Double-face plastic package structure and manufacturing method thereof

Abstract

The invention relates to a double-side plastic package structure and a manufacturing method thereof, the double-side plastic package structure comprises a first laminated board, an anisotropic conductive adhesive layer and a second laminated board which are laminated, the first laminated board comprises a first element, a first circuit layer, a first base layer and a first plastic package body, the first circuit layer is arranged at one side, facing the anisotropic conductive adhesive layer, of the first base layer, and the second circuit layer is arranged at the other side, facing the anisotropic conductive adhesive layer, of the second plastic package body; the first element is embedded in the first plastic package body and is electrically connected with the first circuit layer; the second laminated board comprises a second element, a second circuit layer, a second base layer and a second plastic package body, the second circuit layer, the second base layer and the second plastic package body are stacked in sequence, the second circuit layer is arranged on the side, facing the anisotropic conductive adhesive layer, of the second base layer, the second element is embedded in the second plastic package body and electrically connected with the second circuit layer, and the anisotropic conductive adhesive layer is bonded between the first circuit layer and the second circuit layer. The first circuit layer and the second circuit layer are electrically connected through the anisotropic conductive adhesive layer. The double-face plastic package structure is high in manufacturing yield and packaging reliability and low in manufacturing cost.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit packaging, and in particular to a double-sided plastic packaging structure and a manufacturing method thereof. Background Art

[0002] The existing double-sided plastic encapsulation technology usually first mounts the chip and / or passive components on the front of the substrate, then performs the first plastic encapsulation to complete the front encapsulation, and then performs the second chip and / or passive components on the back of the substrate, and then performs the second plastic encapsulation to complete the back encapsulation. Among them, the two plastic encapsulations require molds of different thicknesses, and the molds cannot be shared, resulting in long production time and high costs. In addition, after completing the double-sided mounting and two plastic encapsulations, it is necessary to open holes to lead out the chip circuits, and then perform electrical testing after ball planting. It is not easy to monitor the yield, and both the double-sided mounting and ball planting processes require high temperature and high heat conditions, which affects the packaging reliability of the entire product. Summary of the invention

[0003] In view of this, it is necessary to provide a double-sided plastic packaging structure that solves at least one of the above problems.

[0004] In addition, it is also necessary to provide a method for manufacturing a double-sided plastic packaging structure that solves the above problems.

[0005] The present invention provides a double-sided plastic packaging structure, comprising a stacked first laminate, an anisotropic conductive adhesive layer and a second laminate, wherein the first laminate comprises a first element, a first circuit layer, a first base layer and a first plastic packaging body, wherein the first circuit layer and the first plastic packaging body are arranged on opposite sides of the first base layer and the first circuit layer is arranged on a side of the first base layer facing the anisotropic conductive adhesive layer, wherein the first element is embedded in the first plastic packaging body and electrically connected to the first circuit layer; the second laminate comprises a second element, a second circuit layer, a second base layer and a second plastic packaging body, wherein the second circuit layer and the second plastic packaging body are arranged on opposite sides of the second base layer and the second circuit layer is arranged on a side of the second base layer facing the anisotropic conductive adhesive layer, wherein the second element is embedded in the second plastic packaging body and electrically connected to the second circuit layer, wherein the anisotropic conductive adhesive layer is bonded between the first circuit layer and the second circuit layer, and the first circuit layer and the second circuit layer are electrically connected through the anisotropic conductive adhesive layer.

[0006] In some embodiments, the first circuit layer includes a plurality of first connection pads, each of which protrudes in a direction away from the first plastic package body to form a convex portion; the second circuit layer includes a plurality of second connection pads, each of which is arranged corresponding to a first connection pad, and a groove is formed inwardly toward the surface of the first connection pad; each of the convex portions is inserted into a groove, and electrical conduction is achieved through the anisotropic conductive adhesive layer filling the portion between the convex portion and the groove.

[0007] In some embodiments, the first laminate further includes a third circuit layer and a first conductive hole, the third circuit layer is disposed between the first plastic packaging body and the first base layer, the first circuit layer is disposed on a surface of the first base layer away from the first plastic packaging body, and the first conductive hole is disposed through the first base layer and electrically connects the first circuit layer and the third circuit layer.

[0008] In some embodiments, the second laminate further includes a fourth circuit layer and a second conductive hole, the fourth circuit layer is disposed between the second plastic packaging body and the second base layer, the second circuit layer is disposed on a surface of the second base layer away from the second plastic packaging body, and the second conductive hole is disposed through the second base layer and electrically connects the second circuit layer and the fourth circuit layer.

[0009] In some embodiments, the second laminate further includes a third conductive hole and a fifth circuit layer, the fifth circuit layer is disposed on a surface of the second plastic package body facing away from the second base layer, and the third conductive hole is disposed through the second plastic package body and electrically connects the fourth circuit layer and the fifth circuit layer.

