Ultra-thin film electroplating device

Abstract

The present invention discloses an ultra-thin film electroplating device, comprising a first electroplating tank, a second electroplating tank and a film conveying mechanism, wherein the first electroplating tank and the second electroplating tank are arranged side by side, and the film conveying mechanism is used to convey the film to be electroplated into the first electroplating tank and the second electroplating tank in sequence, so that the film to be electroplated is electroplated on the front side in the first electroplating tank and electroplated on the back side in the second electroplating tank. When the ultra-thin electroplating device provided by the present invention is electroplated, one side is electroplated before the other side, so that the buoyancy of the electroplating solution has little effect on the electroplating, thereby ensuring the uniformity of the electroplating; the ultra-thin electroplating device provided by the present invention can enable the film to enter the first electroplating tank and the second electroplating tank with support for electroplating through the first carrier wheel and the second carrier wheel, without wrinkling, and the electroplating is uniform; in addition, the ultra-thin electroplating equipment provided by the present invention does not need to be clamped by a clamping plate, and will not cause uneven tension of the film to be electroplated, so the electroplating is uniform.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating, and in particular to an ultra-thin film electroplating device. Background Art

[0002] PET electroplated ultra-thin film (thickness 4 microns) is often used in lithium battery negative electrodes, FPC (flexible circuit boards) and other fields. The PET electroplated film includes a PET substrate layer, a rough copper layer deposited on the surface of the PET substrate layer by deposition, and an electroplated layer electroplated on the surface of the rough copper layer. The PET substrate layer and the rough copper layer electroplated layer are collectively referred to as the film to be electroplated. The electroplated layer can be electroplated copper / nickel / tin, etc.

[0003] In the final step of producing PET electroplated film - the electroplating process, electroplating equipment is used for electroplating. Traditional electroplating equipment uses multiple rollers to horizontally transfer the film to be plated to the electroplating tank. The electroplating solution immerses the film to be plated for double-sided electroplating. When the film to be plated enters the electroplating tank, the two sides of the film to be plated are clamped by clamps to keep the balance of the film to be plated in the electroplating solution.

[0004] However, traditional electroplating equipment has at least the following problems:

[0005] 1) Since the electroplating film is plated on both sides at the same time, and the plating solution has a certain buoyancy and will fluctuate, it will cause uneven film plating.

[0006] 2) In the process of rollers conveying the film to be plated, the rollers will generate tensile stress on the film to be plated. Since the conductive film to be plated is particularly thin, uneven tension is likely to occur at the back of the film to be plated, resulting in wrinkles at the back or even at the front, which leads to uneven electroplating, and then uneven conductivity of the PET plated film after electroplating.

[0007] 3) Since both sides of the film to be plated are clamped by multiple clamps arranged side by side, and the clamping force of the clamps is not uniform, the tension of the film to be plated will be uneven, resulting in uneven electroplating, and further resulting in uneven conductivity of the PET plated film after electroplating. Summary of the invention

[0008] In order to overcome the deficiencies of the prior art, the present invention discloses an ultra-thin film electroplating device.

[0009] To achieve the above object, the present invention is implemented through the following technical solutions:

[0010] The present invention discloses an ultra-thin film electroplating device, comprising a first electroplating tank, a second electroplating tank and a film conveying mechanism, wherein the first electroplating tank and the second electroplating tank are arranged side by side, and the film conveying mechanism is used to convey the film to be electroplated into the first electroplating tank and the second electroplating tank in sequence, so that the film to be electroplated is electroplated on the front side in the first electroplating tank and electroplated on the back side in the second electroplating tank;

[0011] The film conveying mechanism comprises a film releasing wheel, a first carrier wheel, a front-reverse conversion assembly and a second carrier wheel, wherein the first carrier wheel and the second carrier wheel are respectively vertically arranged in the first electroplating tank and the second electroplating tank, and the first carrier wheel and the second carrier wheel have the same rotation direction, and the first carrier wheel and the second carrier wheel are respectively driven to rotate by motors;

[0012] The film releasing wheel is used to release the film to be electroplated into the first electroplating tank;

[0013] The first carrier wheel is used to support the film to be plated so that the reverse side of the film to be plated adheres to the wheel surface and rotates;

[0014] The second carrier wheel is used to support the film to be electroplated so that the front side of the film to be electroplated adheres to the wheel surface and rotates;

[0015] The front-rear conversion assembly is used to make the electroplated film coming out of the first electroplating tank face each other and then enter the second electroplating tank for electroplating on the other side.

