Twice cut mark detection device, method, terminal and storage medium

Abstract

The present application relates to a twice cut mark detection device, method, terminal and storage medium, which belongs to the technical field of semiconductor packaging, wherein the method includes controlling a cutter to cut a cut mark for detection on a wafer, the cut mark hereinafter referred to as a detection cut mark; capturing a wafer image and a detection cut mark on the wafer by a camera device; presenting the captured image and the detection cut mark on a display device by image preprocessing; processing the wafer image, using the detection cut mark as a reference, marking a pre-cut cut mark on the wafer surface, the cut mark being a cut mark made by the cutter along the pre-cut position; controlling the cutter to perform a cut according to the pre-cut cut mark; controlling the cutter to perform a second cut at the first cut. The present application has the feature of using the detection cut mark as a reference, and marking the pre-cut cut mark on the acquired image according to the requirements, and completing the cutting of the wafer by controlling the blade to cut on the pre-cut cut mark, making it easy to find the required cutting position, thereby improving the cutting accuracy.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a twice cut detection device, method, terminal and storage medium. Background Art

[0002] Step cutting is a stress-relief cutting process in which the first groove is cut (half-cut) and the second groove is cut within the cut of the first groove.

[0003] In the process of implementing the present application, the inventors found that the above technology has at least the following problems: in the existing Step mode, the width of the second grooving knife is smaller than the width of the first grooving knife, and the cut mark is within the knife mark of the first grooving. The traditional detection mode cannot see the knife mark of the second grooving, so it is impossible to align with the knife mark. Summary of the invention

[0004] In order to solve the problem that the traditional detection mode cannot see the knife mark of the second grooving and therefore cannot align with the knife mark, the present application provides a twice cut mark detection device, method, terminal and storage medium.

[0005] In a first aspect, the present application provides a twice cut mark detection method, which adopts the following technical solution:

[0006] A twice cut mark detection method comprises the following steps:

[0007] Control the cutter to cut on the wafer and detect the cutter marks;

[0008] Capturing wafer images and inspection knife marks on the wafer through a camera device;

[0009] The captured images and detected knife marks are presented on a display device through image preprocessing;

[0010] Process the wafer image, use the detected knife marks as a reference, and mark the pre-cut knife marks on the wafer surface;

[0011] Control the cutter to make a cut according to the pre-cutting mark;

[0012] Control the cutter to make a second cut at the first cut.

[0013] By adopting the above technical solution, the detected knife marks are used as reference objects, and the pre-cut knife marks are marked on the acquired image according to needs. The wafer is cut by controlling the blade to cut on the pre-cut knife marks, which makes it easier to find the required cutting position, thereby improving the cutting accuracy.

[0014] Optionally, the detection knife mark depth is 0.1 mm, and the detection knife mark length is one quarter of the wafer diameter.

[0015] By adopting the above technical solution, the depth of the detected knife mark is shallow and the length is short, and it will not affect the cutting operation when it can be identified.

[0016] Optionally, the controlling the cutting knife to detect cutting marks on the wafer specifically includes:

[0017] An arbitrary point is selected on the circumference of the wafer as the starting point, the center of the wafer is taken as the end point, and the cutting mark detection is performed on the line connecting the starting point and the end point.

[0018] By adopting the above technical solution, the detection knife mark is set on the diameter of the wafer, which makes it easy to obtain the position of the detection knife mark and thus more accurately calculate the position of the pre-cutting knife mark, thereby improving the accuracy of wafer cutting.

[0019] Optionally, presenting the captured image and the detected knife marks on a display device through image preprocessing further includes:

[0020] The wafer position displayed on the display device is consistent with the actual position of the wafer, and the position of the detection knife mark displayed on the display device is consistent with the actual position of the detection knife mark.

[0021] By adopting the above technical solution, the image position of the wafer is consistent with the actual position of the wafer, which makes it easy to control the cutter to directly cut the wafer according to the pre-cutting marks on the image, making the cutting operation more convenient.

[0022] Optionally, the processing of the wafer image specifically includes:

[0023] Get the cutting length information and the diameter of the wafer;

[0024] The distance value is calculated based on the cutting length information and the diameter;

[0025] A pre-cutting mark is marked on the surface of the wafer, with the center of the circle as the starting point, the pre-cutting mark is parallel to the detection mark, and the distance between the pre-cutting mark and the detection mark is the calculated distance value.

