Device and method for preparing large-size solder balls through pre-quantitative collaborative spheroidizing treatment

Through the pre-determined co-spherical treatment device, the shredding and spherification cooling steps are used to solve the problems of slow spherification speed and poor quality of finished products in the preparation of large-size spherical balls, and the uniform and efficient production of large-size spherical balls is achieved. .

CN119304426AActive Publication Date: 2025-01-14YUNNAN TIN IND TIN MATERIAL CO LTD
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Patent Information

Application Number
CN202411816951.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-01-14
Estimated Expiration
2044-12-11

AI Technical Summary

Technical Problem

It is difficult to effectively prepare large-sized tin balls in the prior art, and the traditional methods have shortcomings in production efficiency and finished product quality, especially the roundness and dimensional uniformity of the tin balls are difficult to ensure.

Method used

The device adopts a predetermined amount of collaborative spheroidization treatment, including a shredding feed assembly and a spheroidization cooling assembly, through the two steps of shredding and spheroidization cooling, the surface tension and cooling process of the molding liquid can be used to achieve rapid spheroidization of the hot balls. and set, prepare large-size hot balls with diameters of 1.0mm~3.0mm.

Benefits of technology

It has achieved the improvement of the size uniformity and roundness of the solder balls, high production efficiency, flexible adjustment to meet the needs of multiple specifications, and solved the problems of slow spherical speed and easy deformation of large-sized solder balls.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a device and a method for preparing large-size solder balls through cooperation of preset quantity and spheroidizing treatment. The device comprises a shredding and feeding assembly, a spheroidizing and cooling assembly located below the shredding assembly and a control system. According to the method, the tin wire is quantitatively cut off through the wire cutting and feeding assembly and then conveyed to the spheroidizing and cooling assembly, and after the tin wire is completely molten in the spheroidizing and cooling assembly, the tin ball with the diameter larger than 1.0 mm-3. 0 mm is formed. The size of the solder balls can be quantitatively controlled through shredding, and the large-size solder balls which are uniform in size and good in roundness are produced. According to the principle that tin liquid rapidly shrinks into balls under the action of surface tension in forming liquid, preparation of large-size tin balls can be achieved. The solder ball preparation device is ingenious in design, easy to operate and capable of being flexibly adjusted according to needs, large-size solder balls of multiple specifications can be produced, and the production efficiency is high.
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Description

Technical Field

[0001] The invention relates to the technical field of solder ball preparation for welding, and in particular to a device for preparing large-size solder balls and a solder ball preparation method thereof. Background Art

[0002] With the development of the new energy vehicle industry and the expansion of the smart car field, large-sized solder balls are required for welding during the packaging of automotive chips, which brings challenges and opportunities to the traditional preparation methods of BGA solder balls. At present, the specifications of BGA solder balls on the market are mainly concentrated in the range of 0.1-1.5mm, and the main preparation process is the droplet injection method. The molten tin liquid is broken under pressure to produce a metal jet, and the flow rate is controlled to keep the jet in a laminar state. It is broken into uniform metal droplets under the action of mechanical vibration of a certain frequency, and the dispersed droplets fall to liquid nitrogen for cooling and shaping under the action of electrostatic protection. Under the action of liquid nitrogen cooling, the buoyancy and surface tension of the small solder ball in the medium can buffer the gravity of the solder ball itself, so as to ensure that the solder ball can be cooled and shaped during the free fall process. The process is simple, the process conditions are easy to control, and the solder ball products are uniform in size and have high precision. However, due to the relatively long time for the spheroidization of large-particle tin droplets, and the problem of larger-sized solder balls being crushed under the action of their own gravity, the excessive increase in liquid nitrogen cooling space will also increase costs.

[0003] In addition, conventional preparation methods include atomization and wire cutting and remelting. The atomization method is to use centrifugal force to break the liquid metal, and the formed droplets fall into the cooling medium for solidification, and finally form tiny particles. The atomization method has high production efficiency, but the product size fluctuation range of this method is relatively wide, and the finished product yield is low, which is not conducive to process expansion production. The wire cutting and remelting method is to put the quantitatively treated solder material into the heating tube. During the free fall process in the heating tube, the solder material is heated and re-melted in the preheating section, spheroidized in the spheroidizing section, and shaped in the cooling section to obtain tin balls. The tin balls are then cleaned and screened to obtain qualified products. The advantage of this method is that it can controllably produce tin balls of different specifications, and the equipment is relatively simple. Many previous studies have shown that the tin balls prepared by this method have good roundness. However, it is also only suitable for the production of tin balls with smaller specifications. If it is used to produce tin balls with larger specifications, the length of the heating tube needs to be very long to allow the tin balls to have enough time to spheroidize and cool and shape, and the process control is complex, and the fallen tin balls are also easy to deform, so it is difficult to use this method to prepare large-sized tin balls.

[0004] The roundness of solder balls is an important criterion for measuring solder ball quality. Neither the droplet jet method nor the wire cutting and remelting method is suitable for producing large-sized solder balls. Therefore, solving the problems of long melting time, slow spheroidization speed, slow cooling and forming, and easy deformation of large-sized solder balls in order to achieve the preparation of large-sized solder balls is an urgent problem to be solved. Summary of the invention

[0005] In view of the problems existing in the prior art, the purpose of the present invention is to provide a device for preparing solder balls by accurately quantifying the size of solder balls and preparing a predetermined amount of larger-sized solder balls through coordinated spheroidization treatment, as well as a method for preparing larger-sized solder balls by the device, so as to provide reliable support for the production of solder balls of more specifications.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions.