[0016] As one of the preferred solutions of the present invention, the film release wheel is vertically arranged, the film release wheel is approximately at the same height as the first carrier wheel and the second carrier wheel, and the film release wheel is close to / located in the area between the first electroplating tank and the second electroplating tank.

[0017] Further preferably, a first membrane inlet and a second membrane inlet and an inner wall of the first electroplating tank opposite to the second electroplating tank and an inner wall of the second electroplating tank opposite to the first electroplating tank are respectively provided with a first membrane inlet and an outlet.

[0018] More preferably, the film conveying mechanism further comprises a first transition wheel, a second transition wheel, a third transition wheel and a fourth transition wheel;

[0019] The first transition wheel and the second transition wheel are respectively located at the inlet and outlet of the first membrane, and are used to transitionally guide the membrane into and out of the first electroplating tank. The third transition wheel and the fourth transition wheel are respectively located at the inlet and outlet of the second membrane, and are used to transitionally guide the membrane into and out of the second electroplating tank. After the membrane is guided out of the first electroplating tank via the second transition wheel, it moves obliquely to the third transition wheel and enters the second electroplating tank after the front and back sides of the third transition wheel are converted.

[0020] As one of the preferred solutions of the present invention, it also includes a first conductive mechanism and a second conductive mechanism, wherein the first conductive mechanism and the second conductive mechanism are respectively used to attract ions to be deposited on the membrane by conductive means.

[0021] Further preferably, the first conductive mechanism comprises a first conductive synchronous belt that circulates and rotates and a plurality of first synchronous wheels that cooperate with the first conductive synchronous belt, wherein a portion of the first conductive synchronous belt is located in the first electroplating tank and another portion is located outside the first electroplating tank during the circulatory rotation, the portion of the first conductive synchronous belt located in the first electroplating tank surrounds and is close to a portion of the circumference of the first carrier wheel, and the first conductive synchronous belt circulates and rotates as the first carrier wheel rotates;

[0022] The second conductive mechanism includes a second conductive synchronous belt that rotates in a circular manner and a plurality of second synchronous wheels that cooperate with the second conductive synchronous belt. During the circular rotation process, a portion of the first conductive synchronous belt is located in the second electroplating tank and the other portion is located outside the second electroplating tank. The portion of the second conductive synchronous belt located in the second electroplating tank surrounds and is close to a portion of the circumference of the second carrier wheel. The second conductive synchronous belt rotates in a circular manner as the second carrier wheel rotates.

[0023] More preferably, two of the first conductive synchronous belt and the second conductive synchronous belt are respectively provided, and the two first conductive synchronous belts are respectively used to contact the upper and lower edges of the membrane for conduction; the two second conductive synchronous belts are respectively used to contact the upper and lower edges of the membrane for conduction.

[0024] Preferably, a conductive copper block serving as an anode is disposed in each of the first electroplating tank and the second electroplating tank.

[0025] Further preferably, a plurality of the conductive copper blocks are disposed on the inner wall of the first electroplating tank surrounding the first carrier wheel, and a plurality of the conductive copper blocks are disposed on the inner wall of the second electroplating tank surrounding the second carrier wheel.

[0026] Further preferably, a spray pipe is provided in the first electroplating tank and the second electroplating tank respectively, and a spray head is provided on the spray pipe.

[0027] Compared with the prior art, the present invention has at least the following advantages:

[0028] When the ultra-thin electroplating device provided by the present invention is electroplated on one side, the other side is electroplated first, so that the buoyancy of the electroplating solution has little effect on the electroplating, thereby ensuring the uniformity of the electroplating.

[0029] The ultra-thin electroplating device provided by the present invention can enable the film to enter the first electroplating tank and the second electroplating tank with support for electroplating through the first carrier wheel and the second carrier wheel, without wrinkling and ensuring uniform electroplating.

[0030] In addition, the ultra-thin electroplating equipment provided by the present invention does not require clamping, and will not cause uneven tension of the film to be electroplated, so the electroplating is uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for describing the embodiments are briefly introduced below.

[0032] Figure 1 A schematic structural diagram of an ultra-thin film electroplating device disclosed in an embodiment of the present invention;

[0033] Figure 2 A schematic diagram of the structure of the first conductive mechanism and the second conductive mechanism disclosed in an embodiment of the present invention;

[0034] Figure 3 It is a schematic structural diagram of the film conveying mechanism disclosed in an embodiment of the present invention. DETAILED DESCRIPTION

[0035] The present invention is further described in detail below in conjunction with embodiments and drawings so that those skilled in the art can implement the invention with reference to the description.

