Semiconductor process equipment and calibration equipment

Abstract

The embodiment of the present application provides a semiconductor process equipment and calibration device. The calibration device includes: a mounting platform, a driving mechanism and a calibration mechanism; the mounting platform is used to install the driving mechanism and the calibration mechanism; the driving mechanism includes a cam and a driver, the cam is located on the top of the mounting platform, and the cam has a plurality of convex parts and concave parts arranged alternately; the driver is used to drive the cam to rotate; the calibration mechanism includes a plurality of mobile bearing components, the plurality of mobile bearing components are radially distributed along the radial direction of the cam, and are used to jointly carry the wafer cutting workpiece, and the plurality of mobile bearing components cooperate with the cam, and are used to selectively move away from or approach the cam synchronously when the cam rotates, so as to calibrate the position of the wafer cutting workpiece. The embodiment of the present application realizes the calibration of the position of the wafer cutting workpiece, avoids the displacement of the wafer cutting workpiece and the electrostatic chuck position during the transmission process, and thus greatly improves the product yield.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and more specifically, to a semiconductor process equipment and a calibration device. Background Art

[0002] At present, with the rapid development of 12-inch three-dimensional integration and advanced packaging, the requirements for wafer utilization, yield and particle control are getting higher and higher, and plasma cutting technology has become the development trend of wafer cutting. The plasma cutting process is to stick the wafer and the frame on the UV film (a plastic film made of special materials, one side of which is sticky), and the frame is set around the periphery of the wafer. This combination is called a wafer cutting workpiece; plasma etches the wafer on the wafer cutting workpiece, and after the etching is completed, the wafer is cut into multiple chips.

[0003] In the prior art, the robot transfers the wafer cutting workpiece from the cassette to the electrostatic chuck in the process chamber. To ensure the stability of the process results, the position of the wafer cutting workpiece cannot be wrong each time it is transferred to the electrostatic chuck, that is, the deviation of the center of the wafer cutting workpiece relative to the center of the electrostatic chuck cannot exceed 0.5 mm. However, in the prior art, only the wafer can be calibrated and positioned separately, and the position of the wafer cutting workpiece cannot be calibrated, which seriously affects the yield of the process results. Summary of the invention

[0004] In view of the shortcomings of the existing methods, the present application proposes a semiconductor process equipment and a calibration device to solve the technical problem in the prior art that the position of the wafer cutting workpiece cannot be calibrated and positioned, thereby affecting the yield of the process results.

[0005] In the first aspect, an embodiment of the present application provides a calibration device for a wafer cutting workpiece, wherein a wafer is fixed on one side of the wafer cutting workpiece, and the calibration device comprises: a mounting platform, a driving mechanism and a calibration mechanism; the mounting platform is used to mount the driving mechanism and the calibration mechanism; the driving mechanism comprises a cam and a driver, the cam is located on the top of the mounting platform, and the cam has a plurality of alternately arranged protrusions and recesses; the driver is used to drive the cam to rotate; the calibration mechanism comprises a plurality of movable bearing assemblies, the plurality of movable bearing assemblies are radially distributed along the radial direction of the cam, and are used to jointly carry the wafer cutting workpiece, and the plurality of movable bearing assemblies cooperate with the cam, and are used to selectively and synchronously move away from or approach the cam when the cam rotates, so as to calibrate the position of the wafer cutting workpiece.

[0006] In one embodiment of the present application, the calibration mechanism also includes an installation structure, which includes a center block and multiple branches, and the multiple branches are radially distributed along the radial direction of the center block. The center block is located between the cam and the mounting platform, and is concentrically arranged with the cam. The multiple movable bearing components are slidably arranged on the multiple branches one by one, and the center block is provided with a through hole along its thickness direction, and one end of the driver is connected to the cam through the through hole.

[0007] In one embodiment of the present application, the movable supporting assembly includes a slide rail, a pull rod structure and an elastic component, the pull rod structure is used to carry the wafer cutting workpiece and is slidably set on the branch through the slide rail; one end of the elastic component is fixedly set on the branch, and the other end is connected to the pull rod structure, which is used to provide an elastic force to drive the pull rod structure close to the cam to calibrate the position of the wafer cutting workpiece.

[0008] In one embodiment of the present application, the pull rod structure includes a bearing component, a roller component and a pull rod body, the pull rod body is slidably arranged on the branch through the slide rail, the bearing component and the roller component are respectively arranged at both ends of the pull rod body, and the roller component is used to selectively abut against the convex portion of the cam; the bearing component is used to carry the wafer cutting workpiece, and when the pull rod structure is close to the cam, it engages with the edge of the wafer cutting workpiece, so that the wafer cutting workpiece is subjected to a pre-tightening force toward the cam.

[0009] In one embodiment of the present application, the elastic component includes a fixed block and an elastic component, the fixed block is arranged on the branch and is located between the roller component and the supporting component; the elastic component is arranged along the extension direction of the pull rod body, and one end is connected to the supporting component and the other end is connected to the fixed block.

[0010] In one embodiment of the present application, the supporting component includes a supporting portion and a clamping portion, the supporting portion has a supporting surface for supporting the wafer cutting workpiece, and the clamping portion is protruding from a side of the supporting surface away from the cam, and is used to clamp the edge of the wafer cutting workpiece when the pull rod structure approaches the cam.

[0011] In one embodiment of the present application, the calibration mechanism includes four movable supporting components, and the engaging portions of the four movable supporting components are used to engage with four straight edges of the periphery of the wafer cutting workpiece to calibrate the position of the wafer cutting workpiece.

