Electrostatic chuck

Abstract

This invention relates to a static chuck with double electrodes including an insulation layer and an electrode in the insulation layer including a positive pole and a negative pole spliced together to form a round pole, in which, the positive pole is composed of a round part at the central position and even fan parts uniformly distributed and integrated with the round part. Advantage: since the positive and negative poles are spliced to form a round part and the negative part is composed of a round part at the center and even fan parts distributed uniformly and integrated with the round part, it is distributed uniformly in the entire sphere of 360deg. to realize uniform symmetrically.

Description

technical field [0001] The invention relates to an electrostatic chuck in semiconductor etching equipment, in particular to an electrostatic chuck with double electrodes. Background technique [0002] In the semiconductor manufacturing process and LCD manufacturing process, in order to fix and support the wafer and avoid movement or misalignment during processing, an electrostatic chuck (ESC: Electrostatic chuck for short) is often used. The electrostatic chuck uses electrostatic attraction to hold the wafer, which has many advantages over the mechanical chuck and vacuum chuck used before. The electrostatic chuck reduces the damage of the wafer caused by pressure, collision and other reasons when using the mechanical chuck; increases the area where the wafer can be processed effectively; reduces the deposition of corrosion particles on the wafer surface; makes the wafer and the chuck better Conduct heat conduction; and can work in a vacuum environment, while vacuum suction ...

AI Technical Summary

Problems solved by technology

However, these shapes of electrodes are not very ideal in terms of uniform symmetry.

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