Wire bonding device and circuit board wire bonding machine

Abstract

The invention relates to the field of electronic soldering machinery, and specifically discloses a wire soldering device. A support frame and a positioning fixture are arranged on a machine base, a soldering mechanism is arranged on the support frame, and the soldering mechanism is used for preheating and welding of a welding position. When a circuit board is positioned in the positioning fixture, the wire to be welded extends to the welding point position of the circuit board, and the soldering mechanism preheats the welding point position of the circuit board and the welding position of the wire. After the preheating is completed, the soldering mechanism melts the tin to achieve welding of the wire and the circuit board. The problem that the heating temperature of the wire and the welding point position of the circuit board rises too fast due to direct welding after the tin is melted, resulting in uneven heating and damage to the copper wire of the wire and the coating on the copper wire, is avoided. The quality and welding stability after welding are improved. The soldering mechanism is arranged on the support frame, and the circuit board is positioned in the positioning fixture, which replaces manual welding and improves efficiency.

Description

Technical Field

[0001] The invention relates to the field of wire soldering machinery, in particular to a soldering device and a circuit board wire soldering machine. Background Art

[0002] Cable and circuit board welding is a commonly used technology in the electronics industry, if the RF antenna, WIFI antenna and other built-in antennas. Traditional wire welding on the circuit board is done by the operator manually using an electric soldering iron to solder the conductor end of the wire to the circuit board; however, with the continuous advancement of technology and high labor costs, automated electric soldering machines have gradually replaced manual operations to improve production efficiency and reduce labor costs. However, in the current electronics field, circuit boards and welded cables are getting smaller and smaller; when using electric soldering iron for automatic welding, the soldering iron head is replaced frequently, which is easy to cause incomplete soldering, tin point pull points and other defects, resulting in short circuits, poor welding quality, and even rework, high soldering rate, and delays in labor; and many of the copper wires in the current wires are small in diameter and usually have a silver coating; therefore, during the soldering process, the electric soldering iron melts the tin wire and contacts the wire, causing the temperature of the conductor that is disconnected to rise instantly, which is prone to uneven heating and damage to part of the substrate or unstable solder joints. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a soldering device and a circuit board wire bonding machine to solve the problem that the current welding equipment has poor welding effect when welding wires on circuit boards, and is prone to uneven heating that damages part of the substrate or unstable solder joints.

[0004] In order to solve the above technical problems, the technical solution of the present invention is: a wire bonding device, comprising:

[0005] Machine base;

[0006] A support frame, arranged on the machine base;

[0007] A positioning fixture is provided on the machine base and is used to clamp and position the circuit board to be soldered;

[0008] The soldering mechanism is arranged on the support frame and is used for preheating and welding the welding position.

[0009] Preferably, the soldering mechanism is a laser soldering head.

[0010] A circuit board wire bonding machine, comprising the wire bonding device, further comprising:

[0011] A wire clamping mechanism, disposed on one side of the soldering mechanism, for clamping the wire to be soldered on the circuit board; and

[0012] A feeding manipulator, arranged on the machine base, for transferring the wires to be welded to the wire clamping mechanism;

[0013] The feeding robot clamps the wire to be welded onto the wire clamping mechanism, and the soldering mechanism preheats the welding contact points of the circuit board and the ends of the wires, and then melts the tin at the ends of the wires to weld the wires onto the circuit board.

[0014] Preferably, the loading robot includes: a first linear module, which is arranged on the machine base; a first connecting plate, which is arranged on the moving seat of the first linear module; a first wire clamp, which is arranged at the bottom of the first connecting plate, with the clamping mouth facing downward; a second wire clamp, which is arranged on the machine base, with the clamping mouth facing upward; a second linear module, which is arranged on the machine base and is arranged parallel to the first linear module; a second connecting plate, which is arranged on the moving seat of the second linear module; a third wire clamp, which is arranged at the bottom of the second connecting plate; the first linear module drives the first wire clamp to clamp the wire and place it on the second wire clamp, and the second linear module drives the third wire clamp to clamp the wire on the second wire clamp to the wire clamping mechanism.

