Display device and chip-on-film structure thereof

a technology of a display device and a chip-on-a-film structure, applied in the field of display technology, can solve the problems of shallow conductive particles and bubbling in pressing, and achieve the effect of reducing the number of chips

Active Publication Date: 2020-07-23
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution ensures uniform force application during the bonding process, preventing issues like bubbling and shallow conductive particles, thereby enhancing the reliability and performance of flexible displays.

Problems solved by technology

Due to the space of COF for laying wires being limited, the lead wires must be arranged on two opposite sides of a COF substrate.
In bonding the COF, the arrangement of the lead wires may cause non-uniform of force application in a pressing operation of the output pads, leading to adverse issues of shallow conductive particles and bubbling in pressing.

Method used

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  • Display device and chip-on-film structure thereof
  • Display device and chip-on-film structure thereof

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Embodiment Construction

[0021]Embodiments of the present invention will be described in detail below, with reference to the attached drawings. However, the present invention can be embodied in various forms and this invention should not be construed as being limited to the specific embodiments described herein. Oppositely, these embodiments are provided just for the purpose of explaining the principle of this invention and practical applications thereof, in order to allow skilled persons of this field to appreciate various embodiments of this invention and various modifications thereof that suit to specific predetermined applications. In the drawings, similar reference numerals are consistently used to designate the same elements.

[0022]Referring to FIGS. 1, 2, and 3, the instant embodiment provides a chip-on-film structure 1, which comprises a substrate 11, a plurality of first output pads 12, a plurality of second output pads 13, a plurality of first lead wires 14, and a plurality of second lead wires 15....

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Abstract

A display device and a chip-on-film structure thereof are provided. The chip-on-film structure includes a substrate, multiple first output pads, multiple second output pads, multiple first lead wires, and multiple second lead wires. The substrate has a surface including a bonding zone. The first and output pads are located in the bonding zone. The first lead wires and the first output pads are located on the same surface of the substrate. The first lead wires and the second lead wires are located on two opposite surfaces of the substrate. Each of the first lead wires is connected to one of the first output pads. Each of the second lead wires is connected to one of the second output pads. The second lead wires each have a portion corresponding to the bonding zone and having the terminal sections that are respectively opposite to the first and second output pads.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This is a divisional application of co-pending U.S. patent application Ser. No. 15 / 765,188, filed on Mar. 30, 2018, which is a national stage of PCT Application Number PCT / CN2018 / 076481, filed on Feb. 12, 2018, claiming foreign priority of Chinese Patent Application Number 201810105842.1, filed on Feb. 2, 2018.BACKGROUND OF THE INVENTION1. Field of the Invention[0002]The present invention relates to the field of display technology, and more particularly to a display device and a chip-on-film thereof.2. The Related Arts[0003]Flexible displays, which are display devices that are made of flexible materials and can be curved, possess various advantages, including reduced thickness, small size, being light weight, being easy to carry, saving energy and being environment friendly, and fashion. Thus, the flexible displays are becoming a main stream. Heretofore, designs of flexible displays generally adopt chip on film (COF) structure. COF is now...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L23/498H01L51/56H05K3/32H05K3/36H01L23/14H01L27/32
CPCH05K1/118H05K3/323H01L27/3276H05K2201/10128H01L23/145H05K2203/1189H05K1/189H01L23/4985H05K3/361H01L51/56G09F9/301H10K71/00H01L23/49838H10K59/131
InventorLUO, JING
OwnerWUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD