Liquid cooling heat dissipation structure of booster motor controller inductor

Abstract

The invention relates to a liquid cooling heat dissipation structure of a boost motor controller inductor, which comprises a boost motor controller shell, an inductance device and a cooling water channel matched with the inductance device are arranged in the shell, and the inductance device comprises an inductance device shell, an inductance coil, an inductance framework, a heat conduction gasket and a magnetic core; the inductance coil and the matched magnetic core are located in the inductance framework, and the inductance framework is arranged in an inner cavity formed by the shell. The shell comprises an upper shell and a lower shell, and the heat conduction gasket is located between the inductance coil and the lower shell. Compared with the prior art, the LED lamp has good heat dissipation performance.

Description

Technical Field

[0001] The invention relates to the field of boost motor controllers, and in particular to a liquid cooling and heat dissipation structure of an inductor of a boost motor controller. Background Art

[0002] Boost circuits are commonly used in new energy vehicle motor controllers. They are a type of DC-DC power converter whose main function is to convert low-voltage DC signals into high-voltage DC signals. Inductors play a key role in smoothing current, storing energy, and improving circuit efficiency in boost circuits. As the power density of boost inductors increases, the high-temperature resistance of inductors is tested. Under different operating ambient temperatures, the inductance value, loss, and material properties of the inductor coil will change. Rising temperature will increase the resistance of the inductor, reduce the inductance value, increase the loss, and may even affect the magnetic permeability of the magnetic core. Therefore, temperature control of the inductor is critical to ensuring its stability and reliability.

[0003] However, with the demand for miniaturization and lightweight inductors, heat dissipation has become increasingly difficult. When assembling the inductor structure, the inductor device is installed first, and then the inductor device is evacuated to ensure that the inside of the inductor device is in a vacuum state, and then the potting compound is filled into the inductor device. However, the internal gap of the inductor is too small, and the potting compound cannot be filled completely, resulting in a vacuum area and a lack of heat transfer path, which affects the heat dissipation performance. Summary of the invention

[0004] The purpose of the present invention is to provide a liquid cooling heat dissipation structure for the inductor of a boost motor controller in order to overcome the defect of poor heat dissipation capability caused by incomplete coverage of the potting glue in the above-mentioned prior art.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] A liquid cooling heat dissipation structure for an inductor of a boost motor controller, wherein an inductor device and a cooling water channel matching the installation position of the inductor device are arranged inside a shell of the boost motor controller, and the inductor device comprises an inductor device shell, an inductor coil, an inductor skeleton, a thermally conductive gasket and a magnetic core; the inductor coil and the matching magnetic core are located in the inductor skeleton, and the inductor skeleton is placed in an inner cavity formed by the shell of the inductor device; the thermally conductive gasket is located between the inductor coil and the shell of the inductor device on a side close to the cooling water channel.

[0007] As a preferred technical solution, the inductor device also includes an input busbar and an output busbar, and the inductor device housing includes an upper housing and a lower housing; the outer surface of the lower housing is coupled to the cooling water channel, and the thermal conductive gasket is arranged between the inductor coil and the lower housing; the upper housing is a plastic housing, and the input busbar and the output busbar are overlapped on the surface of the upper housing, and the input busbar and the output busbar are connected to the inductor coil.

[0008] As a preferred technical solution, a heat dissipation fin matching the cooling water channel is provided on the side of the lower housing facing the boost motor controller housing.

[0009] As a preferred technical solution, the heat dissipation fins and the lower housing of the inductor are integrally formed by die-casting.

[0010] As a preferred technical solution, the lower shell is an aluminum shell.

[0011] As a preferred technical solution, the lower housing and the boost motor controller housing are connected by welding.

[0012] As a preferred technical solution, potting glue is filled between the housing of the inductor device and the built-in components, and between the components.

[0013] As a preferred technical solution, magnetic core gaskets are provided between the magnetic cores.

[0014] As a preferred technical solution, the magnetic core gasket is a gasket made of high thermal conductivity non-magnetic material.