[0015] Preferably, the first wire clamp, the second wire clamp and the third wire clamp are all pneumatic clamps, including a first finger cylinder and a first clamp and a second clamp arranged on two clamping blocks of the first finger cylinder, and the first finger cylinder drives the first clamp and the second clamp to clamp the wire.

[0016] Preferably, V-shaped clamping openings are provided on opposite sides of the first clamping jaw and the second clamping jaw; a plurality of air avoidance grooves are provided on the inner side wall of the V-shaped clamping opening of the first clamping jaw, and a plurality of air avoidance positions are provided on the V-shaped clamping opening of the second clamping jaw, and a clamping portion is formed between adjacent air avoidance positions; when the first clamping jaw and the second clamping jaw are clamped together, the clamping portion is inserted into the air avoidance groove; the centers of the first wire clamp, the second wire clamp and the third wire clamp after clamping are on the same horizontal straight line.

[0017] Preferably, the base is also provided with a detection probe for locating the end of the wire clamped on the second wire clamp.

[0018] Preferably, the soldering mechanism comprises a laser soldering head and a solder feeder arranged on the support frame; the output end of the solder feeder extends to the bottom end of the laser soldering head.

[0019] Preferably, the wire clamping mechanism includes a mounting plate arranged on the support frame, a pneumatic slide arranged on the side of the mounting plate, a second finger cylinder arranged at the bottom end of the sliding part of the pneumatic slide, and a third clamping jaw and a fourth clamping jaw arranged on two clamping blocks; V-shaped clamping openings are arranged on opposite sides of the third clamping jaw and the fourth clamping jaw; a plurality of second air avoidance grooves are arranged on the inner side wall of the V-shaped clamping opening of the third clamping jaw, and a plurality of second air avoidance positions are arranged on the V-shaped clamping opening of the fourth clamping jaw, and a second clamping portion is formed between adjacent second air avoidance positions; when the third clamping jaw and the fourth clamping jaw are clamped, the second clamping portion is inserted into the second air avoidance groove.

[0020] Preferably, a pressing cylinder is also provided on the side of the sliding part of the pneumatic slide, and a third connecting plate and a pressure plate are provided at the lifting end of the pressing cylinder. The pressing cylinder pushes the pressure plate to press down the wire clamped on the third clamp and the fourth clamp, so that the welding end of the wire contacts the circuit board.

[0021] Furthermore, the circuit board wire bonding machine also includes a translation mechanism, which is arranged on the support frame, and the soldering mechanism and the wire clamping mechanism are arranged on a moving seat of the translation mechanism.

[0022] Furthermore, the circuit board wire bonding machine also includes a positioning and conveying mechanism, which is arranged on the machine base and is used for positioning the jig for conveying and positioning it below the wire bonding mechanism.

[0023] Preferably, the positioning and conveying mechanism is an electric linear module arranged on the machine base, and the positioning fixture is arranged on a moving base of the electric linear module.

[0024] Preferably, a circuit board loading mechanism is also provided on the machine base for placing the circuit board in the positioning fixture; the circuit board loading mechanism includes a three-axis manipulator and a positioning material rack arranged on the machine base, a carrier plate arranged on the lifting part of the three-axis manipulator, and a suction cup arranged at the bottom of the carrier plate.

[0025] Preferably, belt conveyor mechanisms are also provided on both sides of the positioning and conveying mechanism, and the two belt conveyor mechanisms are fixedly connected to the machine base; a lifting mechanism arranged in the machine base drives the lifting plate to move up and down, and the positioning and conveying mechanism is arranged on the lifting plate; the circuit board loading mechanism adsorbs the circuit board on the two belt conveyor mechanisms, and the two belt conveyor mechanisms convey the circuit board to the top of the positioning jig, and the lifting mechanism pushes the positioning jig to rise, and the positioning jig clamps and positions the circuit board.