[0010] The present invention also provides a method for manufacturing a double-sided plastic packaging structure, comprising the following steps:

[0011] Providing a first circuit substrate, wherein the first circuit substrate comprises a stacked first base layer and a first circuit layer;

[0012] A first component is arranged on a side of the first base layer away from the first circuit layer to form a first plastic package, wherein the first plastic package covers the first component to obtain a first laminate;

[0013] Providing a second circuit substrate, wherein the second circuit substrate comprises a stacked second base layer and a second circuit layer;

[0014] A second component is arranged on a side of the second base layer away from the second circuit layer to form a second plastic package, wherein the second plastic package covers the second component to obtain a second laminate;

[0015] An anisotropic conductive adhesive layer is provided, and the first laminate, an anisotropic conductive adhesive layer and the second laminate are stacked and pressed together, the anisotropic conductive adhesive layer is bonded between the first circuit layer and the second circuit layer, and the first circuit layer and the second circuit layer are electrically connected through the anisotropic conductive adhesive layer.

[0016] In some embodiments, the first circuit layer includes a plurality of first connection pads, each of which protrudes in a direction away from the first plastic package to form a convex portion; the second circuit layer includes a plurality of second connection pads, each of which has a surface away from the second plastic package to form a concave groove;

[0017] The step of “stacking and laminating the first laminate, an anisotropic conductive adhesive layer and the second laminate” includes:

[0018] During stacking, each of the second connection pads is arranged corresponding to one of the first connection pads, and the grooves and the protrusions are arranged opposite to each other and corresponding to each other; after pressing, the protrusions are inserted into the grooves, and electrical conduction is achieved through the anisotropic conductive adhesive layer filling the part between the protrusions and the grooves.

[0019] In some embodiments, the first circuit substrate further includes a first conductive hole and a third circuit layer, the first circuit layer and the third circuit layer are arranged on opposite sides of the first base layer, and the first conductive hole is arranged through the first base layer and electrically connects the first circuit layer and the third circuit layer;

[0020] The step of “arranging a first component on the side of the first base layer away from the first circuit layer and forming a first plastic package” includes:

[0021] A first tearable film is disposed on one side of the first circuit substrate, the first tearable film is bonded to a side of the first circuit layer away from the first base layer and fills a gap in the first circuit layer to bond to the first base layer;

[0022] The first component and the first plastic package are arranged on the surface of the third circuit layer away from the first base layer, and the first plastic package covers the third circuit layer and the first component;

[0023] The first plastic package body is ground so that the first component is exposed from the surface of the first circuit substrate.

[0024] In some embodiments, the second circuit substrate further includes a second conductive hole and a fourth circuit layer, the second circuit layer and the fourth circuit layer are arranged on opposite sides of the second base layer, and the second conductive hole is arranged through the second base layer and electrically connects the second circuit layer and the fourth circuit layer;

[0025] Step “arranging a second component on the side of the second base layer away from the second circuit layer and forming a second plastic package”

[0026] The second component and the second plastic package are arranged on a side of the second circuit substrate provided with the fourth circuit layer;

[0027] The second plastic package body is ground so that the second component is exposed on a surface facing away from the second circuit substrate.

[0028] In some embodiments, after the step of “grinding the second plastic package body so that the second component is exposed away from the surface of the second circuit substrate”, the method further includes:

[0029] Disposing a dielectric layer on a surface of the second plastic package body facing away from the second circuit substrate;

[0030] Openings are formed through the second plastic package body and the dielectric layer, and circuit holes are formed in the dielectric layer corresponding to the openings, so that part of the fourth circuit layer is exposed from the bottom of the openings;

[0031] A third conductive hole is formed by electroplating in the opening, and a fifth circuit layer is formed by electroplating in the circuit hole. The fifth circuit layer is electrically connected to the fourth circuit layer.

[0032] The double-sided plastic encapsulation structure and the manufacturing method thereof of the present invention can control the substrate size of the first laminate and the second laminate to be the same, so that the same mold can be used for plastic encapsulation, thereby reducing development time and cost. In addition, after plastic encapsulation, the first laminate and the second laminate can be respectively subjected to electrical property detection and analysis in advance, thereby improving the yield rate during the final inspection of the finished product. The first laminate and the second laminate are electrically connected through the anisotropic conductive adhesive layer, which is beneficial to improving the packaging reliability because the anisotropic conductive adhesive layer has good conductivity, and the process temperature is low and the time is short. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A cross-sectional schematic diagram of a double-sided plastic packaging structure provided by an embodiment of the present invention.

[0034] Figure 2 for Figure 1 A simplified schematic diagram of the double-sided plastic package structure is shown.

[0035] Figure 3 A schematic cross-sectional view of a first copper clad laminate provided according to an embodiment of the present invention.

[0036] Figure 4 For Figure 3 The cross-sectional schematic diagram is shown after the first through hole is opened on the first copper clad laminate.