[0007] A device for preparing large-sized solder balls by a predetermined amount of coordinated spheroidization treatment, comprising a wire cutting feed component (14), a spheroidization cooling component located below the wire cutting component, and a control system; The wire cutting feed assembly (14) comprises a base (1401), a wire winding roller mounting frame (1402) mounted on the base and arranged in sequence from the rear to the front, a transmission shaft mounting frame (1403), a movable perforated plate (1408) and a cutter slide rail (1413) horizontally mounted on the upper rear side of the perforated plate, a cutter mechanism that can reciprocate along the cutter slide rail, and a fixed shaft mounting frame (1406); a group of wire winding rollers (1404) are sequentially mounted on the horizontal cross arm of the wire winding roller mounting frame; a pressure strip (1405) that can be adjusted to move up and down and a transmission shaft (1407) located below the pressure strip are horizontally mounted on the transmission shaft mounting frame; tin wire perforations (1414) are evenly distributed in the horizontal direction on the tin wire perforated plate (1408); a moving mechanism is arranged on both sides of the base, and the bottom ends of both sides of the perforated plate are mounted on the moving mechanism and can reciprocate along the longitudinal direction of the base; The cutter mechanism comprises a slider seat (1409) mounted on the cutter slide rail (1413) and capable of reciprocating along the cutter slide rail, a cutting blade (1411) fixedly mounted on the slider seat, and a blade driving motor (1412); An upper fixed shaft (1415) and a lower fixed shaft (1416) are horizontally mounted on the fixed shaft mounting frame, and the fixed shaft controller (1418) is arranged on one side of the base for controlling the upper and lower fixed shafts to move up and down; a tin wire sensor (1417) is arranged on the perforated plate (1408) and the fixed shaft mounting frame, respectively; a group of conveyor belts (1421) corresponding to the tin wire perforations (1414) are arranged at intervals in front of the perforated plate on the base, a group of tin wire delivery holes (1422) connected to the ends of the conveyor belts are arranged at intervals at the front end of the base, a tin wire delivery pipe (1423) connected to the tin wire delivery holes is connected to the bottom surface of the base, and a conveyor belt controller (1420) for controlling the operation of the conveyor belt (1421) is arranged on one side of the base; The spheroidizing cooling assembly comprises a pot body (1), an upper cover (2) arranged on the top of the pot body, a pot body heating sleeve (3) arranged outside the pot body, a first thermocouple (4) arranged in the pot body and a tin ball forming plate (11), a forming tube (5) located below the pot body and connected to the pot body, a cooling sleeve (7) arranged outside the forming tube, a second thermocouple (6) arranged in the forming tube, and a ball valve (8) arranged at the bottom end of the forming tube; the tin ball forming plate (11) comprises two adjacent groove plates (1101) with semicircular grooves on the upper surface, the outer sides of the two groove plates are hinged to the inner wall of the pot body through hinges (1102), and the inner sides of the two groove plates are hinged to the hanger; the hanger is two symmetrically arranged connecting rods (1103), the top ends of the two connecting rods are hinged together and externally connected to a height adjuster (15), the lower ends of the two connecting rods are respectively hinged to the middle of the inner sides of the two groove plates, and a mounting frame is arranged above the hanger for mounting a fixed roller (1101). 104), the chain is passed through a fixed roller, and the other end of the chain is connected to a wire winding disc (15a) provided in a height adjuster. The wire winding disc is controlled to rotate forward or reversely through a height adjuster controller (12), and the hanger is pulled up or down, thereby controlling the opening and closing of the two slot plates; the pot body and the molding tube are filled with molding liquid that covers the solder ball molding plate; the lower end of the delivery tube (1423) extends into the pot body; after the upper cover (2) is opened, the solder wire falling from the delivery tube enters the pot body The body falls on the groove plate (1101), the tin wire is completely melted on the molding plate in the molding liquid to form a tin ball, a section of the tin wire forms a tin ball, the groove plate carrying the tin ball drives the height adjuster to press down under the control of the height adjuster controller, the groove plate is rotated downward along the hinge (1101) connected to the inner wall of the pot body to open, the tin ball falls into the molding tube (5), gradually cools down in the process of falling along the molding tube, and finally sinks to the bottom of the molding tube, to obtain a tin ball with a diameter of 1.0 mm to 3.0 mm; The control system comprises a first temperature controller (9) connected to a first thermocouple (4), a second temperature controller (10) connected to a second thermocouple (6), a height adjuster controller (12) for controlling the height of a solder ball forming plate (11), a control switch connected to a fixed axis controller (1418), a control switch of a conveying axis motor (1407e), a control switch of a blade driving motor (1411), a control switch of a pressure strip electric push rod mechanism (1407d), a control switch of a top electric push rod mechanism (1424) and a control switch of a bottom electric push rod mechanism (1425); the first temperature controller (9), the second temperature controller (10), the height adjuster controller (12) and all the control switches are arranged in a control box.

[0008] Furthermore, a vertical long hole is opened on the conveying shaft mounting frame (1403), and a conveying shaft mounting seat (1407b) and a pressure strip adjustment rod (1407a) fixed on the conveying shaft mounting seat are installed in the long hole, and the upper end of the pressure strip adjustment rod is fixed to the top of the vertical hole; the pressure strip has a pressure strip sleeve (1417c) at both ends, and the pressure strip sleeve is sleeved on the pressure strip adjustment rod and can slide up and down; a pressure strip electric push rod mechanism (1407d) is installed at the top of the long hole, and the piston rod of the electric push rod mechanism faces downward and is connected to the pressure strip (1405), and the pressure strip electric push rod mechanism is controlled by the control system to press down or lift up; the two ends of the conveying shaft are installed in the conveying shaft mounting seat, and the conveying shaft motor (1407e) that drives the conveying shaft to rotate is installed on the conveying shaft mounting frame, and the output shaft of the conveying shaft motor is connected to the conveying shaft.

[0009] Furthermore, a vertical long hole is opened on the fixed shaft mounting frame (1406), and a vertical upright pole (1419) is arranged in the long hole. The two ends of the upper fixed shaft (1415) are respectively provided with an upper fixed shaft sleeve (1415a), and the two ends of the lower fixed shaft (1416) are also respectively provided with a lower fixed shaft sleeve (1416a). The upper fixed shaft sleeve and the lower fixed shaft sleeve are sleeved on the upright pole and can slide up and down. Electric push rods are symmetrically installed at the top and bottom of the long hole. The piston rod of the top electric push rod mechanism (1424) faces downward and is connected to the upper fixed shaft, and the piston rod of the bottom electric push rod mechanism (1425) faces upward and is connected to the lower fixed shaft. The top electric push rod mechanism and the bottom electric push rod mechanism are controlled by the controller (1418) to push out or retract in the opposite direction, so that the upper fixed shaft and the lower fixed shaft move towards each other or move in the opposite direction to loosen.

[0010] Furthermore, the moving mechanism is a guide rail mechanism or a nut sub-mechanism (1410) symmetrically installed on both sides of the base and located between the transmission shaft mounting frame (1403) and the fixed shaft mounting frame (1406); when the guide rail mechanism is adopted, the guide rails are installed on both sides of the base, and sliders are installed on the guide rails. The left and right ends of the perforated plate (1408) are provided with feet, and the feet are installed on the sliders. The movement of the perforated plate is realized by the reciprocating movement of the sliders; when the nut sub-mechanism is adopted, the screw rods equipped with nuts are installed on both sides of the base, and the feet of the perforated plate are installed on the nuts. The nuts are driven to move by the rotation of the screw rods, thereby realizing the movement of the perforated plate.

[0011] Furthermore, the pot body (1) is a square-mouthed pot body, and the shredding feeding components are symmetrically arranged on both sides above the pot body.