[0026] Preferably, an auxiliary conveying mechanism is also provided between the feeding robot and the belt conveying mechanism.

[0027] Compared with the prior art, the circuit board wire bonding machine has the following beneficial effects:

[0028] 1. A support frame and a positioning fixture are set on the machine base, and a soldering mechanism is set on the support frame. The soldering mechanism is used for preheating and welding of the welding position. Therefore, when the circuit board is positioned in the positioning fixture, the wire to be welded extends to the welding point position of the circuit board, and the soldering mechanism preheats the welding point position of the circuit board and the welding position of the wire. After the preheating is completed, the soldering mechanism melts the tin to achieve welding of the wire and the circuit board. By preheating the welding position, it is avoided that the heating temperature of the wire and the circuit board welding point position rises too fast after the tin is melted and then welded directly, resulting in uneven heating and damage to the copper wire of the wire and the coating on the copper wire. Thus, the quality after welding and the welding stability are improved.

[0029] 2. The soldering mechanism is set on the support frame, and the circuit board is positioned in the positioning fixture, thus replacing manual welding, improving efficiency, and being able to control the amount of solder, avoiding the solder on the circuit board from being connected to other electronic components, and avoiding the problem of short circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a structural diagram of the soldering device of the present invention;

[0031] Figure 2 It is a structural diagram of the circuit board wire bonding machine of the present invention;

[0032] Figure 3 It is a structural diagram of the soldering mechanism of the circuit board wire bonding machine of the present invention being arranged on a machine base;

[0033] Figure 4 It is a structural diagram of the soldering mechanism of the circuit board wire bonding machine of the present invention;

[0034] Figure 5 It is a structural diagram of the feeding manipulator of the circuit board wire bonding machine of the present invention;

[0035] Figure 6 is a structural diagram of the first wire clamp of the circuit board wire bonding machine of the present invention;

[0036] Figure 7 is a structural diagram of the second wire clamp of the circuit board wire bonding machine of the present invention;

[0037] Figure 8 is a structural diagram of the third wire clamp of the circuit board wire bonding machine of the present invention;

[0038] Fig. 9 It is a structural diagram of the wire clamping mechanism of the circuit board wire bonding machine of the present invention;

[0039] Fig.10 It is a structural diagram of the second finger cylinder of the circuit board wire bonding machine of the present invention;

[0040] Fig.11It is a structural diagram of the other side of the wire clamping mechanism of the circuit board wire bonding machine of the present invention;

[0041] Fig.12 It is a structural diagram of the circuit board wire bonding machine of the present invention, in which the detection head is arranged on the machine base;

[0042] Fig.13 It is a structural diagram of the circuit board feeding mechanism of the circuit board wire bonding machine of the present invention being arranged on a machine base;

[0043] Fig.14 It is a structural diagram of the circuit board feeding mechanism of the circuit board wire bonding machine of the present invention;

[0044] Fig.15 It is a structural diagram of the conveying and positioning mechanism of the circuit board wire bonding machine of the present invention;

[0045] Fig.16 It is a structural diagram of the auxiliary conveying mechanism of the circuit board wire bonding machine of the present invention being arranged on the machine base. DETAILED DESCRIPTION

[0046] The following specific implementation manner will be further described in conjunction with the above-mentioned drawings.

[0047] In the following, various specific details are set forth in order to provide a thorough understanding of the concepts underlying the described embodiments. However, it will be apparent to those skilled in the art that the described embodiments may be practiced without some or all of these specific details. In other cases, well-known processing steps are not specifically described.

