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Scaled impedance replica for echo attenuation in digital transmission systems

A technology of digital transmission and echo attenuation, applied in the direction of transmission system, wired transmission system, electrical components, etc., can solve the problem of increasing the number of leads

Inactive Publication Date: 2001-10-10
INFINEON TECH AG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition to the necessary external passive components attached to the chip, the increased lead count is a major drawback

Method used

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  • Scaled impedance replica for echo attenuation in digital transmission systems
  • Scaled impedance replica for echo attenuation in digital transmission systems

Examples

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Embodiment Construction

[0015] The receiver / transmitter chip (surrounded by thick lines) includes the line driver LD for driving the connector and ring signal lines TTIP and TRING. The signal received from the loop by the receiver / transmitter chip RTC is connected to the chip through the signal lines RTIP and RRING connected to the termination resistor R, the connector in front of R and the ring line TTIP, TRING. The received signal is sent to a part AGC of the chip TRC which acts as a subtractor.

[0016] Since the received far-end signal is superimposed by the echo signal generated by signal propagation through the line driver LD, the echo signal must be removed. This is accomplished by generating artificial or replica echo signals and subtracting them from the sum of the received far-end signal and the echo signal. Impedance replicas include a replica transmit tap line RTTIP and a replica transmit loop line RTRING connected to a transformer replica, a bridge tap replica and a signal loop replica ...

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Abstract

A device for echo attenuation in a digital transmission system comprises an impedance replica of the transmission path, wherein the impedance replica consists of a terminating resistor replica, a transformer replica and a transmission line replica. Further the device can comprise an additional bridged tap replica. The transformer replica and the bridged tap replica are located on chip and the main transformer inductance replica and all components of the bridged tap replica are made variable so that a software setting is possible.

Description

background of the invention [0001] In a semiconductor-based digital transmission system, such as ISDN or XDSL, sending and receiving signals are performed on the same pair of metal wires from location A to B. As long as no special precautions are taken. The received signal, referred to below as the far-end signal, is overlaid by the own transmitter's signal, referred to as the echo, which brings about two disadvantages: [0002] a) The receive path input must be designed with a high input level. The possible signal-to-noise ratio (S / N) is thus limited. [0003] b) In common ISDN and XDSL transmission systems you can find digital linear echo compensators after the analog receive path. Such echo compensators are not capable of subtracting nonlinear distortion components from the echo. Thus the signal-to-distortion ratio (S / D) must be kept very low. [0004] To overcome the above-mentioned problems, a proportional impedance replica of the transmission path consisting of resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B3/20H04B3/23H04Q1/56
CPCH04B3/23
Inventor T·布隆M·格雷尔M·莫亚尔D·M·乔菲
Owner INFINEON TECH AG
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