[0012] Furthermore, the pot body (1) of the spheroidizing cooling assembly is externally connected to a liquid level controller (13) for controlling the liquid level of the molding liquid in the pot body via a pipeline, and the liquid level controller is connected to a molding liquid storage tank (16) via a pipeline.

[0013] Furthermore, a bottom box (17) is provided below the forming tube (5) of the spheroidizing cooling assembly, and a discharge port (18) with a valve is provided at the bottom end of the bottom box.

[0014] The method for preparing solder balls using the device for preparing large-sized solder balls by using a predetermined amount of coordinated spheroidization treatment according to the present invention is as follows: 1) Wire cutting: according to the size of the solder ball to be produced, the required length of the solder wire is calculated, and the distance between the cutting blade (1411) and the upper fixed shaft (1415) and the lower fixed shaft (1416) is pre-adjusted. Then, the solder wire head of the wire winding roller (1404) is pulled out and inserted between the transmission shaft (1407) and the pressure bar (1405). The pressure bar is pressed down by the pressure bar electric push rod mechanism (1407d) to clamp the solder wire between the transmission shaft and the pressure bar. Then, the transmission shaft motor (1407e) is started. Driven by the transmission shaft, the solder wire moves forward to the front end and is inserted between the upper fixed shaft and the lower fixed shaft. The solder wire sensor (1417) detects that the solder wire has been inserted into the upper fixed shaft. After the upper and lower fixed shafts are positioned between each other, the control system starts the fixed shaft controller (1418) to control the upper and lower fixed shafts to move closer together to clamp the tin wire. Subsequently, the blade drive motor (1412) starts to drive the cutting blade (1411) to move forward along the cutting blade running track while rotating at high speed to cut the tin wire. After the cutting is completed, the fixed shaft controller transmits a signal to control the upper and lower fixed shafts to release, and the cut tin wire falls onto the conveyor belt (1421). The conveyor belt controller (1420) controls the conveyor belt to start, and the cut tin wire is conveyed to the tin wire conveying hole (1422) and falls into the pot body 1 of the subsequent spheroidizing component through the tin wire conveying pipe (1423); 2) Spheroidizing cooling: the tin wire on the conveyor belt (1421) falls from the tin wire conveying pipe (1423) into the pot body (5) and falls on the groove plate (1101), and is heated by the pot body heating sleeve (3) to maintain the molding liquid temperature in the pot body not lower than 350°C, and the molding plate heating temperature is controlled at 230~330°C, and the tin wire spheroidizing time is controlled at 3~15S. After the tin wire is completely melted on the groove plate (1101) in the molding liquid, a tin ball with a diameter greater than 1.5mm is formed and falls into the semicircular groove (1101a), and a section of the tin wire forms a tin ball; press the height adjuster controller (12), The connecting rod (1103) is pressed down by the height adjuster (15), driving the slot plate to rotate downward along the hinge (1102) connected to the inner wall of the pot body and open, and the solder ball rolls down along the semicircular groove into the forming tube (5); circulating cooling water is injected into the cooling sleeve (7) to control the temperature in the forming tube at 30-150°C, and the solder ball gradually cools and takes shape while falling along the forming tube, and finally settles at the bottom of the forming tube; after the formed solder ball slides down, the height adjuster controller is pressed again, and the solder ball forming plate is lifted up by the height adjuster, driving the slot plate to return to a horizontal state, waiting to receive the next batch of falling solder wires.

[0015] Further, the ball valve (8) at the bottom end of the forming tube is opened to send the cooled solder balls into the bottom box (17). When the amount of solder balls in the bottom box reaches a certain amount, the valve of the discharge port (18) is opened to discharge the solder balls, clean and sieve them, and obtain qualified large-sized solder ball products.

[0016] Furthermore, the molding liquid is one or more of peanut oil, castor oil, and glycerin.

[0017] Compared with the prior art, the present invention has the following beneficial effects: The present invention can quantitatively control the size of the solder balls by cutting wires, and produce large-sized solder balls with uniform size and good roundness. The principle that the tin liquid quickly shrinks into a ball under the action of surface tension in the molding liquid can be used to prepare large-sized BGA solder balls with a diameter of 1.5 to 3 mm. The liquid solder ball falls in the molding liquid and gradually cools and shapes, which can effectively alleviate the problem of the mutual influence between the need for rapid shaping of the spherical shape and the slow crystallization of the metal, and improve the surface quality of the solder ball. The solder ball preparation device of the present invention is cleverly designed, easy to operate, and can be flexibly adjusted according to needs to produce large-sized solder balls of multiple specifications with high production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic elevation view of a device for preparing large-sized solder balls by a predetermined amount of coordinated spheroidization treatment according to the present invention; Figure 2 It is a schematic diagram of the shredded feeding assembly of the device of the present invention; Figure 3 A schematic diagram of an embodiment of a conveying shaft adjustment mechanism in a shredded material feeding assembly of the device of the present invention; Figure 4 yes Figure 3 AA section view; Figure 5 It is a schematic diagram of the installation of the cutting blade in the shredded feed assembly of the device of the present invention; Figure 6 It is a schematic diagram of an embodiment in which an upper fixed shaft and a lower fixed shaft in a shredded material feeding assembly of the device of the present invention are installed on a fixed shaft mounting frame; Figure 7 for Figure 6 BB cross-sectional view; Figure 8 A schematic top view of a slot plate of a solder ball forming plate of the device of the present invention; Fig. 9 It is a schematic elevation view of the slot plate of the solder ball forming plate flipping and tilting downward and its control mechanism; Fig.10 It is a schematic elevation diagram of the slot plate reset state of the solder ball forming plate and its control mechanism; Fig.11This is a scanning image of the solder ball prepared in Example 1 of the present invention; Fig.12 This is a scan of the solder ball prepared in Example 2 of the present invention; Fig.13 This is a scanning image of the solder ball prepared in Example 3 of the present invention; Fig.14 This is a scanning image of the solder ball prepared in Example 4 of the present invention.