[0037] Figure 5 For Figure 4The cross-sectional schematic diagram shown is a diagram of a first through hole after the first conductive hole is formed by electroplating.

[0038] Figure 6 For the general Figure 5 The cross-sectional schematic diagram of a first circuit substrate formed after the first copper foil layer and the second copper foil layer are patterned to form a first circuit layer and a second circuit layer respectively.

[0039] Figure 7 For Figure 6 The cross-sectional view of the first circuit substrate shown is a schematic diagram after a first tearable film is disposed on one side and a first protective layer is disposed on the other side.

[0040] Figure 8 For Figure 7 The cross-sectional diagram shown is a diagram showing a second circuit layer after a first component is arranged on the second circuit layer.

[0041] Fig. 9 For Figure 8 The cross-sectional schematic diagram shown is a diagram of a first circuit substrate after a first plastic package is disposed on the surface of the first circuit substrate to cover the second circuit layer and the first component.

[0042] Fig.10 For the general Fig. 9 The schematic cross-sectional view of the first plastic package body after being ground until the surface of the first element is exposed.

[0043] Fig.11 For the general Fig.10 The schematic cross-sectional view of the first laminate obtained after the first tearable film is removed is shown.

[0044] Fig.12 A schematic cross-sectional view of a second copper clad laminate provided according to an embodiment of the present invention.

[0045] Fig.13 For Fig.12 The cross-sectional schematic diagram is shown after the second through hole is opened on the second copper clad laminate.

[0046] Fig.14 For Fig.13 The cross-sectional schematic diagram is shown after the second conductive hole is formed by electroplating in the second through hole.

[0047] Fig.15 For the general Fig.14 The third copper foil layer and the fourth copper foil layer are patterned to form a third circuit layer and a fourth circuit layer respectively, which is a cross-sectional schematic diagram of a second circuit substrate.

[0048] Fig.16 For Fig.15 The cross-sectional view of the second circuit substrate is shown after a second tearable film is disposed on one side and a second protective layer is disposed on the other side.

[0049] Fig.17 For Fig.16 The cross-sectional diagram shown is a diagram showing a fourth circuit layer after a second component is disposed on the fourth circuit layer.

[0050] Fig.18 For Fig.17 The cross-sectional view of the second circuit substrate after the second plastic package body is arranged on the surface of the second circuit substrate to cover the fourth circuit layer and the second component is shown.

[0051] Fig.19 For the general Fig.18 The cross-sectional schematic diagram shown is after the second plastic package body is ground until the surface of the second element is exposed.

[0052] Fig. 20 For Fig.19 The cross-sectional schematic diagram shown is a diagram of a second plastic package body after a dielectric layer is deposited on the surface of the second plastic package body.

[0053] Fig.21 For Fig. 20 The cross-sectional schematic diagram is shown after openings are opened through the second plastic package body and the dielectric layer.

[0054] Fig. 22 For the general Fig.21 The cross-sectional view of the dielectric layer after patterning to form circuit holes is shown.

[0055] Fig.23 For Fig. 22 The cross-sectional view is a schematic diagram showing a third conductive hole formed in the opening and a fifth circuit layer formed in the circuit hole.

[0056] Fig.24 For the general Fig.23 The schematic cross-sectional view of the second laminate obtained after the second tearable film is removed is shown.

[0057] Fig.25 Yes Fig.11 The first laminate, an anisotropic conductive adhesive layer and Fig.24 The cross-sectional schematic diagram of the second laminate after lamination is shown.

[0058] Fig.26 For the general Fig.25 The cross-sectional schematic diagram of the first laminate, the anisotropic conductive adhesive layer and the second laminate after lamination is shown.

[0059] Fig. 27 For Fig.26 The cross-sectional diagram of the third pad after a solder ball is arranged thereon is shown.

[0060] Main component symbols

[0061] Double-sided plastic packaging structure 100 second conductive hole 21

[0062] The first copper clad board 10a and the second circuit layer 22

[0063] First base layer 101 second connection pad 222

[0064] The first copper foil layer 102 has a groove 224

[0065] The second copper foil layer 103 and the fourth circuit layer 23

[0066] First through hole 104 and second pad 232

[0067] First circuit substrate 10 Second tearable film 24

[0068] First conductive via 11 Second protective layer 25

[0069] First circuit layer 12 Second component 26

[0070] First connection pad 122 Second plastic package body 28

[0071] The dielectric layer 30 of the protrusion 124

[0072] The third circuit layer 13 has a hole 32

[0073] First pad 132 circuit hole 34

[0074] The first tearable film 14 and the third conductive hole 40

[0075] First protection layer 15 Fifth circuit layer 42

[0076] The third pad 422 of the first component 16

[0077] First plastic package 18 Second laminate 2

[0078] First laminate 1 anisotropic conductive adhesive layer 3

[0079] The second copper-clad laminate 20a has conductive particles 302

[0080] Second base layer 201 resin layer 3021

[0081] The third copper foil layer 202 metal layer 3022

[0082] Fourth copper foil layer 203 insulation layer 3023

[0083] The second through hole 204 solder ball 50

[0084] The second circuit substrate 20 has a thickness direction A

[0085] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0086] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0087] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0088] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0089] See also Figure 1 An embodiment of the present invention provides a double-sided plastic packaging structure 100, including a stacked first laminate 1, an anisotropic conductive adhesive layer 3 and a second laminate 2, wherein the first laminate and the second laminate 2 are electrically connected through the anisotropic conductive adhesive layer 3.