[0036] See also Figure 1-3 As shown, an embodiment of the present invention discloses an ultra-thin film electroplating device, comprising a first electroplating tank 1, a second electroplating tank 2 and a film conveying mechanism 3, wherein the first electroplating tank 1 and the second electroplating tank 2 are arranged side by side, and the film conveying mechanism 3 is used to convey the film to be electroplated into the first electroplating tank 1 and the second electroplating tank 2 in sequence, so that the film to be electroplated is electroplated on the front side in the first electroplating tank and electroplated on the back side in the second electroplating tank 2;

[0037] The film conveying mechanism 3 includes a film releasing wheel 31, a first carrier wheel 32, a front-back conversion assembly and a second carrier wheel 33. The first carrier wheel 32 and the second carrier wheel 33 are respectively vertically arranged in the first electroplating tank 1 and the second electroplating tank 2, and the first carrier wheel 32 and the second carrier wheel 33 rotate in the same direction. The first carrier wheel 32 and the second carrier wheel 33 are respectively driven to rotate by motors.

[0038] The film release wheel 31 is used to release the film to be electroplated into the first electroplating tank 1;

[0039] The first carrier wheel 32 is used to provide support for the film K to be plated so that the reverse side of the film to be plated adheres to the wheel surface and rotates;

[0040] The second carrier wheel 33 is used to support the film to be plated so that the front side of the film to be plated adheres to the wheel surface and rotates;

[0041] The front and back side conversion assembly is used to make the electroplated film coming out of the first electroplating tank 1 face each other and then enter the second electroplating tank 2 for electroplating on the other side.

[0042] The film release wheel 31 is vertically arranged, and the film release wheel 31 is approximately at the same height as the first carrier wheel 32 and the second carrier wheel 33, and the film release wheel 31 is close to / located in the area between the first electroplating tank 1 and the second electroplating tank 2. Placing the film release wheel 31 in the area close to / located in the area between the first electroplating tank 1 and the second electroplating tank 2 can save the path of the film entering the first electroplating tank 1, reduce the deformation and wrinkling caused by the film conveying path being too long, reduce the exposure time of the film in the air, and reduce oxidation.

[0043] The first membrane inlet and outlet and the second membrane inlet and outlet are respectively arranged on the inner side wall of the first electroplating tank 1 opposite to the second electroplating tank 2 and the inner side wall of the second electroplating tank 2 opposite to the first electroplating tank 1. Of course, the membrane inlet and outlet can be divided into an inlet and an outlet, and the inlet and the outlet are arranged separately. The first membrane inlet and outlet are arranged relative to the second membrane inlet and outlet, which can reduce the path of the membrane, thereby reducing deformation and wrinkling.

[0044] The film conveying mechanism 3 further includes a first transition wheel 34, a second transition wheel 35, a third transition wheel 36 and a fourth transition wheel 37. The first transition wheel 34 and the second transition wheel 35 are respectively located at the inlet and outlet of the first film. The first transition wheel 34 and the second transition wheel 35 are respectively used to transitionally guide the film to move into and out of the first electroplating tank 1. The third transition wheel 36 and the fourth transition wheel 37 are respectively located at the inlet and outlet of the second film. The third transition wheel 36 and the fourth transition wheel 37 are respectively used to transitionally guide the film to move into and out of the second electroplating tank 2. Two third transition wheels 36 can be designed. The film passes through the pores between the two third transition wheels 6. After the film is guided out of the first electroplating tank 1 via the second transition wheel 35, it moves obliquely to the third transition wheel 36 and enters the second electroplating tank 2 after the front and back sides of the third transition wheel 36 are converted. The transition wheel plays a transition role and makes the front and back sides of the film face each other, so that electroplating of different surfaces can be achieved in the first electroplating tank 1 and the second electroplating tank 2. In addition, two fifth transition wheels 38 arranged opposite to each other can be designed. The two fifth transition wheels 38 are arranged behind the fourth transition wheel 37. A gap allowing the membrane to pass through is formed between the two fifth transition wheels 38, which is used to further guide the membrane out of the second electroplating tank 2 for easy winding.

[0045] The ultra-thin film electroplating device further comprises a first conductive mechanism 4 and a second conductive mechanism 5, wherein the first conductive mechanism 4 and the second conductive mechanism 5 are respectively used to attract ions to be deposited on the film by conductive means.