[0048] Reference Figure 1 , a wire welding device, comprising: a machine base 1, a support frame 2, a positioning fixture 3 and a soldering mechanism 4. Among them: the support frame 2 is arranged on the machine base 1. The positioning fixture 3 is arranged on the machine base 1, and is used to clamp and position the circuit board to be welded. The soldering mechanism 4 is arranged on the support frame 2, and is used for preheating and welding of the welding position. When the circuit board is positioned in the positioning fixture 3, the wire to be welded extends to the soldering point position of the circuit board, and the soldering mechanism 4 preheats the soldering point position of the circuit board and the soldering position of the wire. After the preheating is completed, the soldering mechanism 4 melts the tin to achieve welding of the wire and the circuit board; by preheating the welding position, it is avoided that the temperature of the wire and the soldering point position of the circuit board rises too fast after the tin is melted and then the welding is directly carried out, resulting in uneven heating, and the copper wire of the wire and the coating on the copper wire are damaged; thereby improving the quality after welding and the welding stability. And by setting the soldering mechanism 4 on the support frame 2, the circuit board is positioned in the positioning fixture 3, thus replacing manual welding, improving efficiency, and being able to control the amount of solder, avoiding the solder on the circuit board from being connected with other electronic components, and avoiding the problem of short circuit.

[0049] Preferably, the soldering mechanism 4 is a laser soldering head. The laser soldering head ensures that the highest temperature is reached at the welding point by focusing, so as to melt the tin wire. The laser soldering head is used to preheat and weld the welding position. During preheating, the laser soldering head power is reduced to reduce the temperature of the focus point, and preheating is achieved. During welding, the laser soldering head power is reduced.

[0050] Please refer to Figure 1 to Figure 3 , a circuit board wire bonding machine, including the wire bonding device, further includes: a wire clamping mechanism 5, which is arranged on one side of the soldering mechanism 4, and is used to clamp the wire to be welded on the circuit board; and a feeding robot 6, which is arranged on the machine base 1, and is used to transfer the wire to be welded to the wire clamping mechanism 5; the feeding robot 6 clamps the wire to be welded to the wire clamping mechanism 5, and the soldering mechanism 4 preheats the soldering contacts of the circuit board and the ends of the wires, and then melts the tin at the ends of the wires, so that the wires are welded on the circuit board. Specifically, the circuit board is positioned in the positioning fixture 3, and the feeding robot 6 clamps the wire to be welded to the wire clamping mechanism 5, and the soldering mechanism 4 preheats the soldering contacts of the circuit board and the ends of the wires, and then melts the tin at the ends of the wires, so that the wires are welded on the circuit board.

[0051] Preferably, refer to Figure 2 to Figure 5 The loading robot 6 includes: a first linear module 60, which is arranged on the machine base 1; a first connecting plate 61, which is arranged on the moving seat of the first linear module 60; a first wire clamp 62, which is arranged at the bottom of the first connecting plate 61, and the clamping mouth faces downward; a second wire clamp 63, which is arranged on the machine base 1, and the clamping mouth faces upward; a second linear module 64, which is arranged on the machine base 1 and is arranged parallel to the first linear module 60; a second connecting plate 65, which is arranged on the moving seat of the second linear module 64; a third wire clamp 66, which is arranged at the bottom of the second connecting plate 65; the first linear module 60 drives the first wire clamp 62 to clamp the wire and place it on the second wire clamp 63, and the second linear module 64 drives the third wire clamp 66 to clamp the wire on the second wire clamp 63 to the wire clamping mechanism 5. Specifically, when the loading robot 6 clamps the wire to load the wire, the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 can all clamp cables, so after welding is completed, the cables can be quickly transported to the position of the wire clamping mechanism 5.

[0052] Furthermore, the first linear module 60 is fixed on the machine base 1 through a first bracket, and the second linear module 64 is fixed on the machine base 1 through a second bracket.

[0053] Reference Figures 5 to 8The first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 are all pneumatic clamps 600, including a finger cylinder 610 and a first clamp 620 and a second clamp 630 arranged on two clamping blocks of the finger cylinder. The finger cylinder 610 drives the first clamp 620 and the second clamp 630 to hold the wire.