[0019] In the figure, 1 is a pot body, 2 is an upper cover, 3 is a pot body heating sleeve, 4 is a first thermocouple, 5 is a forming tube, 6 is a second thermocouple, 7 is a cooling sleeve, 8 is a ball valve, 9 is a first temperature controller, 10 is a second temperature controller, 11 is a tin ball forming plate, 1101 is a groove plate, 1101a is a semicircular groove, 1102 is a hinge, 1103 is a connecting rod, 1104 is a fixed roller, 1105 is a chain, 12 is a height adjuster controller, 13 is a liquid level controller, 14 is a wire cutting feed assembly, 1401 is a base, 1402 is a wire winding roller mounting frame, 1403 is a transmission shaft mounting frame, 1404 is a wire winding roller, 1405 is a pressure strip, 1406 is a fixed shaft mounting frame, 1407 is a transmission shaft, 1407a is a pressure strip adjustment rod, 1407b is a transmission shaft mounting seat, and 1407c is a pressure strip sleeve Cylinder, 1407d is the pressure strip electric push rod mechanism, 1407e is the transmission shaft motor, 1408 is the perforated plate, 1409 is the slider seat, 1410 is the nut sub-mechanism, 1411 is the cutting blade, 1412 is the blade drive motor, 1413 is the cutter slide rail, 1414 is the tin wire perforation, 1415 is the upper fixed shaft, 1415a is the upper fixed shaft sleeve, 1416a is the lower fixed shaft sleeve, 1417 is the tin wire sensor, 1418 is the fixed shaft controller, 1419 is the vertical rod, 1420 is the conveyor belt controller, 1421 is the conveyor belt, 1422 is the tin wire delivery hole, 1423 is the tin wire delivery pipe, 1424 is the top electric push rod mechanism, 1425 is the bottom electric push rod mechanism, 15 is the height adjuster, the wire winding disk 15a, 16 is the molding liquid storage tank, 17 is the bottom box, and 18 is the discharge port. DETAILED DESCRIPTION

[0020] The technical solution of the present invention will be clearly and completely described below in conjunction with the drawings and embodiments. The described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. The protection scope of the present invention is not limited to the embodiments. All equivalent technical replacements based on the scope of the claims of the present invention belong to the protection scope of the present invention.

[0021] like Figure 1 As shown, the device for preparing large-sized solder balls by predetermined amount coordinated spheroidization treatment of the present invention includes a wire cutting feeding component 14, a spheroidizing cooling component located below the wire cutting component, and a control system.

[0022] The shredded feed assembly is as follows Figure 2 As shown, it includes a base 1401, a winding roller mounting frame 1402 mounted on the base and arranged in sequence from the rear to the front, a transmission shaft mounting frame 1403, a movable perforated plate 1408, a cutter slide rail 1413 horizontally mounted on the upper rear side of the perforated plate, a cutter mechanism that can reciprocate along the cutter slide rail, and a fixed shaft mounting frame 1406. A group of winding rollers 1404 ( Figure 2 Two winding rollers are schematically drawn in the figure), and the tin wire is unwound on the winding rollers. A pressure strip 1405 that can be adjusted to move up and down and a conveying shaft 1407 located below the pressure strip are horizontally mounted on the conveying shaft mounting frame. A row of tin wire perforations 1414 are evenly distributed in the horizontal direction on the perforated plate 1408. Moving mechanisms 1410 are arranged on both sides of the base, and the bottom ends of both sides of the perforated plate are mounted on the moving mechanisms, so that the perforated plate can move back and forth along the longitudinal direction of the base.

[0023] The adjusting mechanism for adjusting the pressure strip 1405 to move up and down can adopt various adjusting mechanisms commonly used in the prior art. The structure adopted in this embodiment is as follows: Figure 2 , Figure 3 , Figure 4 As shown, a vertical long hole is opened on the conveying shaft mounting frame 1403, and a conveying shaft mounting seat 1407b and a pressure strip adjustment rod 1407a fixed on the conveying shaft mounting seat are installed in the long hole, and the upper end of the pressure strip adjustment rod is fixed to the top of the vertical hole. The pressure strip is provided with a pressure strip sleeve 1417c at both ends respectively, and the pressure strip sleeve is mounted on the pressure strip adjustment rod 1407a and can slide up and down. A pressure strip electric push rod mechanism 1407d is installed at the top of the long hole, and the piston rod of the electric push rod mechanism faces downward and is connected to the pressure strip 1405. The pressure strip electric push rod mechanism is controlled by the control system to press down or lift up. The two ends of the conveying shaft are installed in the conveying shaft mounting seat, and the conveying shaft motor 1407e that drives the conveying shaft to rotate is installed on the conveying shaft mounting frame. The output shaft of the conveying shaft motor is connected to the conveying shaft. As shown Figure 5 As shown, the cutter mechanism includes a slider seat 1409 mounted on the cutter slide rail 1413 and capable of reciprocating along the cutter slide rail, a disc-shaped cutting blade 1411 fixedly mounted on the slider seat, and a blade driving motor 1412. When the control system controls the slider seat to move, the blade driving motor drives the cutting blade 1411 to rotate to cut the tin wire.

[0024] A guide rail mechanism or a nut sub-mechanism 1410 is symmetrically arranged on both sides of the base between the transmission shaft mounting frame 1403 and the fixed shaft mounting frame 1406. When a guide rail mechanism is adopted, guide rails are installed on both sides of the base, and sliders are installed on the guide rails. The left and right ends of the perforated plate 1408 are provided with feet, which are installed on the sliders, and the movement of the perforated plate is realized by the reciprocating movement of the sliders. The guide rail mechanism can be purchased from existing technology products on the market. When a nut sub-mechanism is adopted, a screw rod equipped with a nut is installed on both sides of the base, and the foot of the perforated plate 1408 is installed on the nut, and the nut is driven to move by the rotation of the screw rod, thereby realizing the movement of the perforated plate. The nut sub-mechanism can be purchased from existing technology products on the market.

[0025] An upper fixed shaft 1415 and a lower fixed shaft 1416 are horizontally mounted on the fixed shaft mounting frame 1406, and the upper and lower fixed shafts 1415 and the lower fixed shafts 1416 are adjacent to each other and can be adjusted in height. A fixed shaft controller 1418 for controlling the upper and lower fixed shafts to move up and down is arranged on one side of the base. Tin wire sensors 1417 are respectively arranged on the perforated plate 1408 and the fixed shaft mounting frame. A group of conveyor belts 1421 corresponding to the tin wire perforations 1414 are arranged at intervals in front of the perforated plate on the base, a group of tin wire delivery holes 1422 that are connected to the ends of the conveyor belts are arranged at intervals at the front end of the base, and a tin wire delivery pipe 1423 that is connected to the tin wire delivery holes is connected to the bottom surface of the base, and a conveyor belt controller 1420 that controls the operation of the conveyor belt 1421 is arranged on one side of the base. After the tin wire on the winding roller 1404 is unwound, it passes through the pressure strip 1405 and the conveying shaft 1407 and is clamped. The conveying shaft rotates to send the tin wire through the tin wire perforation 1414 and then inserts it between the upper fixed shaft 1415 and the lower fixed shaft 1416. The cutting length of the tin wire is preset, and the distance between the cutting blade and the fixed shaft is adjusted. After the tin wire sensor 1417 detects that the tin wire has been inserted between the upper fixed shaft and the lower fixed shaft, the fixed shaft controller 1418 controls the upper fixed shaft and the lower fixed shaft to move closer to clamp the tin wire, and the cutting blade is started, and it moves forward along the cutting blade running track and rotates at high speed to cut the tin wire. After the cutting is completed, the fixed shaft controller 1418 sends a signal to control the upper fixed shaft and the lower fixed shaft to loosen, and the cut tin wire falls onto the conveyor belt 1421. The conveyor belt starts, and the cut tin wire is conveyed to the tin wire conveying hole 1422 and falls into the pot body 1 of the subsequent spheroidizing component through the tin wire conveying pipe 1423. Each set of wire cutting feed assembly can be equipped with multiple wire winding rollers, and multiple tin wire perforations are set on the perforated plate, so that multiple tin wires can be cut at one time. In this embodiment, 6 wire cutting perforations are set. Commonly used tin wire alloy components are SnAg3Cu0.5 or SnAg1Cu0.5 or Sn63Cu37.