[0046] The first conductive mechanism 4 includes two first conductive synchronous belts 41 that rotate in a circular manner and a plurality of first synchronous wheels 42 that cooperate with the first conductive synchronous belts 41. During the circular rotation process, a portion of the first conductive synchronous belt 41 is located in the first electroplating tank 1 and another portion is located outside the first electroplating tank 1. The portion of the first conductive synchronous belt 41 located in the first electroplating tank 1 surrounds and is close to a portion of the circumference of the first carrier wheel 32. The first conductive synchronous belt 42 rotates in a circular manner as the first carrier wheel 32 rotates. Two first conductive synchronous belts 41 are designed to contact the upper and lower edges of the film for electrical conduction, respectively.

[0047] The second conductive mechanism 5 includes two second conductive synchronous belts 51 that rotate in a circular motion and a plurality of second synchronous wheels 52 that cooperate with the second conductive synchronous belts 51. During the circular rotation process, a portion of the first conductive synchronous belt 41 is located in the second electroplating tank 2 and the other portion is located outside the second electroplating tank 2. The portion of the second conductive synchronous belt 51 that is located in the second electroplating tank 2 surrounds and is close to a portion of the circumference of the second carrier wheel 33. The second conductive synchronous belt 51 rotates in a circular motion with the rotation of the second carrier wheel 33. Two second conductive synchronous belts 51 are designed to contact the upper and lower edges of the film for conduction, respectively.

[0048] Conductive copper blocks 6 serving as anodes are respectively arranged in the first electroplating tank 1 and the second electroplating tank 2, wherein the inner wall of the first electroplating tank 1 is provided with a plurality of conductive copper blocks 6 around the first carrier wheel 32, and the inner wall of the second electroplating tank 2 is provided with a plurality of conductive copper blocks 6 around the second carrier wheel 33.

[0049] A plurality of spray pipes 7 are also provided in the first electroplating tank 1 and the second electroplating tank 2, respectively, and a spray head is provided on the spray pipe 7. The spray pipe 7 can be selectively provided between two adjacent conductive copper blocks 6, and a plurality of spray pipes 7 are also provided around the carrier wheel. Spraying through the spray pipe 7 can disturb the electrolyte, thereby making the electroplating effect better.

[0050] When the ultra-thin electroplating equipment provided by the embodiment of the present invention is working, a material roll is installed on the film release wheel 31, and the motor drives the carrier wheel to rotate. The film on the material roll on the film release wheel 31 is released into the first electroplating tank 1, and the film is attached to the first carrier wheel 32. As the first carrier wheel 32 rotates, the film moves until it is moved out of the first electroplating tank 1. After moving out of the first electroplating tank 1, the film is reversed back to the first conversion wheel, the second conversion wheel and the third conversion wheel, and then enters the second electroplating tank 2. At this time, the other side of the film is attached to the second carrier wheel 33, and as the second carrier wheel 33 rotates, the film moves. The film moves until it is moved out of the second electroplating tank 2. During the movement of the film, the first conductive synchronous belt 41 and the second conductive synchronous belt 51 are respectively driven by the first carrier wheel 32 and the second carrier wheel 33 to rotate in a circular motion. The conductive synchronous belt is attached to the film, and the conductive synchronous belt and the carrier wheel play a role in clamping the film together, thereby further improving the supporting effect on the film. In addition, due to the conductivity of the conductive synchronous belt, copper ions / nickel ions, etc. can be attracted to the film, thereby completing the electroplating, and the part of the film that contacts the conductive synchronous belt is cut off after the electroplating is completed. This is the process edge.

[0051] Through the above technical scheme, the ultra-thin electroplating equipment provided in the embodiment of the present invention is provided with two electroplating tanks. When electroplating, the two sides of the membrane are electroplated separately through the two electroplating tanks. In this way, the buoyancy of the plating solution has little effect on the electroplating, thereby ensuring the uniformity of the electroplating.

[0052] The ultra-thin electroplating equipment can make the non-electroplating surface of the film adhere to the corresponding carrier wheel through the first carrier wheel 32 and the second carrier wheel 33. Therefore, the film has a certain supporting force during electroplating and will not shake or ripple in the electroplating solution. This improves the uniformity of electroplating and ensures the conductive uniformity of the final product.