[0012] In one embodiment of the present application, the calibration device also includes a pin assembly, a plurality of the pin assemblies are inserted into the mounting platform and are evenly distributed along the circumference of the cam; the plurality of the pin assemblies are used to rise when the cam rotates by a first preset angle to support the wafer cutting workpiece, and drive the wafer cutting workpiece to descend and place it on the supporting component at the same time, wherein when the cam rotates by the first preset angle, the roller component abuts against the convex portion of the cam to make the plurality of pull rod structures synchronously move away from the cam; the plurality of the pin assemblies are also used to drive the calibrated wafer cutting workpiece to rise when the cam rotates by a second preset angle, so that the wafer cutting workpiece can be transmitted by a robot, wherein when the cam rotates by the second preset angle, the supporting component is away from the wafer cutting workpiece by a preset distance.

[0013] In one embodiment of the present application, the bearing component has self-lubricating properties, and the preset distance is less than or equal to 0.5 mm.

[0014] In one embodiment of the present application, the ejector assembly includes a telescopic cylinder, a bellows and an ejector, the telescopic cylinder is arranged at the bottom of the mounting platform, and the top of the telescopic cylinder is connected to the bottom of the bellows; the bellows is passed through the mounting hole of the mounting platform, and the top of the bellows is used to install the ejector.

[0015] In one embodiment of the present application, the driving mechanism also includes a mounting frame, a coupling and a transmission shaft, the mounting frame is arranged at a central position at the bottom of the mounting platform, and the driver is arranged at the bottom of the mounting frame; the coupling is arranged in the mounting frame and is connected to the output shaft of the driver; the bottom end of the transmission shaft is connected to the coupling, and the top end passes through the mounting platform and is connected to the cam.

[0016] In the second aspect, an embodiment of the present application provides a semiconductor process equipment, comprising a transfer chamber, a process chamber, a robot and a calibration device as provided in the first aspect, wherein the robot and the calibration device are arranged in the transfer chamber, and the robot is used to transfer the wafer cutting workpiece before calibration to the calibration device, and to transfer the wafer cutting workpiece after calibration to the process chamber.

[0017] The beneficial technical effects brought about by the technical solution provided by the embodiment of the present application are:

[0018] In the embodiment of the present application, a plurality of movable supporting assemblies are arranged on the outer periphery of the cam, and the plurality of movable supporting assemblies are radially distributed along the radial direction of the cam. When the cam rotates by a first preset angle, the convex portion of the cam presses against the movable supporting assemblies, so that the plurality of movable supporting assemblies are synchronously moved away from the cam. At this time, the plurality of movable supporting assemblies can jointly carry the wafer cutting workpiece. When the cam continues to rotate, the plurality of movable supporting assemblies lose the pressing of the convex portion, so that the plurality of movable supporting assemblies can synchronously approach the cam and drive the wafer cutting workpiece to move toward the center of the cam to a concentric state, thereby realizing the calibration of the position of the wafer cutting workpiece, so that when the robot transfers the wafer cutting workpiece into the process chamber, the position of the wafer cutting workpiece and the position of the electrostatic chuck will not be offset, thereby improving the yield of the wafer cutting workpiece.

[0019] Additional aspects and advantages of the present application will be partially given in the following description, which will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0021] Figure 1 A schematic diagram of the structure of a calibration device provided in an embodiment of the present application;

[0022] Figure 2 A partially enlarged structural schematic diagram of a calibration device provided in an embodiment of the present application;

[0023] Figure 3A A schematic diagram of a top view of a calibration device provided in an embodiment of the present application;

[0024] Figure 3B A schematic cross-sectional view of a calibration device provided in an embodiment of the present application;

[0025] Figure 3C A schematic diagram of a partial cross-sectional structure of a calibration device provided in an embodiment of the present application;

[0026] Figure 4A A schematic diagram of a top view of a calibration device in an idle state provided in an embodiment of the present application;

[0027] Figure 4B A schematic cross-sectional structure diagram of a pin assembly of a calibration device provided in an embodiment of the present application carrying a wafer cutting workpiece;

[0028] Figure 4C A schematic cross-sectional structure diagram of a calibration mechanism of a calibration device provided in an embodiment of the present application carrying a wafer cutting workpiece;

[0029] Figure 4D A schematic diagram of a partial cross-sectional structure of a calibration mechanism of a calibration device provided in an embodiment of the present application carrying a wafer cutting workpiece;

[0030] Figure 5 A schematic diagram of a top view of a calibration device in a calibration state provided in an embodiment of the present application;

[0031] Fig. 6A A schematic diagram of a top view of a calibration device in a transmission state provided in an embodiment of the present application;

[0032] Figure 6B A schematic cross-sectional structural diagram of a calibration device in a transmission state provided in an embodiment of the present application;

[0033] Figure 6C A schematic diagram of a partial cross-sectional structure of a calibration device in a transmission state provided in an embodiment of the present application;

[0034] Fig. 7A A schematic structural diagram of a calibration device provided in an embodiment of the present application from another perspective;

[0035] Figure 7B A schematic cross-sectional structure diagram of a calibration device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0036] The present application is described in detail below, and examples of embodiments of the present application are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar components or components with the same or similar functions. In addition, if the detailed description of the known technology is unnecessary for the features of the present application shown, it will be omitted. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be interpreted as limiting the present application.

[0037] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. It should also be understood that terms such as those defined in general dictionaries should be understood to have meanings consistent with those in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as here.

[0038] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments.

[0039] The embodiment of the present application provides a calibration device for a wafer cutting workpiece. A wafer is fixed on one side of the wafer cutting workpiece. The structural schematic diagram of the calibration device is shown in FIG. Figure 1 , Figure 2 , Fig. 7A and Figure 7B As shown, the calibration device includes: a mounting platform 1, a driving mechanism 2 and a calibration mechanism 3; the mounting platform 1 is used to mount the driving mechanism 2 and the calibration mechanism 3; the driving mechanism 2 includes a cam 21 and a driver 22, the cam 21 is located on the top of the mounting platform 1, and the cam 21 has a plurality of alternately arranged protrusions 211 and recesses 212; the driver 22 is used to drive the cam 21 to rotate; the calibration mechanism 3 includes a movable bearing assembly 31, and the plurality of movable bearing assemblies 31 are radially distributed along the radial direction of the cam 21, and are used to jointly carry the wafer cutting workpiece, and the plurality of movable bearing assemblies 31 are all matched with the cam 21, and are used to selectively and synchronously move away from or approach the cam 21 when the cam 21 rotates, so as to calibrate the position of the wafer cutting workpiece.