[0026] The upper fixed shaft 1415 and the lower fixed shaft 1416 are controlled by the fixed shaft controller 1418 to move toward each other or move in the opposite direction to loosen, which can be achieved by using the existing technical mechanism. Figure 6 , Figure 7As shown, a vertical long hole is provided on the fixed shaft mounting frame 1406, and a vertical upright pole 1419 is provided in the long hole. The two ends of the upper fixed shaft 1415 are respectively provided with an upper fixed shaft sleeve 1415a, and the two ends of the lower fixed shaft 1416 are also respectively provided with a lower fixed shaft sleeve 1416a. The upper fixed shaft sleeve and the lower fixed shaft sleeve are sleeved on the upright pole and can slide up and down. Electric push rods are symmetrically installed at the top and bottom of the long hole. The piston rod of the top electric push rod mechanism 1424 faces downward and is connected to the upper fixed shaft, and the piston rod of the bottom electric push rod mechanism 1425 faces upward and is connected to the lower fixed shaft. The top electric push rod mechanism and the bottom electric push rod mechanism are controlled by the fixed shaft controller 1418 to push out or retract in the opposite direction, so that the upper fixed shaft 1415 and the lower fixed shaft 1416 move toward each other or move in the opposite direction to release.

[0027] The spheroidizing cooling assembly includes a pot body 1, an upper cover 2 disposed on the top of the pot body, a pot body heating jacket 3 disposed outside the pot body, a first thermocouple 4 disposed inside the pot body and a solder ball forming plate 11, a forming tube 5 located below the pot body and connected to the pot body, a cooling jacket 7 disposed outside the lower section of the forming tube, a second thermocouple 6 disposed inside the forming tube, and a ball valve 8 disposed at the bottom end of the forming tube. The solder ball forming plate 11 is as shown in FIG. Figure 1 , Figure 8 , Fig. 9 , Fig.10 As shown, it includes two adjacent slot plates 1101 with a group of semicircular grooves on the upper surface. The outer sides of the two slot plates are hinged to the inner wall of the pot body through hinges 1102, and the inner sides of the two slot plates are hinged to the hanger. The hanger is two symmetrically arranged connecting rods 1103. The lower ends of the two connecting rods are respectively hinged to the middle of the inner sides of the two slot plates. The top ends of the two connecting rods 1103 are hinged together and connected to the chain 1105. A mounting frame is provided above the hanger for installing a fixed roller 1104. The chain spans the fixed roller. The other end of the chain is connected to the wire winding disk 15a provided in the height adjuster 15. The height adjuster controller 12 controls the forward or reverse rotation of the wire winding disk to pull the hanger up or down, thereby controlling the opening and closing of the two slot plates. Tighten the chain to close the slot plate, and loosen the chain to flip the slot plate down to open. The upper surface of the slot plate has multiple parallel semicircular grooves, Figure 8Six semicircular grooves 1101a are shown. The pot body and the molding tube are filled with molding liquid that covers the tin ball molding plate. The molding liquid is one or more of peanut oil, castor oil, and glycerin. The lower end of the tin wire delivery tube 1423 extends into the pot body. After opening the upper cover 2, the tin wire falling from the delivery tube enters the pot body and falls on the slot plate 1101. The tin wire is completely melted on the molding plate in the molding liquid to form a tin ball. A section of tin wire forms a tin ball. Press the height adjuster controller 12 to control the wire winding disk 15a in the height adjuster 15 to rotate, and press down the connecting rod 1103 to drive the slot plate 1101 to rotate downward along the hinge 1102 connected to the inner wall of the pot body to open, as shown in FIG. Fig. 9 As shown, the solder ball falls into the forming tube 5, gradually cools down during the falling process along the forming tube, and finally sinks to the bottom of the forming tube. After that, the wire winding disc 15a in the height adjuster 15 is controlled to rotate in the opposite direction, and the connecting rod 1103 is pulled up to drive the slot plate 1101 to rotate upward and reset along the hinge 1102 connected to the inner wall of the pot body, as shown in FIG. Fig.10 As shown, it receives the tin wire that falls again.

[0028] The control system includes a first temperature controller 9 connected to the first thermocouple 1, a second temperature controller 10 connected to the second thermocouple 6, a height adjuster controller 12 for controlling the height of the solder ball forming plate 11, a control switch connected to the fixed axis controller 1418, a control switch of the conveying axis motor 1409, a control switch of the blade driving motor 1412, a control switch of the cam electric push rod 1407d, and control switches of the top electric push rod mechanism 1424 and the bottom electric push rod mechanism 1425. The first temperature controller 9, the second temperature controller 10, the height adjuster controller 12 and all the control switches are arranged in the control box.

[0029] As a preferred configuration, the pot body 1 adopts a square-mouthed pot body, so that two sets of shredding feeding components can be symmetrically arranged on both sides above the pot body to improve production efficiency.

[0030] In order to ensure a stable production state and ensure that the tin wire is always submerged in the molding liquid after falling into the pot body, a liquid level controller 13 for controlling the liquid level of the molding liquid in the pot body is connected to the pot body 1 through a pipeline, and the liquid level controller is connected to the molding liquid storage tank 16 through a pipeline.

[0031] A bottom box 17 may be arranged below the forming tube 5 of the spheroidizing cooling assembly, and a discharge port 18 with a valve is arranged at the bottom end of the bottom box.