[0026] By adopting the above technical solution, the exact position of the pre-cutting mark is calculated according to the needs, thereby improving the accuracy of wafer cutting.

[0027] Optionally, controlling the cutter to perform a cut according to the pre-cutting marks specifically includes:

[0028] Setting cutting parameters, including number of cutting strips, total number of blades, blade height, and feed speed;

[0029] The cutter is controlled according to the cutting parameters to perform a cut according to the pre-cutting marks.

[0030] By adopting the above technical solution, cutting parameters can be preset in advance according to needs, which is convenient for processing different wafers or different cutting requirements.

[0031] In a second aspect, the present application provides a twice cut mark detection device, which adopts the following technical solution:

[0032] A twice cut mark detection device, comprising a camera device, a display device, an image preprocessing module, an image processing module, a calculation module, an information storage module and a control module;

[0033] The camera device is used to take pictures of the wafer and the detection knife marks on the wafer, and transmit the taken pictures to the image preprocessing module;

[0034] The image preprocessing module is used to present the picture in electronic format on a display device;

[0035] The information storage module is used to store cutting information and wafer data;

[0036] The calculation module is used to calculate the position of the pre-cutting mark according to the cutting length information and the diameter of the wafer;

[0037] The image processing module is used to mark the position of the pre-cutting mark on the display device;

[0038] The control module is used to obtain the cutting information in the information storage module and control the cutter to cut the wafer according to the pre-cutting marks.

[0039] By adopting the above technical solution, the detection knife marks are marked on the wafer in advance, the image information of the wafer is obtained through image processing, and the pre-cutting knife marks are marked on the acquired image with the detection knife marks as a reference, and the cutter is controlled to cut the wafer, which makes it easier to find the required cutting position, thereby improving the cutting accuracy.

[0040] Optionally, the control module is communicatively connected to a detection module, and the detection module is used to detect whether a cut mark produced by a single cut is consistent with a pre-cut mark.

[0041] By adopting the above technical solution, the detection module detects whether the position of a cut is offset, thereby reducing the occurrence of wafer scrapping due to a cutting error.

[0042] In a third aspect, the present application provides a smart terminal, which adopts the following technical solution:

[0043] An intelligent terminal comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein when the computer program is executed by the processor, a twice cut mark detection method as described above is implemented.

[0044] By adopting the above technical solution, corresponding programs can be stored and processed, and the cutting accuracy can be improved.

[0045] In a fourth aspect, the present application provides a computer-readable storage medium, which adopts the following technical solution:

[0046] A computer-readable storage medium comprises a readable storage medium and a computer program stored and running on the readable storage medium, wherein the computer program is loaded and executed by a processor to implement any of the above-mentioned twice cut mark detection methods.

[0047] By adopting the above technical solution, it is convenient to store related programs, find the required cutting position, and improve the cutting accuracy.

[0048] In summary, the present application includes at least one of the following beneficial technical effects:

[0049] 1. Use the detected knife marks as a reference, and mark the pre-cut knife marks on the acquired image as required. Control the blade to cut on the pre-cut knife marks to complete the wafer cutting, making it easier to find the required cutting position, thereby improving the cutting accuracy;

[0050] 2. The image position of the wafer is consistent with the actual position of the wafer, which makes it easy to control the cutter to cut the wafer directly according to the pre-cut marks on the image, making the cutting operation more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is an overall structural block diagram of a twice cut mark detection device in an embodiment of the present application.

[0052] Figure 2 It is a schematic diagram of the overall process of a twice cut mark detection method in an embodiment of the present application.

[0053] Figure 3 It is a schematic diagram of the overall process of determining the pre-cutting marks in the embodiment of the present application.

[0054] Explanation of the accompanying drawings: 1. Camera device; 2. Display device; 3. Image preprocessing module; 4. Image processing module; 5. Calculation module; 6. Information storage module; 7. Control module; 8. Detection module. DETAILED DESCRIPTION

[0055] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0056] The following is a further detailed description of an embodiment of a twice cut mark detection device, method, terminal and storage medium of the present application in conjunction with the drawings of the specification.

[0057] The present application embodiment discloses a twice cut mark detection device. Figure 1 A twice cut mark detection device includes a camera 1, a display device 2 and an information storage module 6. In this embodiment, the camera 1 is a camera, which is used to photograph the wafer and the detection cut marks on the wafer. The camera is connected to an image preprocessing module 3, which is used to receive photos taken by the camera and present the photos on the display device 2 in an electronic format.