[0040] like Figure 1 , Figure 2 , Fig. 7A and Figure 7B As shown, the semiconductor process equipment is used to perform a plasma cutting process, for example, but the embodiment of the present application does not limit its specific type, and those skilled in the art can adjust the setting according to actual conditions. The mounting platform 1 can be a rectangular plate-like structure, which is specifically arranged in the transmission chamber of the semiconductor process equipment for installing the drive mechanism 2 and the calibration mechanism 3, but the embodiment of the present application does not limit the specific shape of the mounting platform 1. The drive mechanism 2 is integrally arranged in the center position of the mounting platform 1, and the driver 22 is located at the bottom of the mounting platform 1, and the cam 21 is located at the top of the mounting platform 1. The driver 22 can be a servo motor or a stepper motor, which is used to drive the cam 21 to rotate precisely. The cam 21 has four convex portions 211 and four concave portions 212 in the circumferential direction, and there is a concave portion 212 between any two adjacent convex portions 211, that is, the cam 21 has a plurality of convex portions 211 and concave portions 212 arranged alternately, but the embodiment of the present application does not limit the specific number of the convex portions 211 and the concave portions 212, as long as the number of the convex portions 211 and the concave portions 212 are the same and arranged alternately. The calibration mechanism 3 is arranged on the top of the mounting platform 1, and the calibration mechanism 3 includes four movable bearing components 31, and the four movable bearing components 31 are evenly distributed radially along the radial direction of the cam 21. One end of the movable bearing component 31 is used for cooperating with the protrusion 211 and the recess 212 for transmission; the other end of the movable bearing component 31 cooperates with each other to carry the wafer cutting workpiece. In actual application, the cam 21 is driven by the driver 22 to rotate to a first preset angle, and the four protrusions 211 all press against the movable bearing component 31, so that the multiple movable bearing components 31 are synchronously moved away from the cam 21. At this time, the calibration mechanism 3 is in an idle state, so that the robot arm (not shown in the figure) can transfer the wafer cutting workpiece 100 to the calibration mechanism 3. For details, refer to the following. Figure 3A and Figure 4AAs shown. When the cam 21 continues to rotate under the drive of the driver 22, since the movable bearing assembly 31 loses the abutment of the convex portion 211, the multiple movable bearing assemblies 31 are synchronously close to the cam 21. At this time, the calibration mechanism 3 is in the calibration state, and the multiple movable bearing assemblies 31 simultaneously drive the wafer cutting workpiece 100 to move toward the center of the cam 21 to adjust the position of the wafer cutting workpiece 100 and the cam 21 to a concentric state. For details, refer to Figure 5 As shown, since the four mobile bearing components 31 move simultaneously, the position of the wafer cutting workpiece can be quickly adjusted, so that the robot can transfer the wafer cutting workpiece to the process chamber, thereby preventing the wafer cutting workpiece from being offset from the electrostatic chuck.

[0041] In the embodiment of the present application, a plurality of movable supporting assemblies are arranged on the outer periphery of the cam, and the plurality of movable supporting assemblies are radially distributed along the radial direction of the cam. When the cam rotates by a first preset angle, the convex portion of the cam presses against the movable supporting assemblies, so that the plurality of movable supporting assemblies are synchronously moved away from the cam. At this time, the plurality of movable supporting assemblies can jointly carry the wafer cutting workpiece. When the cam continues to rotate, the plurality of movable supporting assemblies lose the pressing of the convex portion, so that the plurality of movable supporting assemblies can synchronously approach the cam and drive the wafer cutting workpiece to move toward the center of the cam to a concentric state, thereby realizing the calibration of the position of the wafer cutting workpiece, so that when the robot transfers the wafer cutting workpiece into the process chamber, the position of the wafer cutting workpiece and the position of the electrostatic chuck will not be offset, thereby improving the yield of the wafer cutting workpiece.

[0042] It should be noted that the embodiment of the present application does not limit the specific number of the mobile bearing components 31, for example, the number of the mobile bearing components 31 is three or five. Therefore, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the settings according to actual conditions.

[0043] In one embodiment of the present application, Figure 1 , Figure 2 , Fig. 7A and Figure 7B As shown, the calibration mechanism 3 also includes a mounting structure 34, which includes a center block 341 and multiple branches 342. The multiple branches 342 are radially distributed along the radial direction of the center block 341. The center block 341 is located between the cam 21 and the mounting platform 1, and is concentrically arranged with the cam 21. Multiple movable bearing components 31 are slidably arranged on the multiple branches 342 in a one-to-one correspondence. The center block 341 is provided with a through hole along its thickness direction, and one end of the driver 22 is connected to the cam 21 through the through hole.

[0044] like Figure 1 , Figure 2 , Fig. 7A and Figure 7BAs shown, the mounting structure 34 includes an integrally formed center block 341 and four branches 342. The center block 341 is a cylindrical structure, and the four branches 342 are radially distributed along the radial direction of the center block 341, that is, the mounting structure 34 is a "cross" structure as a whole. The mounting structure 34 is arranged on the mounting platform 1 as a whole, and the center block 341 is located between the mounting platform 1 and the cam 21, and is arranged concentrically with the cam 21; the four movable bearing components 31 are respectively arranged on the four branches 342, and can be slidably arranged relative to the branches 342, so that the bearing component 315 can be away from or close to the cam 21. A through hole is also opened in the center position of the center block 341, and the through hole can be arranged coaxially with the cam 21, for the output shaft of the driver 22 to pass through and connect with the cam 21, that is, the center block 341 can be arranged in a circular ring structure. With the above design, since the installation structure 34 is provided, there is a certain distance between the movable supporting assembly 31 and the installation platform 1, which is convenient for coordination with the height of the robot, so as to be applicable to existing semiconductor process equipment, thereby greatly improving the applicability and scope of application.

