Method for producing an electronic assembly

Inactive Publication Date: 2015-12-03
CONTINENTAL TEVES AG & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes an improvement to an electronic assembly. The technical effect of this improvement is better performance and reliability of the electronic assembly.

Problems solved by technology

Accordingly, the structures require a very large amount of installation space, whereby the electronic assembly of the type mentioned at the outset is unsuitable for technical applications having little installation space, for example, as a surface-mounted device, referred to hereafter as an SMD.

Method used

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  • Method for producing an electronic assembly
  • Method for producing an electronic assembly
  • Method for producing an electronic assembly

Examples

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Embodiment Construction

[0030]Identical technical elements are provided with identical reference signs in the figures and are only described once.

[0031]Reference is made to FIG. 1, which shows a schematic view of a vehicle 2 having a vehicle dynamics controller known per se. Details of this vehicle dynamics controller can be inferred, for example, from DE 10 2011 080 789 A1, which is incorporated by reference.

[0032]The vehicle 2 comprises a chassis 4 and four wheels 6. Each wheel 6 can be decelerated in relation to the chassis 4 via a brake 8 which is fastened in a stationary manner on the chassis 4, to decelerate a movement of the vehicle 2 on a road (not shown in greater detail).

[0033]In this case, it can occur in a manner known to a person skilled in the art that the wheels 6 of the vehicle 2 lose their ground contact and the vehicle 2 even moves away from a trajectory, which is predefined for example via a steering wheel (not shown in greater detail), due to understeer or oversteer. This is prevented b...

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Abstract

A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: -arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and -encapsulating the electronic component with the encapsulation material.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is the U.S. National Phase Application of PCT International Application PCT / EP2013 / 076134, filed Dec. 10, 2013, which claims priority to German Patent Application No. 10 2012 223 982.0, filed Dec. 20, 2012, the contents of such applications being incorporated by reference herein.FIELD OF THE INVENTION[0002]The invention relates to a method for producing an electronic assembly and to an electronic assembly.BACKGROUND OF THE INVENTION[0003]An electronic assembly having an encapsulated electronic component (referred to in the document as an encapsulated structure), which is held on a substrate in the form of a printed circuit board having an electrical circuit and is interconnected via bond wires with the electrical circuit, is known from DE 10 2007 060 931 A1, which is incorporated by reference. The substrate having the electronic component is fixed in a housing, which is potted using an embedding material. The potted housi...

Claims

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Application Information

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IPC IPC(8): H05K3/30H05K1/18
CPCH05K3/30Y10T29/49147H05K1/186H01L23/3121H01L23/3128H01L23/3135H01L23/552H01L23/562H01L2224/48137H01L2224/48227H01L2224/48247H01L2924/1433H01L2924/1461H01L2224/16145H01L2224/291H01L2224/2919H01L2224/32245H01L2224/73265H01L2924/19105H01L23/495H01L24/16H01L24/29H01L24/32H01L24/48H01L24/73H01L2224/04042H01L2224/48091H01L2224/0401H01L2924/181H01L2924/00014H01L24/49H01L2224/49171H01L2924/014H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207
InventorBIEBRICHER, LOTHARSCHULMEISTER, MICHAELSCHILLINGER, JAKOBHUBER, DIETMARFISCHERGUNTHNER, STEFANBAUMUNG, WALDEMAR
OwnerCONTINENTAL TEVES AG & CO OHG