[0054] Preferably, refer to Figure 6 to Figure 8 , the first clamping jaw 620 and the second clamping jaw 630 are provided with V-shaped clamping openings 620a, 630a on opposite sides; the inner side wall of the V-shaped clamping opening 620a of the first clamping jaw 620 is provided with a plurality of avoidance grooves 620b; the V-shaped clamping opening 630a of the second clamping jaw 630 is provided with a plurality of avoidance positions 630b, and a clamping portion 630c is formed between adjacent avoidance positions 630b; when the first clamping jaw 620 and the second clamping jaw 630 are clamped together, the clamping portion 630c is clamped into the avoidance groove 620b; therefore, when clamping the cable, it replaces the traditional front-to-back clamping of the wire, avoids the phenomenon of bending of the wire during the clamping process, and improves the accuracy and stability of the clamping. The centers of the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 after clamping are on the same horizontal straight line. By translating the cable, clamping can be completed one by one.

[0055] Specifically, in order for the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 to avoid each other during the wire clamping and transmission process, the first wire clamp 62 and the third wire clamp 66 are bent to form an avoidance position.

[0056] Further, in another embodiment of the third wire clamp 66, the third wire clamp 66 includes a lifting cylinder disposed on the moving seat of the second linear module 65, and a pneumatic clamp 600 disposed at the lifting end of the lifting cylinder. When the lifting cylinder moves to the lowest position, the centers of the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 after clamping are on the same horizontal straight line.

[0057] Preferably, refer to Fig.12 , the base 1 is also provided with a detection probe 200 for locating the end of the wire clamped on the second wire clamp 63. The detection probe 200 detects the position of the cable end, and when clamped with the third wire clamp 66, it automatically compensates the origin position of the second wire clamp 63, so that when the third wire clamp 66 detects that the wire is delivered to the clamping mechanism 5, it can always ensure that the end of the cable can be welded to the soldering point of the circuit board. In this embodiment, the detection probe 200 is set on the support rod, and the support rod is fixed on the base 1. Further, the detection probe 200 is a CCD camera.

[0058] Preferably, the soldering mechanism 4 comprises a laser soldering head 40 and a tin feeder 41 provided on the support frame 2; the output end of the tin feeder 41 extends to the bottom end of the laser soldering head 40. The tin wire is transported to the bottom end of the laser soldering head 40 by the tin feeder 41, and the tin wire is melted by the laser soldering head 40 to achieve soldering of the cable on the circuit board.

[0059] Preferably, refer to Figure 2 to Figure 4 , Figures 9 to 11 The wire clamping mechanism 5 includes a mounting plate 50 arranged on the support frame 2, a pneumatic slide 51 arranged on the side of the mounting plate 50, a second finger cylinder 52 arranged at the bottom end of the sliding part of the pneumatic slide 51, and the second finger cylinder 52 is arranged on the third clamping jaw 53 and the fourth clamping jaw 54 on the two clamping blocks; the third clamping jaw 53 and the fourth clamping jaw 54 are provided with V-shaped clamping openings 53a, 54a on the opposite sides; the inner side wall of the V-shaped clamping opening 53a of the third clamping jaw 53 is provided with a plurality of second avoidance grooves 53b, and the V-shaped clamping opening 54a of the fourth clamping jaw 54 is provided with a plurality of second avoidance positions 54b, and a second clamping portion 54c is formed between adjacent second avoidance positions 54b; when the third clamping jaw 53 and the fourth clamping jaw 54 are clamped, the second clamping portion 54c is clamped into the second avoidance groove 53b.

[0060] Preferably, please refer to Fig.11 The side of the sliding part of the pneumatic slide 51 is also provided with a downward pressing cylinder 55, and the lifting end of the downward pressing cylinder 55 is provided with a third connecting plate 56, and a pressing plate 57 arranged at the bottom of the third connecting plate 56. The downward pressing cylinder 55 pushes the pressing plate 57 to press down the wire clamped on the third clamping jaw 53 and the fourth clamping jaw 54, so that the end of the wire is bent and the welding end thereof contacts the circuit board. Therefore, the situation that the cable conductor is not in contact with the circuit board for welding can be effectively avoided.