[0090] The first laminate 1 includes a first base layer 101, a first circuit layer 12, a first component 16 and a first plastic package 18, wherein the first circuit layer 12 and the first plastic package 18 are arranged on opposite sides of the first base layer 101 and the first circuit layer 12 is arranged on the side of the first base layer 101 facing the anisotropic conductive adhesive layer 3, the first component 16 is embedded in the first plastic package 18 and the first component 16 is electrically connected to the first circuit layer 12. The first circuit layer 12 includes a plurality of first connection pads 122, each of which protrudes in a direction away from the first plastic package 18 to form a convex portion 124. The first component 16 may be an active component and / or a passive component. The second laminate 2 includes a second base layer 201, a second circuit layer 22, a second component 26 and a second plastic package 28. The second circuit layer 22 and the second plastic package 28 are arranged on opposite sides of the second base layer 201 and the second circuit layer 22 is arranged on the side of the second base layer 201 facing the anisotropic conductive adhesive layer 3. The second component 26 is embedded in the second plastic package 28 and the second component 26 is electrically connected to the second circuit layer 22. The second circuit layer 22 includes a plurality of second connection pads 222, and a groove 224 is provided inwardly from the side of each second connection pad 222 away from the second plastic package 28. The first circuit layer 12 and the second circuit layer 22 are arranged at intervals, and each of the protrusions 124 is inserted into a groove 224, and electrical conduction is achieved through the portion of the anisotropic conductive adhesive layer 3 filled between the protrusion 124 and the groove 224.

[0091] See also Figure 2 , the anisotropic conductive adhesive layer 3 includes a resin adhesive and conductive particles 302. The conductive particles 302 are roughly spherical, including a resin layer 3021 located in the center core, a metal layer 3022 coated on the resin layer 3021, and an insulating layer 3023 coated on the metal layer 3022. The diameter of the resin layer 3021 is mostly 3μm to 10μm. When the first laminate 1 and the second laminate 2 are hot-pressed and bonded by the anisotropic conductive adhesive layer 3, the insulating layer 3023 of the conductive particles 302 is broken, and the conductive particles 302 are flattened from spheres to flat ellipsoids, thereby increasing the contact area between the first circuit layer 12, the second circuit layer 22 and the metal layer 3022 of the conductive particles 302, and the resin adhesive is cured by heating, thereby maintaining the conductive state.

[0092] By hot-pressing the first laminate 1 and the second laminate 2 after plastic sealing through the anisotropic conductive adhesive layer 3, double-sided plastic sealing can be achieved, and the anisotropic conductive adhesive layer 3 has good vertical conduction and horizontal insulation characteristics, and the process requires low temperature and short time, which is conducive to improving packaging reliability. Secondly, by setting the protrusion 124 to be inserted into the groove 224, it is conducive to increasing the contact area of ​​the electrical connection between the first circuit layer 12 and the second circuit layer 22, thereby improving the stability of the electrical connection, and can effectively make the small-particle-size conductive particles 302 evenly distributed between the first circuit layer 12 and the second circuit layer 22, reduce the conductive particles 302 from flowing outside the contact surface, thereby improving the conduction reliability, and can be applied to smaller circuit spacing.

[0093] The shape of the protrusion 124 is not limited, for example, it can be but not limited to a rectangular, arc-shaped or V-shaped, etc. The shape of each of the grooves 224 is also not limited, for example, it can be but not limited to a rectangular groove, an arc-shaped groove, a V-shaped groove, etc. Preferably, the shape of each of the protrusions 124 is designed to imitate the shape of the corresponding groove 224.

[0094] The first laminate 1 may further include a first base layer 101, a third circuit layer 13 and a first conductive hole 11, wherein the third circuit layer 13 is disposed between the first plastic package 18 and the first base layer 101, the first circuit layer 12 is disposed on the surface of the first base layer 101 away from the first plastic package 18, the first conductive hole 11 is disposed on the first base layer 101 and the first conductive hole 11 electrically connects the first circuit layer 12 and the third circuit layer 13. The third circuit layer 13 includes a plurality of first pads 132, and the first component 16 is electrically connected to a side of the first pad 132 away from the first base layer 101. In some embodiments, the surface of the first component 16 away from the first base layer 101 is substantially flush with the surface of the first plastic package 18 away from the first base layer 101.