[0045] It should be noted that the embodiment of the present application does not limit the calibration mechanism 3 to include the mounting structure 34. For example, multiple mobile bearing components 31 can be directly slidably arranged on the mounting platform 1. Therefore, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the settings according to actual conditions.

[0046] In one embodiment of the present application, Figure 1 and Figure 2 As shown, the movable supporting assembly 31 includes a slide rail 311, a pull rod structure 312 and an elastic component 313. The pull rod structure 312 is used to support the wafer cutting workpiece and is slidably set on the branch 342 through the slide rail 311; one end of the elastic component 313 is fixedly set on the branch 342, and the other end is connected to the pull rod structure 312, which is used to provide an elastic force to drive the pull rod structure 312 to approach the cam 21 to calibrate the position of the wafer cutting workpiece.

[0047] like Figure 1 and Figure 2As shown, the movable bearing assembly 31 includes a slide rail 311, a pull rod structure 312 and an elastic component 313. The slide rail 311 is extended along the extension direction of the branch 342, and the cross section of the slide rail 311 is an inverted trapezoidal structure. The pull rod structure 312 is extended along the extension direction of the branch 342, and an inverted trapezoidal groove is provided on the bottom surface of the pull rod structure 312 for sliding with the slide rail 311. One end of the pull rod structure 312 is used for transmission with the protrusion 211 of the cam 21, and the other end is used for carrying the wafer cutting workpiece. When the protrusion 211 of the cam 21 presses against the pull rod structure 312, the pull rod structure 312 moves in a direction away from the cam 21 as a whole. The elastic component 313 is extended along the extension direction of the branch 342, and one end of the elastic component 313 is fixedly connected to the branch 342, and the other end is connected to the pull rod structure 312. When the pull rod structure 312 loses the top force of the protrusion 211, the elastic component 313 can provide an elastic force to drive the pull rod structure 312 to move toward the cam 21, so that the wafer cutting workpiece moves toward the center of the cam 21, so that the wafer cutting workpiece is concentric with the cam 21. The above design allows the embodiment of the present application to adopt a relatively simple structure, that is, the reciprocating motion of the mobile bearing assembly 31 on the branch 342 can be realized, which can not only reduce the application and maintenance costs, but also greatly reduce the failure rate to extend the service life.

[0048] It should be noted that the embodiment of the present application does not limit the specific structure of the slide rail 311 and the pull rod structure 312. For example, a slide groove is provided on the slide rail 311, and the pull rod structure 312 is slidably matched in the slide groove. Therefore, the embodiment of the present application is not limited to this, and those skilled in the art can adjust the settings according to actual conditions.

[0049] In one embodiment of the present application, Figure 1 and Figure 2As shown, the rod structure 312 includes a roller component 314, a bearing component 315 and a rod body 316. The rod body 316 is slidably arranged on the branch 342 through the slide rail 311. The bearing component 315 and the roller component 314 are respectively arranged at both ends of the rod body 316. The roller component 314 is used to selectively abut against the convex portion 211 of the cam 21. The bearing component 315 is used to carry the wafer cutting workpiece and engage the edge of the wafer cutting workpiece when the rod structure 312 is close to the cam 21, so that the wafer cutting workpiece is subjected to a preload force toward the cam 21. Specifically, the rod body 316 is slidably fitted on the branch 342 through the slide rail 311, and the roller component 314 and the bearing component 315 are respectively arranged at both ends of the rod body 316. The end of the pull rod body 316 close to the cam 21 is provided with a bending structure, and the bending structure includes a vertical plate and a horizontal plate, the vertical plate is integrally formed at the end of the pull rod structure 312, and the horizontal plate is integrally formed at the top of the vertical plate. The roller component 314 is arranged at the bottom of the horizontal plate through a mounting shaft, and the outer peripheral surface of the roller component 314 can roll with the outer peripheral surface of the convex portion 211 to reduce the transmission resistance, thereby achieving the improvement of work efficiency while avoiding particle contamination caused by friction between the cam 21 and the pull rod body 316. The bearing component 315 is arranged on the other end of the pull rod body 316, and the bearing component 315 can be used to carry the wafer cutting workpiece, and can clamp the edge of the wafer cutting workpiece, so as to clamp the edge of the wafer cutting workpiece when the pull rod structure 312 is close to the cam 21, so that the wafer cutting workpiece is subjected to a pre-tightening force toward the cam 21, and at the same time moves toward the center of the cam 21 to achieve position calibration. The above design makes the implementation structure of the present application simple, and can improve the efficiency of wafer cutting workpiece calibration while reducing the transmission resistance.

[0050] In one embodiment of the present application, Figure 1 and Figure 2As shown, the elastic component 313 includes a fixed block 3131 and an elastic member 3132. The fixed block 3131 is arranged on the branch 342 and is located between the roller component 314 and the bearing component 315. The elastic member 3132 is arranged along the extension direction of the pull rod body 316, and one end of the elastic member 3132 is connected to the bearing component 315, and the other end is connected to the fixed block 3131. Specifically, the bottom end of the fixed block 3131 is connected to the branch 342, and a clearance gap is opened in the middle position of the bottom of the fixed block 3131 for avoiding the slide rail 311 and the pull rod body 316, so that the pull rod body 316 can reciprocate in the clearance gap. The fixed block 3131 is located between the roller component 314 and the bearing component 315, and is arranged close to the roller component 314. The elastic member 3132 is located between the fixed block 3131 and the bearing component 315, and one end of the elastic member 3132 is connected to the fixed block 3131, and the other end is connected to the bearing component 315. The elastic member 3132 is, for example, a coil spring, so that the pull rod body 316 has a preload force that is always close to the cam 21. The above design makes the embodiment of the present application simple and easy to implement, and can provide a horizontal preload force for the pull rod body 316, thereby greatly reducing the application and maintenance costs.