[0061] Further, refer to Figure 2 , Figure 3 and Fig.13 , the circuit board wire bonding machine also includes a translation mechanism 7, which is arranged on the support frame 2, and the soldering mechanism 4 and the wire clamping mechanism 5 are arranged on the moving seat of the translation mechanism 7. In this embodiment, when it is necessary to solder multiple cables on the circuit board, the soldering mechanism 4 and the wire clamping mechanism 5 are driven by the translation mechanism 7 to move simultaneously, thereby realizing welding in multiple positions. It can also realize the welding of the conductor and the shielding layer in the coaxial cable with the circuit board; specifically, when the coaxial cable needs to be soldered on the circuit board, the wire clamping mechanism 5 clamps the wire, the soldering mechanism 4 solders the conductor of the cable on the circuit board, the wire clamping mechanism 5 is loosened, but the cable is still suspended, and the soldering mechanism 4 is translated by the translation mechanism 7, so that the soldering mechanism 4 moves to the shielding layer welding position, thereby realizing the welding of the shielding layer and the circuit board. Further, the translation mechanism is a linear module.

[0062] Further, refer to Figure 3 , Fig.13 and Fig.15 The circuit board wire bonding machine also includes a positioning and conveying mechanism 8, which is arranged on the machine base 1 and is used to convey and position the positioning jig 3 below the wire bonding mechanism. In this embodiment, the circuit board is positioned in the positioning jig 3, and the positioning and conveying mechanism 8 drives the positioning jig 3 to move to the bottom end of the soldering mechanism 4, thereby realizing the welding of the wires and the circuit board. In this embodiment, multiple wires can also be welded on the circuit board. Specifically, after the welding of the first wire is completed, the wire clamping mechanism 5 clamps the second wire, and the positioning jig 3 is driven to move by the positioning and conveying mechanism 8, thereby realizing the welding of multiple wires on the circuit board.

[0063] Preferably, the positioning and conveying mechanism 8 is an electric linear module arranged on the machine base 1, and the positioning fixture 3 is arranged on a moving base of the electric linear module.

[0064] Preferably, please refer to Fig.11 and Fig.12 The base 1 is also provided with a circuit board feeding mechanism 9 for placing the circuit board in the positioning fixture 3. The circuit board feeding mechanism 9 comprises a three-axis manipulator 90 and a positioning material rack 91 provided on the base 1, a carrier plate 92 provided on the lifting part of the three-axis manipulator 90, and a suction cup 93 provided at the bottom of the carrier plate 92. The three-axis manipulator 90 drives the suction cup 93 to move downward, so that the circuit board placed on the positioning material rack 91 is placed on the positioning fixture 3, and the positioning fixture 3 is used to position and clamp the circuit board; thereby realizing automatic feeding of the circuit board.

[0065] Preferably, please refer to Figure 3 , Fig.13 , Fig.15 and Fig.16 , belt conveyor mechanisms 100 are also provided on both sides of the positioning and conveying mechanism 8, and the two belt conveyor mechanisms 100 are fixedly connected to the machine base 1; the lifting mechanism 110 arranged in the machine base 1 drives the lifting plate 120 to move up and down, and the positioning and conveying mechanism 8 is arranged on the lifting plate 120; the circuit board loading machine 9 adsorbs the circuit board on the two belt conveyor mechanisms 100, and the two belt conveyor mechanisms 100 convey the circuit board to the top of the positioning fixture 3, and the lifting mechanism 110 pushes the positioning fixture 3 to rise, and the positioning fixture 3 clamps and positions the circuit board.