[0095] In some embodiments, the first laminate 1 may further include a first protective layer 15, which fills the gap between the third circuit layer 13 and the first base layer 101. In some embodiments, the surface of the first protective layer 15 facing away from the first base layer 101 is substantially flush with the surface of the third circuit layer 13 facing away from the first base layer 101.

[0096] The second laminate 2 may further include a second base layer 201, a fourth circuit layer 23 and a second conductive hole 21, wherein the fourth circuit layer 23 is disposed between the second plastic package 28 and the second base layer 201, the second circuit layer 22 is disposed on the surface of the second base layer 201 away from the second plastic package 28, the second conductive hole 21 is disposed on the second base layer 201 and the second conductive hole 21 electrically connects the second circuit layer 22 and the fourth circuit layer 23. The anisotropic conductive adhesive layer 3 bonds the first base layer 101 and the second base layer 201. The fourth circuit layer 23 includes a plurality of second pads 232, and the second element 26 is electrically connected to the side of the second pad 232 away from the second base layer 201. In some embodiments, the surface of the second element 26 away from the second base layer 201 is substantially flush with the surface of the second plastic package 28 away from the second base layer 201.

[0097] The second laminate 2 may also include a third conductive hole 40 and a fifth circuit layer 42, the fifth circuit layer 42 includes a plurality of third pads 422, the fifth circuit layer 42 is arranged on the surface of the second plastic packaging body 28 away from the anisotropic conductive adhesive layer 3, the third conductive hole 40 is penetrated by the second plastic packaging body 28 and the third conductive hole 40 electrically connects the fourth circuit layer 23 and the fifth circuit layer 42.

[0098] The second laminate 2 may further include a dielectric layer 30, and the dielectric layer 30 fills the gap between the fifth circuit layer 42 and the second plastic package 28. In some embodiments, the thickness of the dielectric layer 30 is greater than or equal to the thickness of the fifth circuit layer 42, that is, the fifth circuit layer 42 is completely embedded in the dielectric layer 30.

[0099] In some embodiments, the second laminate 2 further includes a second protective layer 25, and the second protective layer 25 fills the gap between the fourth circuit layer 23 and the second base layer 201. In some embodiments, the surface of the second protective layer 25 facing away from the second base layer 201 is substantially flush with the surface of the fourth circuit layer 23 facing away from the second base layer 201.

[0100] The double-sided plastic packaging structure 100 may further include a plurality of solder balls 50 , each of which is disposed on a side of the third solder pad 422 away from the second plastic packaging body 28 .

[0101] Please refer to Figures 3 to 27 An embodiment of the present invention further provides a method for manufacturing the double-sided plastic packaging structure 100, comprising the following steps:

[0102] Step S11, see Figure 6 , providing a first circuit substrate 10 , wherein the first circuit substrate 10 includes a first base layer 101 and a first circuit layer 12 and a third circuit layer 13 arranged on opposite sides of the first base layer 101 .

[0103] The first circuit layer 12 includes a plurality of first connection pads 122, each of which protrudes in a direction away from the first base layer 101 to form a convex portion 124. The shape of each convex portion 124 is not limited, for example, it can be, but not limited to, a rectangular, arc or V-shaped shape. The third circuit layer 13 includes a plurality of first pads 132.

[0104] The manufacturing method of the first circuit substrate 10 may include the following steps:

[0105] Step S111, see Figure 3 , a first copper clad laminate 10a is provided, wherein the first copper clad laminate 10a includes a first base layer 101 and a first copper foil layer 102 and a second copper foil layer 103 disposed on opposite sides of the first base layer 101 .

[0106] The material of the first base layer 101 can be, but is not limited to, a polyimide film.

[0107] Step S112, see Figure 4 A first through hole 104 is formed through the first copper clad laminate 10a along a thickness direction A.

[0108] Specifically, the first through hole 104 may be opened by, but is not limited to, laser drilling.

[0109] Step S113, see Figure 5 , a first conductive via 11 is formed by electroplating in the first through hole 104 , and the first conductive via 11 electrically connects the first copper foil layer 102 and the second copper foil layer 103 .

[0110] Step S114, see Figure 6 The first copper foil layer 102 is patterned to form a first circuit layer 12, wherein the first circuit layer 12 includes a plurality of first connection pads 122, and a protrusion 124 is formed by protruding from each of the first connection pads 122 in a direction away from the first base layer 101; and the second copper foil layer 103 is patterned to form a third circuit layer 13, wherein the third circuit layer 13 includes a plurality of first solder pads 132, thereby obtaining a first circuit substrate 10.

[0111] Specifically, the first circuit layer 12 and the third circuit layer 13 may be formed by, but not limited to, etching with an etching solution.

[0112] Step S12, see Figure 7 A first tearable film 14 is disposed on one side of the first circuit substrate 10 , and the first tearable film 14 is bonded to the side of the first circuit layer 12 away from the first base layer 101 and fills the gap of the first circuit layer 12 to bond with the first base layer 101 .