[0032] The method for preparing solder balls using the device for preparing large-size solder balls by using a predetermined amount of coordinated spheroidization treatment according to the present invention is as follows: 1) Wire cutting: according to the size of the solder ball to be produced, calculate the required length of the solder wire, pre-adjust the distance between the cutting blade 1411 and the upper fixed shaft and the lower fixed shaft, then pull out the solder wire head of the wire winding roller 1404 and insert it between the conveying shaft 1407 and the pressure bar 1405, press the pressure bar down through the pressure bar electric push rod mechanism 1407d, and clamp the solder wire between the conveying shaft and the pressure bar; then start the conveying shaft motor 1407e, and driven by the conveying shaft 1407, the solder wire moves forward to the front end and is inserted between the upper fixed shaft 1415 and the lower fixed shaft 1416, and the solder wire sensor 1417 detects the solder wire. After being inserted between the upper fixed shaft and the lower fixed shaft, the control system starts the fixed shaft controller 1418, controls the upper fixed shaft and the lower fixed shaft to move closer to clamp the tin wire, and then the blade drive motor 1412 starts, driving the cutting blade 1411 to move forward along the cutting knife running track while rotating at high speed to cut the tin wire. After the cutting is completed, the fixed shaft controller 1418 transmits a signal to control the upper fixed shaft and the lower fixed shaft to loosen, and the cut tin wire falls onto the conveyor belt 1421. The conveyor belt starts to transport the cut tin wire to the tin wire delivery hole 1422 and fall into the pot body 1 of the subsequent spheroidizing component through the tin wire delivery pipe 1423.

[0033] 2) Spheroidization cooling: The tin wire on the conveyor belt 1421 falls from the tin wire conveying pipe 1423 into the pot body 1 and falls on the slot plate. It is heated to 230-330°C by the pot body heating sleeve 3, so that the tin wire is melted and spheroidized in the molding liquid. The tin wire spheroidization time is controlled to be 3-15S, and the molding liquid temperature in the pot body is kept not lower than 350°C. After the tin wire is completely melted on the tin ball molding plate 11 in the molding liquid, it forms a tin ball and falls into the semicircular groove 1101a. Press the height adjuster controller 12, and press the connecting rod 1103 through the height adjuster 15, driving the slot plate 1101 to rotate downward along the hinge 1102 connected to the inner wall of the pot body to open, as shown in FIG. Figure 8 As shown, the solder ball rolls down into the forming tube 5 along the semicircular groove in the direction of the arrow in the figure. Circulating cooling water is injected into the cooling jacket 7 to control the temperature in the forming tube at 30-150°C. The solder ball gradually forms and cools while falling along the forming tube, and finally settles at the bottom of the forming tube. After the formed solder ball slides down, the height adjuster controller 12 is pressed again, and the connecting rod 1103 is lifted up through the height adjuster 15, driving the slot plate 1101 to return to a horizontal state, waiting to receive the next batch of falling solder wires.

[0034] 3) Open the ball valve 8 at the bottom of the forming tube to send the cooled solder balls into the bottom box 17. When the amount of solder balls in the bottom box reaches a certain amount, open the valve of the discharge port 18 to discharge the solder balls, clean and sieve them to obtain qualified large-sized solder ball products. Example 1

[0035] First, close the ball valve 8, and adjust the solder ball forming plate 11 to the working height and close it by operating the height regulator controller 12. Peanut oil is used as the forming liquid, and the liquid level controller 13 is opened. The peanut oil immerses the solder ball forming plate about 1 cm high. The temperature of the solder ball forming liquid is set to 280~320℃, and the temperature of the forming transition section below the solder ball forming plate (the length of the forming tube above the cooling sleeve 7) is controlled at 40~100℃, and the cooling temperature at the bottom of the forming tube is room temperature. The target solder ball product is SnAg3Cu0.5φ2.6mm solder ball, which is cut and remelted with 1mm solder wire. The shear length is calculated by the formula, which is L=(2R1^3) / (3R2^2), where R1 is the diameter of the solder ball, R2 is the diameter of the solder wire, and L is the cutting length). The shear length is 11.72mm. Set the cutting parameters to start the wire cutting feeding assembly. The cut tin wire falls along the tin wire conveying pipe to the tin ball forming plate. The tin wire is completely melted and formed on the tin ball forming plate. After 5 seconds, the height adjuster controller 12 adjusts the height adjuster 15, loosens the connecting rod 1103, and the inner side of the tin ball forming plate tilts downward, so that the formed tin balls slowly fall from the transition section of the forming tube to the bottom of the forming tube to cool and form. Repeat the above operations to continuously prepare tin balls. The liquid level controller monitors the liquid level in the pot in real time. When the liquid level is lower than the set height, the forming liquid in the spare forming liquid storage tank 16 is replenished into the pot in time through the pipeline. After some tin balls accumulate at the bottom of the forming tube 5, stop heating and feeding, open the ball valve 8, and put the tin balls into the bottom box 17. Then close the ball valve 8 and repeat the above production. When the tin balls in the bottom box are stored to a certain amount, open the outlet valve of the bottom box to release the tin balls. After washing, drying and screening, qualified products are obtained. The obtained tin ball products are sampled and scanned, and the scanning results are shown in Fig.11 , the sphericity is intact. 10 samples were randomly selected to measure the diameter of the solder balls. The measurement results are shown in Table 1. The diameter error of each ball in the sample is within the range of 0.04~0.16mm, which is a small error. Example 2

[0036] The steps for preparing solder balls in this embodiment are the same as those in embodiment 1, except that the temperature of the solder ball forming liquid is set at 280-320°C, the temperature of the forming transition section is controlled at 40-60°C, the target solder ball product is SnAg1Cu0.5φ2mm solder ball, and 1mm solder wire is cut and remelted, and the shear length of the solder wire is 5.33mm. The solder ball is completely melted and formed on the solder ball forming plate. After 3 seconds, the height adjuster controller 12 adjusts the height adjuster 15, loosens the connecting rod 1103, and places the formed solder ball into the forming tube. The solder ball product sample obtained in this embodiment is scanned, and the scanning results are shown in FIG. Fig.12 10 solder balls were randomly sampled and their diameters were measured and are shown in Table 1. Example 3

[0037] The steps for preparing solder balls in this embodiment are the same as those in Embodiment 1, with the difference that castor oil is used as the molding liquid, the temperature of the solder ball molding liquid is set to 260~300°C, and the temperature of the molding transition section is controlled at 60~100°C. The target solder ball product is a SnAg3Cu0.5φ2.6mm solder ball, which is cut and remelted using a 1mm tin wire, and the shear length of the tin wire is 11.72mm. After the solder ball is formed on the solder ball molding plate for 3 seconds, the height regulator controller 12 adjusts the height regulator 15, loosens the connecting rod 1103, and places the molded solder ball into the molding tube, and the cooling temperature is room temperature. The solder ball product obtained in this embodiment was sampled and scanned, and the scanning results are shown in FIG. Fig.13 10 solder balls were randomly sampled and their diameters were measured and are shown in Table 1. Example 4

[0038] The steps for preparing solder balls in this embodiment are the same as those in Embodiment 1, except that glycerol is used as the molding liquid, the temperature of the solder ball molding liquid is set to 230~260°C, and the temperature of the molding transition section is controlled at 40~60°C. The target solder ball product is a Sn63Cu37φ2.2mm solder ball, which is cut and remelted using a 1mm tin wire, and the shear length of the tin wire is 7.10mm. After the solder ball is completely formed on the molding plate for 15 seconds, the height adjuster controller 12 adjusts the height adjuster 15, loosens the connecting rod 1103, and places the molded solder ball into the molding tube. The solder ball product obtained in this embodiment is sampled and scanned, and the scanning results are shown in Fig.14 10 solder balls were randomly sampled and their diameters were measured and are shown in Table 1.