[0066] Preferably, refer to Fig.15 and Fig.16The lifting mechanism 110 includes a plurality of connecting columns 111 arranged on the top wall of the cavity of the machine base 1, a support plate 112 connected to the bottom of the plurality of connecting columns 111, a guide column 113 slidingly passing through the support plate 112, and a lifting cylinder 114; the upper end of the guide column 113 is connected to the lifting plate 120, the lifting cylinder 114 is arranged on the support plate 112, and the upper end of the lifting cylinder 114 is fixedly connected to the bottom of the lifting plate 150.

[0067] Preferably, refer to Fig.15 The positioning fixture 3 includes a base plate 30 arranged on the moving seat of the positioning and conveying mechanism 8, a wide air gripper 31 arranged on the base plate 30, a clamping plate 32 arranged on two moving blocks of the wide air gripper 31, a support member 33 arranged on the body of the wide air gripper 31, and a positioning plate 34 arranged on the support member 33; the outer end of the clamping plate 32 is provided with a clamping portion 35 extending upward, and the inner side of the clamping portion 35 is provided with a positioning card slot 36; the opening end of the card slot 36 has a guide position. The circuit board is placed on the positioning plate 34, and the finger cylinder 31 drives the clamping plate 32 to move toward each other, clamping the two ends of the circuit board, and positioning it in the card slot 36, so as to clamp and position the circuit board.

[0068] Preferably, refer to Figure 2 , Fig.13 ,and Fig.16 An auxiliary conveying mechanism 130 is also provided between the feeding robot 6 and the belt conveying mechanism 100. The tail end of the wire welded on the circuit board is placed on the auxiliary conveying mechanism 130, so as to not only play an auxiliary supporting role for the cable, but also play a conveying role.

[0069] Further, refer to Fig.11 , driving the motor of the auxiliary conveying mechanism 130, and driving one of the belt conveying mechanisms 100 to operate through the transmission mechanism, so that the unloading and loading of the positioning fixture 3 are carried out simultaneously, ensuring that the loading and unloading are carried out in an orderly manner, and at the same time one driving power can be reduced.

[0070] The present invention is not limited to the above-mentioned specific implementation modes. Various changes made by ordinary technicians in this field based on the above-mentioned concepts without creative work are all within the protection scope of the present invention.

Claims

1. Circuit board wire bonding machine, characterized in that, include: A wire bonding device, the wire bonding device comprising a machine base, a support frame, a positioning fixture and a soldering mechanism; the support frame and the positioning fixture are arranged on the machine base; The positioning fixture is used to clamp and position the circuit board to be soldered; the soldering mechanism is arranged on the support frame and is used for preheating and soldering the soldering position; A wire clamping mechanism, disposed on one side of the soldering mechanism, for clamping the wire to be soldered on the circuit board; and a feeding manipulator, disposed on the machine base, for transferring the wire to be soldered to the wire clamping mechanism; The soldering mechanism comprises a laser welding head and a soldering machine arranged on the support frame; the output end of the soldering machine extends to the bottom end of the laser welding head; The circuit board is positioned in the positioning fixture, the feeding robot clamps the wire to be welded onto the wire clamping mechanism and extends to the soldering point position of the circuit board, the soldering mechanism preheats the soldering point position of the circuit board and the welding position of the wire, the tin feeder conveys the tin wire to the bottom end of the laser welding head, the laser welding head melts the tin wire and welds the wire on the circuit board; The feeding robot comprises: a first linear module, which is arranged on the machine base; a first connecting plate, which is arranged on the moving seat of the first linear module; a first wire clamp, which is arranged at the bottom of the first connecting plate, with the clamping opening facing downward; a second wire clamp, which is arranged on the machine base, with the clamping opening facing upward; a second linear module, which is arranged on the machine base and is arranged parallel to the first linear module; a second connecting plate, which is arranged on the moving seat of the second linear module; a third wire clamp, which is arranged at the bottom of the second connecting plate; the first linear module drives the first wire clamp to clamp the wire and place it on the second wire clamp, and the second linear module drives the third wire clamp to clamp the wire on the second wire clamp to the wire clamping mechanism; It also includes a positioning and conveying mechanism, which is arranged on the machine base and is used for conveying the positioning jig and positioning it below the soldering mechanism; the positioning and conveying mechanism is an electric linear module arranged on the machine base, and the positioning jig is arranged on the moving base of the electric linear module; the machine base is also provided with a circuit board loading mechanism for placing the circuit board in the positioning jig; the circuit board loading mechanism includes a three-axis manipulator and a positioning material rack arranged on the machine base, a carrier plate arranged on the lifting part of the three-axis manipulator, and a suction cup arranged at the bottom of the carrier plate; belt conveying mechanisms are also arranged on both sides of the positioning and conveying mechanism, and the two belt conveying mechanisms are fixedly connected to the machine base; the lifting mechanism arranged in the machine base drives the lifting plate to move up and down, and the positioning and conveying mechanism is arranged on the lifting plate; the circuit board loading mechanism adsorbs the circuit board on the two belt conveying mechanisms, and the two belt conveying mechanisms transport the circuit board to the top of the positioning jig, and the lifting mechanism pushes the positioning jig to rise, and the positioning jig clamps and positions the circuit board.