[0113] In some embodiments, step S12 further includes:

[0114] A first protective layer 15 is disposed on the other side of the first circuit substrate 10 away from the first tearable film 14 .

[0115] The first protection layer 15 fills the gap between the third circuit layer 13 and the first base layer 101. The first protection layer 15 can be solder resist ink.

[0116] In some embodiments, a surface of the first protection layer 15 facing away from the first base layer 101 is substantially flush with a surface of the third circuit layer 13 facing away from the first base layer 101 .

[0117] Step S13, see Figure 8 , a first element 16 is disposed on the third circuit layer 13 .

[0118] The first component 16 may be soldered to the surface of the first pad 132 by surface mount technology (SMT). The first component 16 may include an active component and / or a passive component.

[0119] Step S14, see Fig. 9 A first plastic package 18 is disposed on one side of the first circuit substrate 10 , and the first plastic package 18 covers the third circuit layer 13 , the first protective layer 15 and the first component 16 .

[0120] Specifically, an injection molding process (molding) may be used to fill epoxy resin molding material on one side of the first circuit substrate 10 , and the first plastic package body 18 may be formed through curing.

[0121] In some embodiments, see Fig.10 , step S17 further includes: grinding to remove part of the first plastic package 18, so that at least the surface of the first component 16 away from the third circuit layer 13 is exposed. In this embodiment, the surface of the first plastic package 18 away from the first base layer 101 is substantially flush with the surface of the first component 16 away from the third circuit layer 13. Exposing part of the surface of the first component 16 can improve the heat dissipation performance and reduce the total thickness of the packaging structure.

[0122] Step S15, see Fig.11 , remove the first tearable film 14 to obtain a first laminate 1.

[0123] Step S21, see Fig.15 , providing a second circuit substrate 20 , the second circuit substrate 20 includes a second base layer 201 and a second circuit layer 22 and a fourth circuit layer 23 arranged on opposite sides of the second base layer 201 .

[0124] The second circuit layer 22 includes a plurality of second connection pads 222, and a groove 224 is formed inwardly from the side of each second connection pad 222 away from the second base layer 201. The shape of each groove 224 is not limited, for example, it can be but not limited to a rectangular groove, an arc groove, a V-shaped groove, etc.

[0125] The manufacturing method of the second circuit substrate 20 may include the following steps:

[0126] Step S211, see Fig.12 , providing a second copper clad laminate 20a, wherein the second copper clad laminate 20a includes a second base layer 201 and a third copper foil layer 202 and a fourth copper foil layer 203 disposed on opposite sides of the second base layer 201.

[0127] The material of the second base layer 201 can be, but is not limited to, a polyimide film.

[0128] Step S212, see Fig.13 A second through hole 204 is formed through the second copper clad laminate 20a along the thickness direction A.

[0129] Specifically, the second through hole 204 may be opened by, but is not limited to, laser drilling.

[0130] Step S213, see Fig.14 , a second conductive hole 21 is formed by electroplating in the second through hole 204 , and the second conductive hole 21 electrically connects the third copper foil layer 202 and the fourth copper foil layer 203 .

[0131] Step S214, see Fig.15 The third copper foil layer 202 is patterned to form a second circuit layer 22, wherein the second circuit layer 22 includes a plurality of second connection pads 222, and a groove 224 is opened inwardly from a side of each second connection pad 222 away from the second base layer 201; and the fourth copper foil layer 203 is patterned to form a fourth circuit layer 23, wherein the fourth circuit layer 23 includes a plurality of second solder pads 232, thereby obtaining a second circuit substrate 20.

[0132] Specifically, the second circuit layer 22 and the fourth circuit layer 23 may be formed by, but not limited to, etching with an etching solution.

[0133] Step S22, see Fig.16 A second tearable film 24 is disposed on one side of the second circuit substrate 20 , and the second tearable film 24 is bonded to the side of the second circuit layer 22 away from the second base layer 201 and fills the gap of the second circuit layer 22 to bond with the second base layer 201 .

[0134] In some embodiments, step S22 further includes:

[0135] A second protective layer 25 is disposed on the other side of the second circuit substrate 20 away from the second tearable film 24 .

[0136] The second protection layer 25 fills the gap between the fourth circuit layer 23 and the second base layer 201. The second protection layer 25 can be solder resist ink.

[0137] In some embodiments, a surface of the second protection layer 25 facing away from the second base layer 201 is substantially flush with a surface of the fourth circuit layer 23 facing away from the second base layer 201 .

[0138] Step S23, see Fig.17 , a second element 26 is disposed on the fourth circuit layer 23 .

[0139] The second component 26 may be soldered to the surface of the second pad 232 by surface mount technology (SMT). The second component 26 may include an active component and / or a passive component.

