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Intelligent head-mounted device

A head-mounted device, intelligent technology, applied in sensor parts, sensors, electrical components, etc., can solve problems such as affecting the user's use effect, sound leakage, and adverse personal privacy protection.

Active Publication Date: 2021-10-26
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the open rear cavity will cause serious sound leakage to the outside world, which is not conducive to the protection of personal privacy and affects the user's use effect

Method used

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0029] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0030] At the same time,...

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Abstract

The invention discloses an intelligent head-mounted device. The intelligent head-mounted device comprises a device shell and a loudspeaker module installed in the device shell, wherein the device shell is provided with a front sound outlet hole and a rear sound outlet hole; the loudspeaker module comprises a module shell and a loudspeaker individual; the module shell is provided therein with an installation space; the module shell is provided with a sound outlet hole and a sound leakage hole; the sound outlet hole is in communication with the front sound outlet hole; the sound leakage hole is in communication with the rear sound outlet hole; the loudspeaker individual is arranged in the installation space and comprises a vibrating diaphragm capable of vibrating to produce sound; an effective volume on a path from a first side of the vibrating diaphragm to the sound outlet hole forms a front sound cavity; an effective volume on a path from a second side of the vibrating diaphragm to the sound leakage hole forms a rear sound cavity; the volume V1 of the front sound cavity and the volume V2 of the rear sound cavity meet the relational expression that V1 / V2 is larger than or equal to 0.42 and smaller than or equal to 2.5. The invention aims to provide the intelligent head-mounted device which can effectively improve the sound leakage of a product and widen the high-frequency cut-off frequency.

Description

technical field [0001] The invention relates to the technical field of electro-acoustic equipment, in particular to an intelligent head-mounted equipment. Background technique [0002] With the development of science and technology, smart wearable devices have brought great convenience to people's lives, and as smart wearable devices, smart head-mounted devices are becoming more and more popular. Smart wearable devices can be regarded as a miniature smart A device that has corresponding functions for collecting, processing or displaying data. Users can install programs provided by software service providers such as software and games in smart headsets, and can also complete functions such as adding schedules, map navigation, interacting with friends, taking photos and videos, and making video calls with friends through voice or motion control , and wireless network access can also be realized through the mobile communication network. [0003] In related technologies, the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R9/02H04R9/06H04R1/34
CPCH04R9/02H04R9/06H04R1/345G02C11/10G02C11/06G02C5/14
Inventor 王海荣郭翔朱本超
Owner GOERTEK INC
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