[0053] Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An ultra-thin film electroplating device, characterized in that: The invention comprises a first electroplating tank, a second electroplating tank and a film conveying mechanism, wherein the first electroplating tank and the second electroplating tank are arranged side by side, and the film conveying mechanism is used to convey the film to be electroplated into the first electroplating tank and the second electroplating tank in sequence so that the film to be electroplated is electroplated on the front side in the first electroplating tank and electroplated on the back side in the second electroplating tank; The film conveying mechanism comprises a film releasing wheel, a first carrier wheel, a front-reverse conversion assembly and a second carrier wheel, wherein the first carrier wheel and the second carrier wheel are respectively vertically arranged in the first electroplating tank and the second electroplating tank, and the first carrier wheel and the second carrier wheel have the same rotation direction, and the first carrier wheel and the second carrier wheel are respectively driven to rotate by motors; The film releasing wheel is used to release the film to be electroplated into the first electroplating tank; The first carrier wheel is used to support the film to be plated so that the reverse side of the film to be plated adheres to the wheel surface and rotates; The second carrier wheel is used to support the film to be electroplated so that the front side of the film to be electroplated adheres to the wheel surface and rotates; The front-rear conversion assembly is used to make the electroplated film coming out of the first electroplating tank face each other and then enter the second electroplating tank for electroplating on the other side.

2. The ultra-thin film electroplating device according to claim 1, characterized in that: The film release wheel is vertically arranged, the film release wheel is located at substantially the same height as the first carrier wheel and the second carrier wheel, and the film release wheel is close to / located in the area between the first electroplating tank and the second electroplating tank.

3. The ultra-thin film electroplating device according to claim 2, characterized in that: A first membrane inlet and a second membrane inlet and an inner side wall of the first electroplating tank opposite to the second electroplating tank and an inner side wall of the second electroplating tank opposite to the first electroplating tank are respectively provided with a first membrane inlet and an inner side wall of the second electroplating tank opposite to the first electroplating tank.

4. The ultra-thin film electroplating device according to claim 3, characterized in that: The film conveying mechanism further comprises a first transition wheel, a second transition wheel, a third transition wheel and a fourth transition wheel; The first transition wheel and the second transition wheel are respectively located at the inlet and outlet of the first membrane, and are used to transitionally guide the membrane into and out of the first electroplating tank. The third transition wheel and the fourth transition wheel are respectively located at the inlet and outlet of the second membrane, and are used to transitionally guide the membrane into and out of the second electroplating tank. After the membrane is guided out of the first electroplating tank via the second transition wheel, it moves obliquely to the third transition wheel and enters the second electroplating tank after the front and back sides of the third transition wheel are converted.

5. The ultra-thin film electroplating device according to claim 1, characterized in that: It also includes a first conductive mechanism and a second conductive mechanism, wherein the first conductive mechanism and the second conductive mechanism are respectively used to attract ions to be deposited on the membrane in a conductive manner.

6. The ultra-thin film electroplating device according to claim 5, characterized in that: The first conductive mechanism comprises a first conductive synchronous belt that circulates and rotates and a plurality of first synchronous wheels that cooperate with the first conductive synchronous belt. During the circulatory rotation, a portion of the first conductive synchronous belt is located in the first electroplating tank and another portion is located outside the first electroplating tank. The portion of the first conductive synchronous belt located in the first electroplating tank surrounds and is close to a portion of the circumference of the first carrier wheel. The first conductive synchronous belt circulates and rotates as the first carrier wheel rotates. The second conductive mechanism includes a second conductive synchronous belt that rotates in a circular manner and a plurality of second synchronous wheels that cooperate with the second conductive synchronous belt. During the circular rotation process, a portion of the first conductive synchronous belt is located in the second electroplating tank and the other portion is located outside the second electroplating tank. The portion of the second conductive synchronous belt located in the second electroplating tank surrounds and is close to a portion of the circumference of the second carrier wheel. The second conductive synchronous belt rotates in a circular manner as the second carrier wheel rotates.

7. The ultra-thin film electroplating device according to claim 6, characterized in that: The first conductive synchronous belt and the second conductive synchronous belt are provided with two each, and the two first conductive synchronous belts are used to contact with the upper and lower edges of the film for electrical conduction, and the two second conductive synchronous belts are used to contact with the upper and lower edges of the film for electrical conduction.

8. The ultra-thin film electroplating device according to claim 1, characterized in that: The first electroplating tank and the second electroplating tank are respectively provided with conductive copper blocks serving as anodes.

9. The ultra-thin film electroplating device according to claim 8, characterized in that: A plurality of the conductive copper blocks are disposed on the inner wall of the first electroplating tank surrounding the first carrier wheel, and a plurality of the conductive copper blocks are disposed on the inner wall of the second electroplating tank surrounding the second carrier wheel.

10. The ultra-thin film electroplating device according to claim 1, characterized in that: The first electroplating tank and the second electroplating tank are respectively provided with spray pipes, and the spray pipes are provided with spray heads.

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