[0140] Step S24, see Fig.18 A second plastic package 28 is disposed on one side of the second circuit substrate 20 , and the second plastic package 28 covers the fourth circuit layer 23 , the second protective layer 25 and the second component 26 .

[0141] Specifically, an injection molding process (molding) may be used to fill epoxy resin molding material on one side of the second circuit substrate 20 , and the second plastic package 28 may be formed through curing.

[0142] In this embodiment, since the first circuit substrate 10 and the second circuit substrate 20 have the same size and structure, the same mold can be used for plastic packaging, thereby reducing development time and cost. In addition, after the plastic packaging is completed, the first circuit substrate 10 and the second circuit substrate 20 can be electrically tested and analyzed in advance to improve the yield rate during the final inspection of the finished product.

[0143] In some embodiments, see Fig.19 Step S24 further includes: grinding to remove part of the second plastic package 28, so that at least the surface of the second component 26 away from the fourth circuit layer 23 is exposed. In this embodiment, the surface of the second plastic package 28 away from the second base layer 201 is substantially flush with the surface of the second component 26 away from the fourth circuit layer 23.

[0144] Step S25, see Fig. 20 Along the thickness direction A, a dielectric layer 30 is stacked on the surface of the second plastic package 28 away from the second circuit substrate 20 , and the dielectric layer 30 covers the surface of the second component 26 away from the fourth circuit layer 23 .

[0145] Step S26, see Fig.21 A plurality of openings 32 are formed through the second plastic package body 28 and the dielectric layer 30 along the thickness direction A, and a portion of the second solder pad 232 is exposed from the bottom of the opening 32 .

[0146] Specifically, the opening 32 may be opened by, but not limited to, laser drilling.

[0147] Step S27, see Fig. 22 , corresponding to the opening 32 , the dielectric layer 30 is patterned to form a circuit hole 34 .

[0148] In this embodiment, the circuit hole 34 is connected to the opening 32 .

[0149] Step S27, see Fig.23 , copper is plated in the opening 32 to form a third conductive hole 40 , and copper is plated in the circuit hole 34 to form a fifth circuit layer 42 .

[0150] The fifth circuit layer 42 is electrically connected to the fourth circuit layer 23 through the third conductive via 40. The fifth circuit layer 42 includes a plurality of third pads 422.

[0151] Step S28, see Fig.24 , remove the second tearable film 24 to obtain the second laminate 2.

[0152] Step S31, see Fig.25 and Fig.26 , the first laminate 1, an anisotropic conductive adhesive layer 3 and the second laminate 2 are stacked and pressed together. During stacking, the groove 224 and the convex portion 124 are opposite to and corresponding to each other; after pressing together, the convex portion 124 is inserted into the groove 224, and the anisotropic conductive adhesive layer 3 fills the portion between the convex portion 124 and the groove 224 to achieve electrical conduction.

[0153] Preferably, the shape of each protrusion 124 is designed to be similar to the shape of the corresponding groove 224 .

[0154] Step S32, see Fig. 27 , a solder ball 50 is disposed on the surface of the third solder pad 422 to obtain the double-sided plastic packaging structure 100.

[0155] It can be understood that in some embodiments, multiple double-sided plastic packaging structures 100 can be obtained by simultaneously manufacturing the boards and cutting them into pieces.

[0156] The above is only a preferred embodiment of the present invention and is not intended to limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A double-sided plastic packaging structure, characterized in that: It includes a stacked first laminate, an anisotropic conductive adhesive layer and a second laminate, the first laminate includes a first component, a first circuit layer, a first base layer and a first plastic package, the first circuit layer and the first plastic package are arranged on opposite sides of the first base layer and the first circuit layer is arranged on a side of the first base layer facing the anisotropic conductive adhesive layer, the first component is embedded in the first plastic package and electrically connected to the first circuit layer; the second laminate includes a second component, a second circuit layer, a second base layer and a second plastic package, the second circuit layer and the second plastic package are arranged on opposite sides of the second base layer and the second circuit layer is arranged on a side of the second base layer facing the anisotropic conductive adhesive layer, the second component is embedded in the second plastic package and electrically connected to the second circuit layer, the anisotropic conductive adhesive layer is bonded between the first circuit layer and the second circuit layer, and the first circuit layer and the second circuit layer are electrically connected through the anisotropic conductive adhesive layer.

2. The double-sided plastic packaging structure according to claim 1, characterized in that: The first circuit layer includes a plurality of first connection pads, each of which protrudes in a direction away from the first plastic package body to form a convex portion; the second circuit layer includes a plurality of second connection pads, each of which is arranged corresponding to a first connection pad, and a groove is formed inwardly toward the surface of the first connection pad; each of the convex portions is inserted into a groove, and electrical conduction is achieved through the anisotropic conductive adhesive layer filling the portion between the convex portion and the groove.

