Liquid cooling device

Abstract

A liquid cooling device includes a heat dissipation shell and a double-layer fin module. The heat dissipation shell includes a cooling cavity, and the double-layer fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that after the cooling fluid enters the cooling cavity, it flows into the upper cooling space and the lower cooling space respectively to cool a chip in the lower cooling space.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, and in particular to a liquid cooling heat dissipation device. Background Art

[0002] With the advancement of technology, electronic products are becoming more and more popular, and gradually changing the way many people live or work. As computer computing power increases, the temperature control of electronic components such as CPUs becomes more and more important.

[0003] Electronic components such as CPUs generate heat when running and require proper cooling to achieve optimal performance. In order to keep CPUs and other electronic components running at an ideal temperature, liquid cooling or air cooling is currently commonly used.

[0004] Taking the CPU as an example, the heat generated by it is dissipated to the metal cover of the integrated heat spreader (IHS) above. The heat is then transferred to the cooler's base plate through the integrated heat spreader, and then the heat is dissipated to the fan through liquid or heat pipes to be taken away from the electronic device.

[0005] In the current water cooling method, the working fluid flows into the cold plate through the pipe, but there are multiple layers of material between the working fluid and the chip, and the thermal resistance will reduce the heat conduction efficiency. Therefore, how to effectively improve the heat dissipation efficiency of the heat dissipation device is eagerly anticipated by relevant personnel in the relevant technical field. Summary of the invention

[0006] The invention summary is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This invention summary is not a complete overview of the present disclosure, and it is not intended to point out the important / critical elements of the embodiments of the present invention or to define the scope of the present invention.

[0007] An object of the present invention is to provide a liquid cooling device, which can effectively improve the heat dissipation efficiency of the heat dissipation device, reduce the operating temperature of electronic products, and improve the working efficiency of electronic products.

[0008] To achieve the above-mentioned purpose, a technical aspect of the present invention relates to a liquid cooling device, comprising a heat dissipation housing and a double-layer fin module. The heat dissipation housing comprises a cooling cavity, and the double-layer fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that after the cooling fluid enters the cooling cavity, it flows into the upper cooling space and the lower cooling space respectively to cool a chip in the lower cooling space.

[0009] In some embodiments, the double-layer fin module includes an isolation plate, a plurality of first fins and a plurality of second fins. The plurality of first fins are formed above the isolation plate and located in the upper cooling space, and the plurality of second fins are formed below the isolation plate and located in the lower cooling space.

[0010] In some embodiments, the lower cooling space further includes a thin film space between the chip and the second fin.

[0011] In some embodiments, the heat dissipation housing further includes a plurality of fixing bosses, and a fixing surface of the isolation plate of the double-layer fin module is fixed to the fixing bosses to form a thin film space between the chip and the second fin.

[0012] In some embodiments, a first fin width of the first fin is the same as or different from a second fin width of the second fin.

[0013] In some embodiments, the heat dissipation housing includes an inlet and an outlet, and the aperture of the outlet is larger than the aperture of the inlet.

[0014] In some embodiments, the heat dissipation housing further includes two inlet guide surfaces, which are disposed on both sides of the inlet to guide the cooling fluid into the cooling cavity.

[0015] In some embodiments, the heat dissipation housing further includes two outlet guide surfaces, which are disposed on both sides of the outlet to guide the cooling fluid to leave the cooling cavity.

[0016] In some embodiments, the inlet guide surface forms an angle of about 45 degrees to 75 degrees with the inlet, and the outlet guide surface forms an angle of about 45 degrees to 75 degrees with the outlet.

[0017] In some embodiments, the liquid cooling device further comprises a substrate and an adhesive layer. The chip is fixed on the substrate, and the adhesive layer adheres the substrate and the heat dissipation housing, and the adhesive layer comprises an epoxy resin adhesive layer.

