Systems, devices, and methods for semiconductor device temperature management

a technology of temperature management and semiconductor devices, applied in semiconductor devices, instruments, computing, etc., can solve problems such as data and other reliability problems, large power consumption, and large operational and/or structural problems, and achieve the effect of maintenance, and reducing the cost of operation

Inactive Publication Date: 2009-12-10
COOLSILICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"This patent describes a method and system for designing integrated circuits (ICs) with improved temperature management. The invention involves creating coolant structures within the IC that can manage the temperature of the device. The coolant structures can include a coolant reservoir and coolant channels that are designed to interface with specific regions of the IC that are susceptible to high temperatures. The coolant reservoir and coolant channels can be formed using a variety of methods, such as bonding layers of the IC together or adding a new layer. The invention can help to prevent the IC from overheating and improve its overall performance."

Problems solved by technology

This generated heat may cause a variety of operational and / or structural issues.
A “hot” IC may operate at limited speed (Many authors have posited that for every 10 degrees in heat reduction, a typical IC will operate at a 2% higher operating frequency), may suffer from data and other reliability issues, and may consume more power than a device operating at lower temperatures.
The IC may even fail functionally or physically.
Because multi-substrate IC devices incorporate transistors arranged in proximity in both horizontal and vertical dimensions they may be more susceptible to the effects of heat.
As such it may be difficult to remove heat from such devices by traditional methods.
These insulating may layers trap heat in the IC, which may exacerbate issues related to the presence of heat.

Method used

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  • Systems, devices, and methods for semiconductor device temperature management
  • Systems, devices, and methods for semiconductor device temperature management
  • Systems, devices, and methods for semiconductor device temperature management

Examples

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Embodiment Construction

[0045]FIG. 1A illustrates generally one example of a typical IC device 001. As shown, IC device 001 includes one or more semiconductor die 100. Semiconductor die 100 may include any variety of circuits adapted to enable IC device 001 to perform computational, signal processing, or other functions. The circuits may be formed in one or more integral layers of die 100.

[0046]As also shown, semiconductor die 100 is housed in package 010. Package 010 is constructed to provide protection to die 100. Package 010 may further be constructed to provide one or more pins 008. Die 100 may include a plurality of pads 007. Pads 007 provide an interface for electrical connection to circuits of die 100. Pads 007 of die 100 are adapted to be electrically connected to pins 008, thus allowing electrical access to functions of die 100 through package 010.

[0047]Package 010 may be adapted to be secured to a printed circuit (PC) board 012 or other mounting surface. PC board 012 may include one or more trace...

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Abstract

Devices, systems, and methods for semiconductor die temperature management are described and discussed herein. An IC device is described that includes at least one intra-die cooling structure. In an embodiment, the IC device includes a semiconductor die formed of integral device layers and further includes at least one coolant reservoir and at least one coolant channel. In an embodiment, the at least one coolant reservoir and at least one coolant channel are disposed wholly within the semiconductor die. In various embodiments, at least one coolant reservoir and at least one coolant channel are constructed and arranged to circulate coolant fluid in proximity to at least one IC device structure in order to decrease and or normalize an operating temperature of the IC device. In other embodiments, systems and methods for designing and / or fabricating IC die that include at least one intra-die cooling structure are provided herein.

Description

RELATED APPLICATIONS[0001]The present invention claims priority to U.S. Provisional Patent Application No. 61 / 059,603, entitled “System and Methods for Cooling Semiconductor Device,” filed Jun. 6, 2008, U.S. Provisional Patent Application No. 61 / 060,413, entitled “Systems, Methods, and Devices Providing for Liquid Cooling of a Semiconductor Device” filed Jun. 10, 2008, and U.S. Provisional Patent Application No. 61 / 086,600, entitled “Systems, Methods, and Devices Providing for Liquid Cooling of a Semiconductor Device” filed Aug. 6, 2008, all of which are hereby incorporated by reference.FIELD OF THE INVENTION[0002]The invention relates generally to integrated circuits and, more particularly, to temperature management of integrated circuits.BACKGROUND OF THE INVENTION[0003]Designers of Integrated Circuit (IC) technology typically strive to provide IC devices that take up a minimum amount of space, and operate reliably at high speeds while consuming a minimum of power. Of increasing i...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): G06F17/50
CPCH01L23/34H01L23/473H01L27/0211H01L2924/0002H01L2924/00
InventorWINTER, BRADLEY J.ZEYEN, BENEDIKT
OwnerCOOLSILICON