzle and a side nozzle installed on the lifting platform. The water outlet direction of the top nozzle is toward the top of the frame, the water outlet direction of the side nozzles is toward the side of the frame, and the side nozzles are distributed on both sides of the top nozzle; the flushing method of the top spray water of the present invention can make the quartz parts The residual dirt on the surface is taken away with the water flow, thus greatly improving the cleaning effect of quartz parts and reducing the occurrence of water stains.

Description

technical field [0001] The invention relates to the field of semiconductor processing equipment, in particular to a cleaning equipment for semiconductor quartz components. Background technique [0002] With the development of science and technology, semiconductor technology is a key research area for human beings at this stage. From small smart home appliances to medium-sized cars and ships, to aerospace and aerospace, all of them need to be applied to semiconductor technology. [0003] At present, the semiconductor that everyone refers to generally refers to chip manufacturing technology. In the chip manufacturing process, semiconductor epitaxy equipment, semiconductor diffusion equipment, etc. are needed, and some quartz components are used on these equipment, such as quartz boats. , Quartz tube, Quartz bracket, Quartz tank, etc. [0004] Before these quartz components are applied to semiconductor equipment, they need to be thoroughly cleaned to ensure good cleanliness, s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B08B3/02B08B13/00
CPCB08B3/022B08B13/00
Inventor 王卫良李士昌刘超平林保璋姜永峰
Owner 盛吉盛(宁波)半导体科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products