Correction method for head position of part installation device and nominal nozzle

Abstract

The present invention provides a head position correction method and a dummy nozzle of a component mounting device, which can accurately identify the actual offset between the board recognition camera and the head position in simple steps, and perform appropriate correction. Install the dummy nozzle (32) on the head (14n), and use the OCC camera (second camera) (26) equipped on the holder (12) with the head (14n) to identify the VCS on the side of the base (10) The position of the camera (first camera) (20), according to the offset (On) of the design of the OCC camera (26) and the head (14n), move the head (14n) to the identified VCS camera (20) position, use the VCS camera (20) to photograph the mark (36) of the virtual nozzle (32) of the moved position, thereby the deviation (OnR) of the head (14n) after the move from the center of the VCS camera (20) Obtained as an offset correction amount.

Description

technical field [0001] The present invention relates to a method of correcting the head position of a component mounting device and a dummy nozzle suitable for use in the correction. Background technique [0002] For example, Patent Document 1 discloses a component mounting apparatus for mounting electronic components such as ICs, LSIs, flip chips, resistor chips, and chip capacitors at predetermined positions on a substrate. This component mounting apparatus has a head having a nozzle for vacuum-adsorbing these components, and the direction of the X-Y direction (horizontal driving) and the Z-axis direction (vertical driving) of the head (specifically, a holder for holding the head) are combined. Combination of movement and the head's own rotation around the Z axis (theta drive), and the parts supplied to the parts feeder (partsfeeder) are mounted on the substrate, [0003] In such a component mounting apparatus, if the position of the nozzle on the X-Y plane recognized by ...

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Problems solved by technology

[0008] However, in the method of correcting the head position of the component mounting apparatus in the above-mentioned Patent Document 1, there are very many types of positional relationships to be considered, and any positional relationship must be judged by observing the time-varying operation. As a result of the correction amount, two sets of information of various types are required both before operation and at the time of judgment, and there is a problem that the procedure for judgment is complicated

[0009] In addition, when observing the nozzle of the head with a camera for chip recognition, it is extremely difficult to actually accurately identify the center of the nozzle. From this point of view, it cannot be said that the accurate head (axis center) can be detected. Location

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