[0051] In one embodiment of the present application, Figures 1 to 3A As shown, the bearing component 315 includes a supporting portion 3151 and a clamping portion 3152, the supporting portion 3151 has a supporting surface for carrying a wafer cutting workpiece, and the clamping portion 3152 is convexly arranged on the side of the supporting surface away from the cam 21, and is used to clamp the edge of the wafer cutting workpiece when the pull rod structure 312 approaches the cam 21. Specifically, the supporting portion 3151 can adopt a rectangular parallelepiped structure, the supporting portion 3151 is arranged on the pull rod body 316, and the top surface of the supporting portion 3151 is the supporting surface for carrying the wafer cutting workpiece. The clamping portion 3152 can adopt a rod-shaped structure, which can be formed on the supporting surface of the supporting portion 3151 in an integrally formed manner, and the clamping portion 3152 is arranged far from the cam 21, so that the supporting surface of the supporting portion 3151 can be used to carry the wafer cutting workpiece. In actual application, the four supporting parts 3151 are used to support the bottom surface of the wafer cutting workpiece, and the four clamping parts 3152 are used to clamp the four edge positions of the wafer cutting workpiece, and when the four pull rod structures 312 are synchronously close to the cam 21, the four clamping parts 3152 simultaneously clamp the edge positions of the wafer cutting workpiece, thereby realizing the calibration of the wafer cutting workpiece. Further, there is a first spacing L1 between the two oppositely arranged clamping parts 3152, and the value of the first spacing L1 depends on the maximum allowable offset calibration amount. The maximum offset calibration amount is the maximum amount of unidirectional offset of the wafer cutting workpiece. Figure 4AAs shown, when the periphery of the wafer cutting workpiece 100 has four evenly distributed straight edges, the first spacing L1 should be calculated as the width between the straight edges of the wafer cutting workpiece 100 plus twice the maximum offset calibration amount (it may also be offset in the opposite direction). For example, if the maximum offset calibration amount is 5 mm, the first spacing L1 can be 380 mm + 5 mm × 2 = 390 mm, where 380 mm is the width between two symmetrical straight edges of the wafer cutting workpiece 100. When the wafer cutting workpiece 100 exceeds the maximum offset, an alarm can be issued through an alarm mechanism, but the embodiment of the present application does not limit the specific implementation of the alarm mechanism. The above design makes the embodiment of the present application not only simple in structure, but also can be set according to different wafer cutting workpieces 100, thereby greatly improving the applicability and scope of application of the embodiment of the present application.

[0052] It should be noted that the embodiment of the present application does not limit the specific shapes of the support portion 3151 and the engaging portion 3152. For example, the shapes of the support portion 3151 and the engaging portion 3152 can be arc-shaped to be suitable for the circular wafer cutting workpiece 100. Therefore, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the settings according to actual conditions.

[0053] In one embodiment of the present application, Figure 1 , Figure 3A and Figure 4A As shown, the calibration mechanism 3 includes four mobile bearing components 31, and the engaging parts 3152 of the four mobile bearing components 31 are used to engage with the four straight edges of the periphery of the wafer cutting workpiece 100 to calibrate the position of the wafer cutting workpiece 100. Specifically, the four mobile bearing components 31 are evenly distributed radially along the circumferential direction of the cam 21, so that the engaging parts 3152 of the four mobile bearing components 31 can engage with the four straight edges of the periphery of the wafer cutting workpiece 100. When the four mobile bearing components 31 approach the cam 21 synchronously, the four engaging parts 3152 can push the four straight edges of the wafer cutting workpiece 100 to move toward the center of the cam 21 at the same time, thereby realizing the calibration of the wafer cutting workpiece 100. However, the embodiment of the present application does not limit the specific number of the mobile bearing components 31, as long as the number of the mobile bearing components 31 is set corresponding to the number of straight edges of the periphery of the wafer cutting workpiece 100. Therefore, the embodiment of the present application is not limited to this, and those skilled in the art can adjust the settings according to actual conditions.

[0054] In one embodiment of the present application, Figures 1 to 4DAs shown, the calibration device also includes a pin assembly 4, and multiple pin assemblies 4 are inserted into the mounting platform 1 and evenly distributed along the circumference of the cam 21; the multiple pin assemblies 4 are used to rise when the cam 21 is placed at a first preset angle to support the wafer cutting workpiece 100, and drive the wafer cutting workpiece 100 to descend and place it on the supporting component 315 at the same time, wherein when the cam 21 rotates at a first preset angle, the roller component 314 contacts the convex portion 211 of the cam 21, so that the multiple pull rod structures 312 are synchronously moved away from the cam 21; the multiple pin assemblies 4 are also used to drive the calibrated wafer cutting workpiece 100 to rise when the cam 21 rotates at a second preset angle, so that the wafer cutting workpiece 100 can be transmitted by a robot, wherein when the cam 21 rotates at the second preset angle, the supporting component 315 is away from the cam 21 by a preset distance L.

[0055] like Figures 1 to 4D As shown, three ejector assemblies 4 are arranged on the mounting platform 1 and are evenly and spacedly distributed along the circumference of the cam 21, so as to cooperate with each other to support the wafer cutting workpiece 100. Part of the ejector assembly 4 is located at the bottom of the mounting platform 1, and the ejector 43 of the ejector assembly 4 can be located above the mounting platform 1, and the ejector 43 can be raised and lowered relative to the mounting platform 1, so as to contact the bottom surface of the wafer cutting workpiece 100. When the cam 21 rotates to a first preset angle, the roller component 314 contacts the convex portion 211 of the cam 21, so that the multiple pull rod structures 312 are away from the cam 21, that is, the calibration mechanism 3 is in an idle state, and the robot can transfer the wafer cutting workpiece 100 to the calibration mechanism 3. At this time, the ejector 43 of the ejector assembly 4 rises so that there is a second spacing L2 between the top of the ejector 43 and the supporting surface of the supporting portion 3151. The second spacing L2 can be set to be greater than 0 mm and less than 3 mm, so as to cooperate with each other to carry the wafer cutting workpiece 100. For details, refer to FIG. Figure 3C Further, the three ejector pin assemblies 4 can drive the wafer cutting workpiece 100 to descend, so as to drive the wafer cutting workpiece 100 to land on the calibration mechanism 3, so that the wafer cutting workpiece 100 is placed on multiple supporting components 315 at the same time. At this time, there is a third distance L3 between the ejector pin 43 of the ejector pin assembly 4 and the supporting surface of the supporting portion 3151. The third distance L3 can be set to be greater than 0 mm and less than 3 mm. The specific process can be referred to as follows. 4A to 4D It should be noted that the embodiment of the present application does not limit the specific value of the third distance L3, as long as the ejector pin 43 of the ejector pin assembly 4 is lower than the supporting surface of the supporting portion 3151, so the embodiment of the present application is not limited thereto.