[0039] Table 1 Statistical analysis of solder ball size (unit: mm)

[0040]

[0041] Although the present invention has been described in detail above by general description and specific implementation methods, it is obvious to those skilled in the art that some modifications or improvements can be made based on the present invention. Therefore, all other embodiments obtained without creative work are within the scope of protection of the present invention.

Claims

1. A device for preparing large-size solder balls by spheroidizing with a predetermined amount, characterized in that: The device comprises a shredding feeding assembly (14), a spheroidizing cooling assembly located below the shredding assembly, and a control system; The wire cutting feed assembly (14) comprises a base (1401), a wire winding roller mounting frame (1402) mounted on the base and arranged in sequence from the rear to the front, a transmission shaft mounting frame (1403), a movable perforated plate (1408) and a cutter slide rail (1413) horizontally mounted on the upper rear side of the perforated plate, a cutter mechanism that can reciprocate along the cutter slide rail, and a fixed shaft mounting frame (1406); a group of wire winding rollers (1404) are sequentially mounted on the horizontal cross arm of the wire winding roller mounting frame; a pressure strip (1405) that can be adjusted to move up and down and a transmission shaft (1407) located below the pressure strip are horizontally mounted on the transmission shaft mounting frame; tin wire perforations (1414) are evenly distributed in the horizontal direction on the tin wire perforated plate (1408); a moving mechanism is arranged on both sides of the base, and the bottom ends of both sides of the perforated plate are mounted on the moving mechanism and can reciprocate along the longitudinal direction of the base; The cutter mechanism comprises a slider seat (1409) mounted on the cutter slide rail (1413) and capable of reciprocating along the cutter slide rail, a cutting blade (1411) fixedly mounted on the slider seat, and a blade driving motor (1412); An upper fixed shaft (1415) and a lower fixed shaft (1416) are horizontally mounted on the fixed shaft mounting frame, and the fixed shaft controller (1418) is arranged on one side of the base for controlling the upper and lower fixed shafts to move up and down; a tin wire sensor (1417) is arranged on the perforated plate (1408) and the fixed shaft mounting frame, respectively; a group of conveyor belts (1421) corresponding to the tin wire perforations (1414) are arranged at intervals in front of the perforated plate on the base, a group of tin wire delivery holes (1422) connected to the ends of the conveyor belts are arranged at intervals at the front end of the base, a tin wire delivery pipe (1423) connected to the tin wire delivery holes is connected to the bottom surface of the base, and a conveyor belt controller (1420) for controlling the operation of the conveyor belt (1421) is arranged on one side of the base; The spheroidizing cooling assembly comprises a pot body (1), an upper cover (2) arranged on the top of the pot body, a pot body heating sleeve (3) arranged outside the pot body, a first thermocouple (4) arranged in the pot body and a tin ball forming plate (11), a forming tube (5) located below the pot body and connected to the pot body, a cooling sleeve (7) arranged outside the forming tube, a second thermocouple (6) arranged in the forming tube, and a ball valve (8) arranged at the bottom end of the forming tube; the tin ball forming plate (11) comprises two adjacent groove plates (1101) with semicircular grooves on the upper surface, the outer sides of the two groove plates are hinged to the inner wall of the pot body through hinges (1102), and the inner sides of the two groove plates are hinged to the hanger; the hanger is two symmetrically arranged connecting rods (1103), the top ends of the two connecting rods are hinged together and externally connected to a height adjuster (15), the lower ends of the two connecting rods are respectively hinged to the middle of the inner sides of the two groove plates, and a mounting frame is arranged above the hanger for mounting a fixed roller (1101). 104), the chain is passed through a fixed roller, and the other end of the chain is connected to a wire winding disc (15a) provided in a height adjuster. The wire winding disc is controlled to rotate forward or reversely through a height adjuster controller (12), and the hanger is pulled up or down, thereby controlling the opening and closing of the two slot plates; the pot body and the molding tube are filled with molding liquid that covers the solder ball molding plate; the lower end of the delivery tube (1423) extends into the pot body; after the upper cover (2) is opened, the solder wire falling from the delivery tube enters the pot body The body falls on the groove plate (1101), the tin wire is completely melted on the molding plate in the molding liquid to form a tin ball, a section of the tin wire forms a tin ball, the groove plate carrying the tin ball drives the height adjuster to press down under the control of the height adjuster controller, the groove plate is rotated downward along the hinge (1101) connected to the inner wall of the pot body to open, the tin ball falls into the molding tube (5), gradually cools down in the process of falling along the molding tube, and finally sinks to the bottom of the molding tube, to obtain a tin ball with a diameter of 1.0 mm to 3.0 mm; The control system comprises a first temperature controller (9) connected to a first thermocouple (4), a second temperature controller (10) connected to a second thermocouple (6), a height adjuster controller (12) for controlling the height of a solder ball forming plate (11), a control switch connected to a fixed axis controller (1418), a control switch of a conveying axis motor (1407e), a control switch of a blade driving motor (1411), a control switch of a pressure strip electric push rod mechanism (1407d), a control switch of a top electric push rod mechanism (1424) and a control switch of a bottom electric push rod mechanism (1425); the first temperature controller (9), the second temperature controller (10), the height adjuster controller (12) and all the control switches are arranged in a control box.

2. The device for preparing large-sized solder balls by predetermined amount coordinated spheroidization treatment according to claim 1, characterized in that: A vertical long hole is opened on the conveying shaft mounting frame (1403), and a conveying shaft mounting seat (1407b) and a pressure strip adjustment rod (1407a) fixed on the conveying shaft mounting seat are installed in the long hole, and the upper end of the pressure strip adjustment rod is fixed to the top of the vertical hole; the pressure strip has pressure strip sleeves (1417c) at both ends, and the pressure strip sleeves are sleeved on the pressure strip adjustment rod and can slide up and down; a pressure strip electric push rod mechanism (1407d) is installed at the top of the long hole, and the piston rod of the electric push rod mechanism faces downward and is connected to the pressure strip (1405), and the pressure strip electric push rod mechanism is controlled by the control system to press down or lift up; the two ends of the conveying shaft are installed in the conveying shaft mounting seat, and the conveying shaft motor (1407e) that drives the conveying shaft to rotate is installed on the conveying shaft mounting frame, and the output shaft of the conveying shaft motor is connected to the conveying shaft.