2. The circuit board wire bonding machine according to claim 1, characterized in that: The first wire clamp, the second wire clamp and the third wire clamp are all pneumatic clamps, including a first finger cylinder and a first clamp and a second clamp arranged on two clamping blocks of the first finger cylinder. The first finger cylinder drives the first clamp and the second clamp to clamp the wire.

3. The circuit board wire bonding machine according to claim 2, characterized in that: The first clamp and the second clamp are provided with V-shaped clamping openings on opposite sides; the inner side wall of the V-shaped clamp of the first clamp is provided with a plurality of air avoidance grooves, and the V-shaped clamp of the second clamp is provided with a plurality of air avoidance positions, and a clamping part is formed between adjacent air avoidance positions; when the first clamp and the second clamp are clamped, the clamping part is clamped into the air avoidance groove; the centers of the first wire clamp, the second wire clamp and the third wire clamp after clamping are on the same horizontal straight line.

4. The circuit board wire bonding machine according to any one of claims 1 to 3, characterized in that: The base is also provided with a detection probe for locating the end of the electric wire clamped on the second wire clamp.

5. The circuit board wire bonding machine according to any one of claims 1 to 3, characterized in that: The wire clamping mechanism includes a mounting plate arranged on the support frame, a pneumatic slide arranged on the side of the mounting plate, a second finger cylinder arranged at the bottom end of the sliding part of the pneumatic slide, and a third clamping jaw and a fourth clamping jaw arranged on two clamping blocks of the second finger cylinder; V-shaped clamping openings are arranged on opposite sides of the third clamping jaw and the fourth clamping jaw; a plurality of second air avoidance grooves are arranged on the inner side wall of the V-shaped clamping opening of the third clamping jaw, and a plurality of second air avoidance positions are arranged on the V-shaped clamping opening of the fourth clamping jaw, and a second clamping portion is formed between adjacent second air avoidance positions; when the third clamping jaw and the fourth clamping jaw are clamped, the second clamping portion is clamped into the second air avoidance groove.

6. The circuit board wire bonding machine according to claim 5, characterized in that: A pressing cylinder is also provided on the side of the sliding part of the pneumatic slide, and a third connecting plate and a pressure plate are provided at the lifting end of the pressing cylinder. The pressing cylinder pushes the pressure plate to press down the wire clamped on the third clamp and the fourth clamp, so that the welding end of the wire contacts the circuit board.

7. The circuit board wire bonding machine according to claim 1, characterized in that: It also includes a translation mechanism, which is arranged on the support frame, and the soldering mechanism and the wire clamping mechanism are arranged on a moving seat of the translation mechanism.

8. The circuit board wire bonding machine according to claim 1, characterized in that: An auxiliary conveying mechanism is also provided between the feeding robot and the belt conveying mechanism.

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