[0056] Combined with reference Figures 5 to 6CAs shown, when the cam 21 rotates by the first preset angle and then continues to rotate, since the roller component 314 gradually loses the abutment of the convex portion 211, the roller component 314 can approach the cam 21 and is finally accommodated in the concave portion 212, that is, the multiple bearing components 315 synchronously approach the cam 21. At this time, the calibration mechanism 3 is in a calibration state. Under the action of the multiple bearing components 315, the wafer cutting workpiece 100 and the cam 21 are finally in a concentric state. For details, refer to FIG. Figure 5 When the cam 21 rotates to a second preset angle, the convex portion 211 of the cam 21 can again abut the roller component 314, and the supporting component 315 can be away from the cam 21 by a preset distance L. At this time, the engaging portion 3152 of the supporting component 315 is separated from the straight edge of the wafer cutting workpiece 100, so that the calibration mechanism 3 is in a transmission state, and the ejector pins 43 of the three ejector pin assemblies 4 rise at the same time to drive the calibrated wafer cutting workpiece 100 to rise and separate from the supporting portion 3151, so that it is convenient for the robot to take away the calibrated wafer cutting workpiece 100. For details, refer to FIG. FIG. 6A to FIG. 6C By adopting the above design, the embodiment of the present application can cooperate with the robot to transfer the wafer cutting workpiece 100, so that while realizing the calibration of the wafer cutting workpiece 100, it also realizes the transmission of the calibrated wafer cutting workpiece 100, and there will be no mechanical interference with the robot, thereby improving the ease of use of the embodiment of the present application and reducing the failure rate.

[0057] In one embodiment of the present application, Figures 1 to 6CAs shown, the bearing component 315 has self-lubricating property, and the preset distance L is less than or equal to 0.5 mm. Specifically, the bearing component 315 is made of resin material, so that the supporting surface of the supporting part 3151 has self-lubricating property. When the bearing component 315 is away from the cam 21 by a preset distance L, in the process of the four bearing components 315 being synchronously away from the cam 21, due to the weight of the wafer cutting workpiece 100 itself and the self-lubricating property of the bearing component 315, the position of the wafer cutting workpiece 100 will not be offset, that is, the center of the wafer cutting workpiece 100 still coincides with the center of the cam 21. Further, since the bearing component 315 is away from the cam 21 by a preset distance L, the clamping part 3152 and the straight edge of the wafer cutting workpiece 100 also have a preset distance L. In order to avoid the displacement of the wafer cutting workpiece 100 due to excessive movement distance, the preset distance L can be set to be greater than 0 mm and less than or equal to 0.5 mm. By adopting the above design, the embodiment of the present application can still maintain the concentric arrangement with the cam 21 during the process of transmitting the calibrated wafer cutting workpiece 100, thereby further improving the accuracy of the calibration of the wafer cutting workpiece 100. It should be noted that the embodiment of the present application does not limit the specific material of the bearing component 315, as long as it has the characteristic of self-lubrication relative to the wafer cutting workpiece 100. Therefore, the embodiment of the present application is not limited to this, and those skilled in the art can adjust the setting according to the actual situation.

[0058] In one embodiment of the present application, Figure 1 , Fig. 7A and Figure 7B As shown, the ejector assembly 4 includes a telescopic cylinder 41, a bellows 42 and an ejector 43. The telescopic cylinder 41 is arranged at the bottom of the mounting platform 1, and the top of the telescopic cylinder 41 is connected to the bottom of the bellows 42; the bellows 42 is inserted into the mounting hole of the mounting platform 1, and the top of the bellows 42 is used to install the ejector 43. Specifically, three mounting holes are provided on the mounting platform 1, and three ejector assemblies 4 are respectively inserted into the three mounting holes. The telescopic cylinder 41 is located at the bottom of the mounting platform 1 and is aligned with the mounting holes. The bottom end of the bellows 42 is connected to the top of the telescopic cylinder 41, the bellows 42 is inserted into the mounting hole, and the top end is used to install the ejector 43, and the top end of the ejector 43 can be used to contact and push against the bottom surface of the wafer cutting workpiece 100. The telescopic cylinder 41 is used to drive the ejector 43 to telescope relative to the mounting platform 1, so as to drive the wafer cutting workpiece 100 to rise and fall. The above design makes the structure of the embodiment of the present application simple and easy to implement, thereby greatly reducing the application and maintenance costs of the embodiment of the present application.