[0058] The information storage module 6 is used to store cutting information and wafer data, wherein the cutting information includes cutting length, number of cutting strips, total number of blades, blade height, and feed speed, and the wafer data includes the diameter of the wafer and the position of the detection knife mark on the wafer. The calculation module 5 is connected to the information storage module 6 in communication, and the calculation module 5 obtains the cutting length information and the diameter of the wafer, and calculates the position of the pre-cut knife mark based on the cutting length information and the diameter of the wafer. The image processing module 4 is connected to the calculation module 5 in communication, and the image processing module 4 obtains the position of the pre-cut knife mark and marks the position of the pre-cut knife mark on the acquired wafer image. The information storage module 6 is connected to the control module 7 in communication, and the control module 7 is connected to the calculation module 5 in communication, and the control module 7 obtains the cutting information, and controls the cutter to cut the wafer according to the pre-cut knife mark according to the cutting information. The control module 7 is connected to the detection module 8 in communication, and the detection module 8 is used to detect whether the cut mark of a cut is consistent with the pre-cut knife mark, thereby reducing the occurrence of cutting deviation.

[0059] During implementation, a detection knife mark is marked on the wafer, image information of the wafer is obtained through image processing, and pre-cut knife marks are marked on the obtained image using the detection knife mark as a reference. The cutter is controlled to cut the wafer, making it easier to find the required cutting position, thereby improving the cutting accuracy.

[0060] The implementation of a twice cut mark detection method is described in detail below in conjunction with a twice cut mark detection device:

[0061] Reference Figure 2 Another embodiment of the present application provides a twice cut mark detection method, comprising the following steps:

[0062] S10, controlling the cutter to cut a detection cut mark on the wafer;

[0063] Among them, the cutting for detecting knife marks is to take any point on the circumference of the wafer as the starting point, and the center of the wafer as the end point, and cut a knife mark that coincides with the connecting line at the connecting line between the starting point and the end point, and use the cut knife mark as the detection knife mark, and the detection knife mark is a knife mark that can be identified on the display device 2 through image processing.

[0064] In this embodiment, the depth of the detection knife mark is 0.1 mm, and the length of the detection knife mark is one quarter of the wafer diameter.

[0065] S20, capturing the wafer image and the detection knife marks on the wafer through a camera;

[0066] S30, presenting the captured image and the detected knife marks on the display device 2 through image preprocessing;

[0067] In order to facilitate the control of the cutter to cut the wafer, the wafer position displayed on the display device 2 is consistent with the actual wafer position, and the position of the detection knife mark on the wafer displayed on the display device 2 is consistent with the actual detection knife mark on the wafer.

[0068] S40, processing the wafer image, using the detected knife marks as a reference, and marking the pre-cutting knife marks on the wafer surface;

[0069] The position of the pre-cutting mark is determined according to the requirements, and the specific steps include:

[0070] S1, obtaining cutting length information and wafer diameter;

[0071] S2, calculate the distance value according to the cutting length information and the diameter;

[0072] S3, marking a pre-cutting mark on the surface of the wafer, with the center of the circle as the starting point, the pre-cutting mark is parallel to the detection mark, and the distance between the pre-cutting mark and the detection mark is the calculated distance value.

[0073] In one embodiment, the cutting length is 60mm and the diameter of the wafer is 100mm. The radius of the wafer is calculated to be 50mm, and half of the cutting length is 30mm. The cutting length is regarded as a line segment intersecting the wafer, and both endpoints of the line segment are on the circumference of the wafer, which is equivalent to the cutting length being the chord of the circumference of the wafer. Half of the cutting length is 30mm, and the radius of the wafer is 50mm. According to the Pythagorean theorem, the distance from the center of the circle to the line segment is calculated to be 40mm. Based on the detection mark, the line segment on the wafer that is parallel to the detection mark and 40mm away from the detection mark is used as the pre-cut mark.

[0074] S50, controlling the cutter to perform a cut according to the pre-cutting mark;

[0075] Among them, for different wafers or different cutting requirements, the wafer will be cut according to the set data. The specific steps include:

[0076] S100, setting cutting parameters;

[0077] S200, controlling the cutter to perform a cut according to the pre-cutting marks according to the cutting parameters.

[0078] Specifically, the cutting parameters include the number of cutting strips, the total number of blades, the blade height, and the feed speed. In practice, cutting according to the cutting parameters can improve the accuracy of cutting and can ensure that the wafer is not damaged as much as possible during cutting.