[0018] Therefore, the liquid cooling device can effectively improve the heat dissipation efficiency, directly contact the working fluid with the chip to perform heat exchange, improve the heat conduction efficiency, and use the small distance between the heat dissipation fins and the chip to generate a layer of liquid film through surface tension, and use the film to conduct the heat of the chip to the heat dissipation fins, and then the working fluid will take away the heat. In addition, the lower heat dissipation fins can take away most of the heat, and the upper heat dissipation fins can take away the remaining heat, effectively improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

[0020] Figure 1 The figure is an exploded diagram of a liquid cooling device according to an embodiment of the present invention.

[0021] Figure 2 for Figure 1 A three-dimensional schematic diagram of the heat dissipation housing of the liquid cooling device and the double-layer fin module from another angle.

[0022] Figure 3 for Figure 1 A partial cross-sectional schematic diagram of a liquid cooling heat dissipation device.

[0023] The reference numerals are described as follows:

[0024] 100: Liquid cooling device

[0025] 110: Heat dissipation housing

[0026] 112: Entrance

[0027] 114: Exit

[0028] 116: Cooling chamber

[0029] 117: Fixed boss

[0030] 118: Entrance guide surface

[0031] 119: Exit guide surface

[0032] 120: Double-layer fin module

[0033] 122: First Fin

[0034] 123: Runner

[0035] 124: Isolation board

[0036] 125: Fixed surface

[0037] 126: Second fin

[0038] 127: Runner

[0039] 130: Adhesive layer

[0040] 140: Substrate

[0041] 150: Chip

[0042] 201: First fin width

[0043] 202: Second fin width

[0044] 203: Height

[0045] 204: Height

[0046] 205: Angle

[0047] 206: Angle

[0048] 301: Inlet fluid

[0049] 302: Upper cooling fluid

[0050] 303: Cooling fluid below

[0051] 304: Liquid Film

[0052] 305: Outlet fluid

[0053] 306: Spacing

[0054] 307: Upper cooling space

[0055] 308: Lower cooling space

[0056] 309: Membrane Space DETAILED DESCRIPTION

[0057] The following is a detailed description of the embodiments with the accompanying drawings, but the embodiments provided are not intended to limit the scope of the present disclosure, and the description of the structure operation is not intended to limit the order of its execution. Any structure recombined by the elements to produce a device with equal functions is within the scope of the present disclosure. In addition, the drawings are for illustration purposes only and are not drawn according to the original size. For ease of understanding, the same or similar elements in the following description will be described with the same symbols.

[0058] In addition, the terms used throughout the specification and claims generally have the ordinary meaning of each term used in the field, in the context of this disclosure, and in the specific context, unless otherwise noted. Certain terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the present disclosure.

[0059] In the embodiments and claims, unless otherwise specified in the context, "a", "an" and "the" may refer to one or more. The numbers used in the steps are only used to mark the steps for ease of description, and are not used to limit the order and implementation methods.

[0060] Secondly, the words "include", "including", "have", "contain" and the like used in this article are all open terms, which mean including but not limited to.

[0061] Figure 1 is an exploded schematic diagram of a liquid cooling device according to an embodiment of the present invention. Figure 2It is a three-dimensional schematic diagram of the heat dissipation housing of the liquid cooling device and the double-layer fin module from another angle. Figure 3 for Figure 1 A partial cross-sectional schematic diagram of a liquid cooling heat dissipation device.

[0062] See also Figure 1 and Figure 2 As shown in the figure, the liquid cooling device 100 includes a heat dissipation housing 110 , a double-layer fin module 120 , an adhesive layer 130 , a substrate 140 and a chip 150 .

[0063] The heat dissipation housing 110 includes a cooling chamber 116, and the double-layer fin module 120 is fixed in the cooling chamber 116. Figure 3 The double-layer fin module 120 divides the cooling cavity 116 into an upper cooling space 307 and a lower cooling space 308 , so that after the cooling fluid enters the cooling cavity 116 , it flows into the upper cooling space 307 and the lower cooling space 308 respectively to cool the chip 150 in the lower cooling space 308 .