[0059] In one embodiment of the present application, Figure 1 , Fig. 7A and Figure 7BAs shown, the driving mechanism 2 also includes a mounting frame 23, a coupling 24 and a transmission shaft 25. The mounting frame 23 is arranged at the bottom center of the mounting platform 1, and the driver 22 is arranged at the bottom of the mounting frame 23; the coupling 24 is arranged in the mounting frame 23 and connected to the output shaft of the driver 22; the bottom end of the transmission shaft 25 is connected to the coupling 24, and the top end passes through the mounting platform 1 and is connected to the cam 21. Specifically, the mounting frame 23 can adopt a hollow cubic structure, the mounting frame 23 is arranged at the bottom center of the mounting platform 1, and the two are fixedly connected by welding or fasteners. The driver 22 can adopt a servo motor or a stepper motor, the driver 22 is arranged at the bottom of the mounting frame 23, and the output shaft of the driver 22 can extend into the mounting frame 23, the coupling 24 is arranged in the mounting frame 23, and its two ends are respectively connected to the output shaft and the transmission shaft 25, and the transmission shaft 25 passes through the mounting platform 1 and is connected to the cam 21. With the above design, the coupling 24 can largely absorb the vibration of the driver 22, thereby improving the accuracy of transmission and further improving the accuracy of calibration.

[0060] In order to further illustrate the implementation methods and beneficial effects of the embodiments of the present application, the following Figures 1 to 7B As shown, a specific implementation of the present application is described as follows.

[0061] When the calibration mechanism 3 is in an idle state, the cam 21 rotates by a first preset angle, as shown in FIG. Figure 3A In the position shown, the convex portion 211 of the cam 21 abuts against the roller component 314, and the elastic component 313 is in a stretched state. The stretching amount can be determined according to the elastic force of the elastic component 3132. The elastic force of the elastic component 3132 can be set to be no less than 5N. The robot can transfer the wafer cutting workpiece 100 to the calibration mechanism 3. The wafer cutting workpiece 100 is pre-placed on a plurality of ejector pin assemblies 4, as shown in FIG. Figure 4A and Figure 4B The ejector pin 43 of the ejector pin assembly 4 descends to drive the wafer cutting workpiece 100 to fall on multiple supporting components 315 at the same time. At this time, there is a third distance L3 between the top of the ejector pin 43 and the supporting surface of the supporting portion 3151 to prevent the ejector pin 43 from colliding and rubbing with the wafer cutting workpiece 100. The third distance L3 can be set to 3 mm. For details, refer to Figure 4C and Figure 4D shown.

[0062] Furthermore, after the driver 22 drives the cam 21 to rotate by the first preset angle, it continues to drive the cam 21 to rotate counterclockwise, and the elastic force of the elastic member 3132 can make the bearing component 315 move toward the center of the cam 21. Since the moving distances of the four bearing components 315 are the same, the center of the wafer cutting workpiece 100 gradually moves toward the center of the cam 21, and the roller component 314 is always in close contact with the outer peripheral surface of the cam 21, so that the movement of the wafer cutting workpiece 100 is relatively stable. For details, refer to Figure 5 When the cam 21 rotates to an angle (less than 45°), the elastic force of the elastic member 3132 gradually decreases due to the gradual decrease in the stretching amount of the elastic member 3132, until all four bearing components 315 clamp the wafer cutting workpiece 100, and make the center of the wafer cutting workpiece 100 coincide with the center of the cam 21. At this time, the elastic force of the elastic member 3132 is reduced to a minimum, but the elastic member 3132 should still be in a stretched state, and the elastic force is not less than 3N to ensure that the wafer cutting workpiece 100 and the cam 21 are in a concentric state. Furthermore, when the driver 22 continues to drive the cam 21 to rotate to 45°, the roller component 314 has completely separated from the convex portion 211 of the cam 21 and is located in the concave portion 212 of the cam 21. Since the elastic member 3132 is still in a stretched state, each supporting component 315 has an elastic force on the wafer cutting workpiece 100 of the same size and directed to the center of the cam 21, so as to ensure that the center of the wafer cutting workpiece 100 is completely coincident with the center of the cam 21, thereby completing the work station calibration of the wafer cutting workpiece 100.

[0063] Finally, the driver 22 drives the cam 21 to rotate a second preset angle, and the four supporting components 315 move away from the cam 21 at the same time, so that there is a preset distance L between the engaging portion 3152 of the supporting component 315 and the straight edge of the wafer cutting workpiece 100. The preset distance L can be set to be greater than or equal to 0 and less than or equal to 0.5 mm. For details, refer to Figure 6B and Figure 6C As shown. At this time, the three ejector pin assemblies 4 simultaneously drive the wafer cutting workpiece 100 to rise, so that the robot can transfer the calibrated wafer cutting workpiece 100 to the electrostatic chuck in the process chamber. It can be seen that the embodiment of the present application realizes the calibration and transmission of the wafer cutting workpiece 100 through a relatively simple structure, thereby avoiding the position deviation of the wafer cutting workpiece 100 and the electrostatic chuck, thereby improving the product yield.

[0064] Based on the same inventive concept, an embodiment of the present application provides a semiconductor process equipment, including: a transfer chamber, a process chamber, a robot and a calibration device as provided in the above embodiments, the robot and the calibration device are both arranged in the transfer chamber, the robot is used to transfer the wafer cutting workpiece before calibration to the calibration device, and to transfer the wafer cutting workpiece after calibration to the process chamber.

[0065] By applying the embodiments of the present application, at least the following beneficial effects can be achieved:

[0066] In the embodiment of the present application, a plurality of movable supporting assemblies are arranged on the outer periphery of the cam, and the plurality of movable supporting assemblies are radially distributed along the radial direction of the cam. When the cam rotates by a first preset angle, the convex portion of the cam presses against the movable supporting assemblies, so that the plurality of movable supporting assemblies are synchronously moved away from the cam. At this time, the plurality of movable supporting assemblies can jointly carry the wafer cutting workpiece. When the cam continues to rotate, the plurality of movable supporting assemblies lose the pressing of the convex portion, so that the plurality of movable supporting assemblies can synchronously approach the cam and drive the wafer cutting workpiece to move toward the center of the cam to a concentric state, thereby realizing the calibration of the position of the wafer cutting workpiece, so that when the robot transfers the wafer cutting workpiece into the process chamber, the position of the wafer cutting workpiece and the position of the electrostatic chuck will not be offset, thereby improving the yield of the wafer cutting workpiece.