[0079] S60, controlling the cutter to perform a second cut at the first cut location.

[0080] Based on the same inventive concept mentioned above, an embodiment of the present application also discloses an intelligent terminal, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the computer program is executed by the processor, a twice cut mark detection method provided in the above method embodiment is implemented.

[0081] Based on the same inventive concept mentioned above, an embodiment of the present application also discloses a computer-readable storage medium, including a readable storage medium and a computer program stored and running on the readable storage medium, wherein the computer program is loaded and executed by a processor to implement a twice cut mark detection method provided in the above method embodiment.

[0082] It should be understood that the "plurality" mentioned in this article refers to two or more. "And / or" describes the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0083] Those skilled in the art will appreciate that all or part of the steps to implement the above embodiments may be accomplished by hardware or by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium. The storage medium mentioned above may include, for example, various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0084] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A twice cut detection method, based on at least one camera device (1) and one display device (2), characterized in that: The following steps are involved: Control the cutter to cut on the wafer and detect the cutter marks; Capturing the wafer image and the detection knife marks on the wafer by means of a camera device (1); The captured image and the detected knife marks are presented on a display device (2) through image preprocessing; Process the wafer image, use the detected knife marks as a reference, and mark the pre-cut knife marks on the wafer surface; Control the cutter to make a cut according to the pre-cutting mark; Control the cutter to make a second cut at the first cut; The processing of the wafer image specifically includes: Get the cutting length information and the diameter of the wafer; The distance value is calculated based on the cutting length information and the diameter; A pre-cutting mark is marked on the surface of the wafer, with the center of the circle as the starting point, the pre-cutting mark is parallel to the detection mark, and the distance between the pre-cutting mark and the detection mark is the calculated distance value.

2. A twice cut detection method according to claim 1, characterized in that: The depth of the detection knife mark is 0.1 mm, and the length of the detection knife mark is one quarter of the wafer diameter.

3. A twice cut mark detection method according to claim 1, characterized in that: The control of the cutting knife to detect the cutting marks on the wafer specifically includes: An arbitrary point is selected on the circumference of the wafer as the starting point, the center of the wafer is taken as the end point, and the cutting mark detection is performed on the line connecting the starting point and the end point.

4. A twice cut mark detection method according to claim 1, characterized in that: The method of presenting the captured picture and the detected knife marks on the display device (2) through image preprocessing also includes: The wafer position displayed on the display device (2) is consistent with the actual position of the wafer, and the position of the detection knife mark displayed on the display device (2) is consistent with the actual position of the detection knife mark.

5. A twice cut mark detection method according to claim 4, characterized in that: The controlling the cutting knife to perform a cutting according to the pre-cutting marks specifically includes: Setting cutting parameters, including number of cutting strips, total number of blades, blade height, and feed speed; The cutter is controlled according to the cutting parameters to perform a cut according to the pre-cutting marks.

6. A twice cut mark detection device, the device being based on a twice cut mark detection method according to any one of claims 1 to 5, characterized in that: It comprises a camera device (1), a display device (2), an image preprocessing module (3), an image processing module (4), a calculation module (5), an information storage module (6) and a control module (7); The camera device (1) is used to take photos of the wafer and the detection knife marks on the wafer, and transmit the taken photos to the image preprocessing module (3); The image preprocessing module (3) is used to present the image in an electronic format on the display device (2); The information storage module (6) is used to store cutting information and wafer data; The calculation module (5) is used to calculate the position of the pre-cutting mark according to the cutting length information and the diameter of the wafer; The image processing module (4) is used to mark the position of the pre-cutting mark on the display device (2); The control module (7) is used to obtain the cutting information in the information storage module (6) and control the cutter to cut the wafer according to the pre-cutting marks.

7. A twice cut mark detection device according to claim 6, characterized in that: The control module (7) is communicatively connected to a detection module (8), and the detection module (8) is used to detect whether a cut mark obtained by a single cut is consistent with a pre-cut mark.

8. An intelligent terminal, characterized in that: The invention comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein when the computer program is executed by the processor, a twice cut mark detection method as claimed in any one of claims 1 to 5 is implemented.

9. A computer-readable storage medium, characterized in that: It comprises a readable storage medium and a computer program stored and running on the readable storage medium, wherein the computer program is loaded and executed by a processor to implement a twice cut mark detection method as claimed in any one of claims 1 to 5.

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