[0064] The chip 150 is fixed on the substrate 140 , and the adhesive layer 130 adheres the substrate 140 and the heat dissipation housing 110 to fix the substrate 140 and the heat dissipation housing 110 , and seals the chip 150 in the cooling cavity 116 of the heat dissipation housing 110 .

[0065] In some embodiments, the adhesive layer 130 is an epoxy adhesive layer.

[0066] In some embodiments, the adhesive layer 130 is attached to four sides of the chip 150. Therefore, when the working fluid flows through the back surface of the chip 150, it can be prevented from contacting the circuit on the substrate 140 to avoid the problem of short circuit.

[0067] In some embodiments, the heat dissipation housing 110 includes an inlet 112 and an outlet 114, which are respectively disposed at two ends of the heat dissipation housing 110. In some embodiments, the aperture of the outlet 114 is larger than the aperture of the inlet 112 to improve the heat dissipation efficiency, especially when using a two-phase fluid, which is more conducive to the coexistence of liquid and gas to stabilize the inlet and outlet cross-sectional area required for the cooling fluid to enter and exit.

[0068] In some embodiments, the double-layer fin module 120 includes an isolation plate 124, a plurality of first fins 122, and a plurality of second fins 126. The first fins 122 are formed above the isolation plate 124 and are located in the upper cooling space 307, while the second fins 126 are formed below the isolation plate 124 and are located in the lower cooling space 308.

[0069] In some embodiments, the lower cooling space 308 further includes a thin film space 309 between the chip 150 and the second fin 126 .

[0070] See also Figures 1 to 3 As shown in the figure, in some embodiments, after the inlet fluid 301 enters the cooling cavity 116 from the left inlet 112, the inlet fluid 301 is divided into an upper cooling fluid 302 and a lower cooling fluid 303 due to the isolation plate 124 of the double-layer fin module 120. The lower cooling fluid 303 flows along the flow channel 127 between the second fins 126 and flows through the surface of the chip 150 to directly cool the chip 150. The upper cooling fluid 302 flows along the flow channel 123 between the first fins 122 to cool the heat conducted to the isolation plate 124 and the first fins 122 through the second fins 126 of the double-layer fin module 120, thereby reducing the temperature of the entire double-layer fin module 120, so as to further reduce the operating temperature of the chip 150.

[0071] Therefore, the liquid cooling device 100 of the present invention can directly and indirectly cool the chip 150 through the double-layer fin module 120 , thereby effectively reducing the operating temperature of the chip 150 and improving the working efficiency of the chip 150 .

[0072] In addition, a gap 306 is formed between the second fin 126 and the chip 150. The small distance between the second fin 126 and the chip 150 is used to generate a liquid film 304 through surface tension, and then the heat of the chip 150 is transferred to the heat sink fins by the liquid film 304, and then the heat is taken away by the working fluid. The double-layer fin module 120 of the liquid-cooled heat sink 100 of the present invention has heat sink fins on both the upper and lower layers. The lower heat sink fins can take away most of the heat, and the upper heat sink fins can further take away the remaining heat, further improving the heat dissipation effect of the liquid-cooled heat sink 100.

[0073] In some embodiments, the double-layer fin module 120 includes double-layer skived fins and is not in contact with the chip 150 , and heat can be transferred through a film.

[0074] In some embodiments, the outlet fluid 305 may be a single-phase fluid or a two-phase fluid without departing from the spirit and scope of the present invention.

[0075] In some embodiments, see Figure 2As shown in the figure, the heat dissipation housing 110 further includes two fixing bosses 117 to be fixed to a fixing surface 125 of the isolation plate 124 of the double-layer fin module 120, so as to form a thin film space 309 between the chip 150 and the second fin 126. In some embodiments, the height 203 from the fixing boss 117 to the bottom surface of the heat dissipation housing 110 is greater than or equal to the height 204 from the fixing surface 125 of the isolation plate 124 to an end surface of the second fin 126.