[0067] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

[0068] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0069] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0070] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0071] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0072] The above description is only a partial implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A calibration device for a wafer cutting workpiece, wherein a wafer is fixed on one side of the wafer cutting workpiece, characterized in that: The calibration device comprises: a mounting platform, a driving mechanism and a calibration mechanism; The mounting platform is used to mount the driving mechanism and the calibration mechanism; The driving mechanism comprises a cam and a driver, wherein the cam is located at the top of the mounting platform and has a plurality of convex parts and concave parts arranged alternately; the driver is used to drive the cam to rotate, and the driver is located at the bottom of the mounting platform; The calibration mechanism includes a plurality of movable bearing assemblies, which are radially distributed along the radial direction of the cam and are used to jointly bear the wafer cutting workpiece transmitted by the robot. The plurality of movable bearing assemblies cooperate with the cam and are used to selectively and synchronously move away from or approach the cam when the cam rotates, so as to calibrate the position of the wafer cutting workpiece; The calibration mechanism further includes a mounting structure, the mounting structure includes a central block and a plurality of branches, the plurality of branches are radially distributed along the radial direction of the central block, the plurality of mobile bearing assemblies are slidably arranged on the plurality of branches in a one-to-one correspondence, and the mounting structure allows a certain distance between the mobile bearing assembly and the mounting platform, so as to facilitate the height coordination with the manipulator; The calibration device further comprises an ejector pin assembly, wherein a plurality of the ejector pin assemblies are inserted on the mounting platform and evenly distributed along the circumference of the cam, and the ejector pins of the ejector pin assembly rise so that a second distance L2 exists between the top of the ejector pin and the supporting surface of the movable bearing assembly; the three ejector pin assemblies can drive the wafer cutting workpiece to descend, so as to drive the wafer cutting workpiece to land on the calibration mechanism, so that the wafer cutting workpiece is placed on the plurality of movable bearing assemblies at the same time, and at this time, a third distance L3 exists between the ejector pins of the ejector pin assembly and the supporting surface of the movable bearing assembly; The driving mechanism also includes a mounting frame, a coupling and a transmission shaft. The mounting frame is arranged at a central position at the bottom of the mounting platform, and the driver is arranged at the bottom of the mounting frame; the coupling is arranged in the mounting frame and is connected to the output shaft of the driver; the bottom end of the transmission shaft is connected to the coupling, and the top end passes through the mounting platform and is connected to the cam.

2. The calibration device according to claim 1, characterized in that The center block is located between the cam and the mounting platform and is arranged concentrically with the cam. A through hole is opened in the center block along the thickness direction thereof, and one end of the driver passes through the through hole and is connected with the cam.

3. The calibration device according to claim 2, characterized in that The movable supporting assembly includes a slide rail, a pull rod structure and an elastic component, wherein the pull rod structure is used to support the wafer cutting workpiece and is slidably arranged on the branch through the slide rail; one end of the elastic component is fixedly arranged on the branch, and the other end is connected to the pull rod structure, so as to provide an elastic force to drive the pull rod structure close to the cam to calibrate the position of the wafer cutting workpiece.

4. The calibration device according to claim 3, characterized in that The pull rod structure includes a bearing component, a roller component and a pull rod body. The pull rod body is slidably arranged on the branch through the slide rail. The bearing component and the roller component are respectively arranged at both ends of the pull rod body. The roller component is used to selectively abut against the convex portion of the cam. The bearing component is used to carry the wafer cutting workpiece and engage the edge of the wafer cutting workpiece when the pull rod structure is close to the cam, so that the wafer cutting workpiece is subjected to a pre-tightening force toward the cam.

5. The calibration device according to claim 4, characterized in that The elastic component includes a fixed block and an elastic member, wherein the fixed block is arranged on the branch and is located between the roller component and the bearing component; the elastic member is arranged along the extension direction of the pull rod body, and one end is connected to the bearing component and the other end is connected to the fixed block.

6. The calibration device according to claim 4, characterized in that The supporting component includes a supporting portion and a clamping portion, the supporting portion has a supporting surface for supporting the wafer cutting workpiece, and the clamping portion is protruding from a side of the supporting surface away from the cam, and is used to clamp the edge of the wafer cutting workpiece when the pull rod structure approaches the cam.

7. The calibration device according to claim 6, characterized in that The calibration mechanism includes four movable bearing components, and the engaging parts of the four movable bearing components are used to engage with four straight edges of the periphery of the wafer cutting workpiece to calibrate the position of the wafer cutting workpiece.

8. The calibration device according to claim 4, characterized in that The plurality of ejector pin assemblies are used to rise when the cam rotates by a first preset angle to support the wafer cutting workpiece, and drive the wafer cutting workpiece to descend and place it on the carrying component at the same time, wherein when the cam rotates by the first preset angle, the roller component abuts against the convex portion of the cam to make the plurality of pull rod structures synchronously move away from the cam; The plurality of ejector pin assemblies are also used to drive the calibrated wafer cutting workpiece to rise when the cam rotates a second preset angle, so that the wafer cutting workpiece can be transferred by a robot, wherein when the cam rotates a second preset angle, the supporting component is away from the wafer cutting workpiece by a preset distance.

9. The calibration device according to claim 8, characterized in that The bearing component has self-lubricating properties, and the preset distance is less than or equal to 0.5 mm.

10. The calibration device according to claim 8, characterized in that The ejector assembly includes a telescopic cylinder, a bellows and an ejector. The telescopic cylinder is arranged at the bottom of the mounting platform, and the top of the telescopic cylinder is connected to the bottom of the bellows; the bellows is inserted into the mounting hole of the mounting platform, and the top of the bellows is used to install the ejector.

11. A semiconductor process equipment, characterized in that: It comprises a transfer chamber, a process chamber, a robot and a calibration device as described in any one of claims 1 to 10, wherein the robot and the calibration device are arranged in the transfer chamber, and the robot is used to transfer the wafer cutting workpiece before calibration to the calibration device, and to transfer the wafer cutting workpiece after calibration to the process chamber.

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