3. The device for preparing large-size solder balls by predetermined amount coordinated spheroidization treatment according to claim 1, characterized in that: A vertical long hole is opened on the fixed shaft mounting frame (1406), and a vertical upright pole (1419) is arranged in the long hole. The two ends of the upper fixed shaft (1415) are respectively provided with an upper fixed shaft sleeve (1415a), and the two ends of the lower fixed shaft (1416) are also respectively provided with a lower fixed shaft sleeve (1416a). The upper fixed shaft sleeve and the lower fixed shaft sleeve are sleeved on the upright pole and can slide up and down. Electric push rods are symmetrically installed at the top and bottom of the long hole. The piston rod of the top electric push rod mechanism (1424) faces downward and is connected to the upper fixed shaft, and the piston rod of the bottom electric push rod mechanism (1425) faces upward and is connected to the lower fixed shaft. The top electric push rod mechanism and the bottom electric push rod mechanism are controlled by the controller (1418) to push out or retract in the opposite direction, so that the upper fixed shaft and the lower fixed shaft move towards each other to get closer or move in the opposite direction to loosen.

4. The device for preparing large-size solder balls by predetermined amount coordinated spheroidization treatment according to claim 1, characterized in that: The moving mechanism is a guide rail mechanism or a nut sub-mechanism (1410) symmetrically installed on both sides of the base and located between the transmission shaft mounting frame (1403) and the fixed shaft mounting frame (1406); when the guide rail mechanism is adopted, the guide rails are installed on both sides of the base, and sliders are installed on the guide rails. The left and right ends of the perforated plate (1408) are provided with feet, and the feet are installed on the sliders. The movement of the perforated plate is realized by the reciprocating movement of the sliders; when the nut sub-mechanism is adopted, the screw rods equipped with nuts are installed on both sides of the base, and the feet of the perforated plate are installed on the nuts. The nuts are driven to move by the rotation of the screw rods, thereby realizing the movement of the perforated plate.

5. A device for preparing large-size solder balls by predetermined amount coordinated spheroidization treatment according to claim 1, 2, 3 or 4, characterized in that: The pot body (1) is a square-mouthed pot body, and the shredding feeding components are symmetrically arranged on both sides above the pot body.

6. A device for preparing large-size solder balls by predetermined amount coordinated spheroidization treatment according to claim 1, 2, 3 or 4, characterized in that: The pot body (1) of the spheroidizing cooling assembly is externally connected to a liquid level controller (13) for controlling the liquid level of the molding liquid in the pot body through a pipeline, and the liquid level controller is connected to a molding liquid storage tank (16) through a pipeline.

7. The device for preparing large-sized solder balls by predetermined amount coordinated spheroidization treatment according to claim 1, 2, 3 or 4, characterized in that: A bottom box (17) is arranged below the forming tube (5) of the spheroidizing cooling assembly, and a discharge port (18) with a valve is arranged at the bottom end of the bottom box.

8. A method for preparing solder balls using a device for preparing large-size solder balls by a predetermined amount of coordinated spheroidization treatment as described in any one of claims 1 to 7, characterized in that: Here’s how: 1) Wire cutting: according to the size of the solder ball to be produced, the required length of the solder wire is calculated, and the distance between the cutting blade (1411) and the upper fixed shaft (1415) and the lower fixed shaft (1416) is pre-adjusted. Then, the solder wire head of the wire winding roller (1404) is pulled out and inserted between the transmission shaft (1407) and the pressure bar (1405). The pressure bar is pressed down by the pressure bar electric push rod mechanism (1407d) to clamp the solder wire between the transmission shaft and the pressure bar. Then, the transmission shaft motor (1407e) is started. Driven by the transmission shaft, the solder wire moves forward to the front end and is inserted between the upper fixed shaft and the lower fixed shaft. The solder wire sensor (1417) detects that the solder wire has been inserted into the upper fixed shaft. After the upper and lower fixed shafts are positioned between each other, the control system starts the fixed shaft controller (1418) to control the upper and lower fixed shafts to move closer together to clamp the tin wire. Subsequently, the blade drive motor (1412) starts to drive the cutting blade (1411) to move forward along the cutting blade running track while rotating at high speed to cut the tin wire. After the cutting is completed, the fixed shaft controller transmits a signal to control the upper and lower fixed shafts to release, and the cut tin wire falls onto the conveyor belt (1421). The conveyor belt controller (1420) controls the conveyor belt to start, and the cut tin wire is conveyed to the tin wire conveying hole (1422) and falls into the pot body 1 of the subsequent spheroidizing component through the tin wire conveying pipe (1423); 2) Spheroidizing cooling: the tin wire on the conveyor belt (1421) falls from the tin wire conveying pipe (1423) into the pot body (5) and falls on the groove plate (1101), and is heated by the pot body heating sleeve (3) to maintain the molding liquid temperature in the pot body not lower than 350°C, and the molding plate heating temperature is controlled at 230~330°C, and the tin wire spheroidizing time is controlled at 3~15S. After the tin wire is completely melted on the groove plate (1101) in the molding liquid, a tin ball with a diameter greater than 1.5mm is formed and falls into the semicircular groove (1101a), and a section of the tin wire forms a tin ball; press the height adjuster controller (12), The connecting rod (1103) is pressed down by the height adjuster (15), driving the slot plate to rotate downward along the hinge (1102) connected to the inner wall of the pot body and open, and the solder ball rolls down along the semicircular groove into the forming tube (5); circulating cooling water is injected into the cooling sleeve (7) to control the temperature in the forming tube at 30-150°C, and the solder ball gradually cools and takes shape while falling along the forming tube, and finally settles at the bottom of the forming tube; after the formed solder ball slides down, the height adjuster controller is pressed again, and the solder ball forming plate is lifted up by the height adjuster, driving the slot plate to return to a horizontal state, waiting to receive the next batch of falling solder wires.

9. The method according to claim 8, characterized in that The ball valve (8) at the bottom of the forming tube is opened to send the cooled solder balls into the bottom box (17). When the amount of solder balls in the bottom box reaches a certain amount, the valve of the discharge port (18) is opened to discharge the solder balls, clean and sieve them, and obtain qualified large-sized solder ball products.

10. The method according to claim 8 or 9, characterized in that: The molding liquid is one or more of peanut oil, castor oil and glycerin.

Citation Information

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