[0076] In some embodiments, the first fin width 201 is greater than the second fin width 202 , but the present invention is not limited thereto. The first fin width 201 may also be the same as or different from the second fin width 202 .

[0077] In some embodiments, the heat dissipation housing 110 further includes two inlet guide surfaces 118 disposed on both sides of the inlet 112 to guide the cooling fluid into the cooling chamber 116. In addition, the heat dissipation housing 110 may also include two outlet guide surfaces 119 disposed on both sides of the outlet 114 to guide the cooling fluid out of the cooling chamber 116.

[0078] In some embodiments, the inlet guide surface 118 forms an angle 205 with the inlet 112 of about 45 degrees to 75 degrees, and the outlet guide surface 119 forms an angle 206 with the outlet 114 of about 45 degrees to 75 degrees.

[0079] In summary, the liquid cooling device disclosed in the present invention can effectively improve the heat dissipation efficiency, directly contact the working fluid with the chip to perform heat exchange, improve the heat conduction efficiency, and use the small distance between the heat dissipation fins and the chip to generate a layer of liquid film through surface tension, and use the film to conduct the heat of the chip to the heat dissipation fins, and then the working fluid will take away the heat. In addition, the lower heat dissipation fins can take away most of the heat, and the upper heat dissipation fins can take away the remaining heat, effectively improving the heat dissipation efficiency.

[0080] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the appended claims.

Claims

1. A liquid cooling device, characterized in that: Include: A heat dissipation housing, wherein the heat dissipation housing comprises a cooling chamber; and A double-layer fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that after the cooling fluid enters the cooling cavity, it flows into the upper cooling space and the lower cooling space respectively to cool a chip in the lower cooling space, wherein the double-layer fin module comprises: a separation board; A plurality of first fins are formed above the isolation plate and located in the upper cooling space; and A plurality of second fins are formed below the isolation plate and are located in the lower cooling space, wherein the lower cooling space also includes a thin film space between the chip and the plurality of second fins, wherein a spacing is formed between the plurality of second fins and the chip, and a layer of liquid film is generated through surface tension by utilizing the small distance between the plurality of second fins and the chip.

2. The liquid cooling device according to claim 1, characterized in that: The heat dissipation housing further comprises a plurality of fixing bosses, and a fixing surface of the isolation plate of the double-layer fin module is fixed to the plurality of fixing bosses to form the thin film space between the chip and the plurality of second fins.

3. The liquid cooling device according to claim 2, characterized in that: A first fin width of the plurality of first fins is the same as or different from a second fin width of the plurality of second fins.

4. The liquid cooling device according to claim 1, characterized in that: The heat sink housing includes: an entrance; and An outlet, wherein the aperture of the outlet is larger than the aperture of the inlet.

5. The liquid cooling device according to claim 4, characterized in that: The heat sink also includes: Two inlet guide surfaces are respectively arranged on both sides of the inlet to guide the cooling fluid into the cooling cavity.

6. The liquid cooling device according to claim 5, characterized in that: The heat sink also includes: Two outlet guide surfaces are respectively arranged on both sides of the outlet to guide the cooling fluid to leave the cooling cavity.

7. The liquid cooling device according to claim 6, characterized in that: The plurality of inlet guide surfaces form an angle of about 45 degrees to 75 degrees with the inlet, and the plurality of outlet guide surfaces form an angle of about 45 degrees to 75 degrees with the outlet.

8. The liquid cooling device according to claim 1, characterized in that: Also includes: a substrate, wherein the chip is fixed on the substrate; and An adhesive layer is used to bond the substrate and the heat dissipation housing, and the adhesive layer comprises an epoxy resin adhesive layer.

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