3. The double-sided plastic packaging structure according to claim 1, characterized in that: The first laminate also includes a third circuit layer and a first conductive hole. The third circuit layer is arranged between the first plastic packaging body and the first base layer. The first circuit layer is arranged on the surface of the first base layer away from the first plastic packaging body. The first conductive hole is arranged through the first base layer and electrically connects the first circuit layer and the third circuit layer.

4. The double-sided plastic packaging structure according to claim 3, characterized in that: The second laminate also includes a fourth circuit layer and a second conductive hole. The fourth circuit layer is arranged between the second plastic packaging body and the second base layer. The second circuit layer is arranged on the surface of the second base layer away from the second plastic packaging body. The second conductive hole is arranged through the second base layer and electrically connects the second circuit layer and the fourth circuit layer.

5. The double-sided plastic packaging structure according to claim 4, characterized in that: The second laminate further includes a third conductive hole and a fifth circuit layer. The fifth circuit layer is arranged on the surface of the second plastic package body away from the second base layer. The third conductive hole penetrates the second plastic package body and electrically connects the fourth circuit layer and the fifth circuit layer.

6. A method for manufacturing a double-sided plastic packaging structure, characterized in that: The following steps are involved: Providing a first circuit substrate, wherein the first circuit substrate comprises a stacked first base layer and a first circuit layer; A first component is arranged on a side of the first base layer away from the first circuit layer to form a first plastic package, wherein the first plastic package covers the first component to obtain a first laminate; Providing a second circuit substrate, wherein the second circuit substrate comprises a stacked second base layer and a second circuit layer; A second component is arranged on a side of the second base layer away from the second circuit layer to form a second plastic package, wherein the second plastic package covers the second component to obtain a second laminate; An anisotropic conductive adhesive layer is provided, and the first laminate, an anisotropic conductive adhesive layer and the second laminate are stacked and pressed together, the anisotropic conductive adhesive layer is bonded between the first circuit layer and the second circuit layer, and the first circuit layer and the second circuit layer are electrically connected through the anisotropic conductive adhesive layer.

7. The method for manufacturing a double-sided plastic packaging structure according to claim 6, characterized in that: The first circuit layer includes a plurality of first connection pads, each of which protrudes in a direction away from the first plastic package to form a convex portion; the second circuit layer includes a plurality of second connection pads, each of which has a surface away from the second plastic package to form a concave groove; The step of "stacking and laminating the first laminate, an anisotropic conductive adhesive layer and the second laminate" includes: When stacked, each of the second connection pads is arranged corresponding to one of the first connection pads, and the grooves and the protrusions are arranged opposite to each other and corresponding to each other; After lamination, the protrusion is inserted into the groove, and electrical conduction is achieved through the anisotropic conductive adhesive layer filling the portion between the protrusion and the groove.

8. The method for manufacturing a double-sided plastic packaging structure according to claim 7, characterized in that: The first circuit substrate further includes a first conductive hole and a third circuit layer, the first circuit layer and the third circuit layer are arranged on opposite sides of the first base layer, and the first conductive hole is arranged through the first base layer and electrically connects the first circuit layer and the third circuit layer; The step of "arranging a first component on the side of the first base layer away from the first circuit layer and forming a first plastic package" includes: A first tearable film is disposed on one side of the first circuit substrate, the first tearable film is bonded to a side of the first circuit layer away from the first base layer and fills a gap in the first circuit layer to bond to the first base layer; The first component and the first plastic package are arranged on the surface of the third circuit layer away from the first base layer, and the first plastic package covers the third circuit layer and the first component; The first plastic package body is ground so that the first component is exposed on a surface facing away from the first circuit substrate.

9. The method for manufacturing a double-sided plastic packaging structure according to claim 7, characterized in that: The second circuit substrate further includes a second conductive hole and a fourth circuit layer, the second circuit layer and the fourth circuit layer are arranged on opposite sides of the second base layer, and the second conductive hole is arranged through the second base layer and electrically connects the second circuit layer and the fourth circuit layer; Step "arranging a second component on the side of the second base layer away from the second circuit layer and forming a second plastic package" The second component and the second plastic package are arranged on a side of the second circuit substrate provided with the fourth circuit layer; The second plastic package body is ground so that the second component is exposed on a surface facing away from the second circuit substrate.

10. The method for manufacturing a double-sided plastic packaging structure according to claim 9, characterized in that: After the step of "grinding the second plastic package body so that the second component is exposed away from the surface of the second circuit substrate", the method further includes: Disposing a dielectric layer on a surface of the second plastic package body facing away from the second circuit substrate; Openings are formed through the second plastic package body and the dielectric layer, and circuit holes are formed in the dielectric layer corresponding to the openings, so that part of the fourth circuit layer is exposed from the bottom of the openings; A third conductive hole is formed by electroplating in the opening, and a fifth circuit layer is formed by electroplating in the circuit hole. The fifth circuit layer is electrically connected to the fourth circuit layer.

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