[0015] As a preferred technical solution, the inductor skeleton is a hollow structure.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] The present invention arranges a thermally conductive gasket between the inductor coil and the housing of the inductor device on the side close to the cooling water channel. The thermally conductive gasket overcomes the difficulty of lacking a heat transfer path due to the inability of the potting glue to completely fill the vacuum gap inside the inductor. The thermally conductive gasket increases the heat dissipation area of ​​the inductor, improves the overall heat dissipation efficiency of the inductor device, and ensures the stability of the boost motor controller in a high temperature environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the boost motor controller of the present invention;

[0019] Figure 2 It is a cross-sectional schematic diagram of the boost motor controller structure of the present invention;

[0020] Figure 33a is a schematic diagram of the external structure of the upper shell of the inductor device, and (3b) is a schematic diagram of the external structure of the lower shell of the inductor device;

[0021] Figure 4 Schematic diagram of the internal structure of the inductor device of the present invention; (4a) is a schematic diagram of the overall internal structure, and (4b) is a schematic diagram of the magnetic core structure;

[0022] Figure 5 Boost circuit diagram in an embodiment of the present invention.

[0023] Reference numerals:

[0024] 1-boost motor controller housing, 2-water inlet, 3-water outlet, 4-input end busbar, 5-output end busbar, 6-potting glue, 7-upper housing, 8-lower housing, 9-heat sink fins, 10-inductor coil, 11-inductor skeleton, 12-thermal conductive pad, 13-magnetic core, 14-magnetic core pad. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0026] Unless otherwise defined, the technical terms or scientific terms involved in this application should be understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "a", "a", "the" and the like involved in this application do not indicate a quantitative limitation, and may represent the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in this application are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships, for example, "A and / or B" can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects before and after are in an "or" relationship. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0027] A liquid cooling heat dissipation structure of a boost motor controller inductor, the overall structure diagram is as follows Figure 1 As shown, the cross-sectional diagram is Figure 2 As shown, it includes a boost motor controller housing 1, inside of which an inductor device and a cooling water channel matching the installation position of the inductor device are arranged, and a water inlet 2 and a water outlet 3 are arranged on both sides thereof.

[0028] The schematic diagram of the inductor device is shown in Figure 3 The above-mentioned structure comprises an upper shell 7 as shown in FIG. (3a) and a lower shell 8 as shown in FIG. (3b), and the upper and lower shells are connected by bolts.

[0029] The input busbar 4 and output busbar 5 of the inductor are overlapped on the surface of the upper shell 7 of the inductor device, and the input and output busbars are connected to the inductor coil 10. The upper shell 7 is a plastic product, which not only ensures insulation but also reduces the overall weight of the boost motor controller; the lower shell 8 is directly welded on the boost motor controller shell 1 and coupled with the cooling water channel and is provided with heat dissipation fins 9 matching the cooling water channel, and the lower shell 8 is an aluminum product to improve the heat dissipation performance of the inductor device. The heat dissipation fins 9 are integrally formed by die casting with the lower shell 8 of the inductor, and the shape of the heat dissipation fins 9 can be customized according to actual conditions. In this embodiment, the heat dissipation fins 9 are U-shaped and folded back at the inductor, which plays a role in smoothing the flow speed and reducing the pressure drop.

[0030] The inductor device includes an inductor coil 10, a hollow inductor skeleton 11, a thermally conductive pad 12 and a magnetic core 13, and a potting compound 6 is filled between the inductor device housing and the built-in components and between the components. The internal structure is as follows: Figure 4 As shown, Figure (4a) is a schematic diagram of the overall internal structure, and Figure (4b) is a schematic diagram of the magnetic core structure.

[0031] It can be seen that the inductor coil 10 and the matching magnetic core 13 are located in the hollow inductor skeleton 11, the inductor skeleton 11 is placed in the inner cavity formed by the outer shell of the inductor device, and the thermal conductive gasket 12 is located between the inductor coil 10 and the lower outer shell 8; due to the presence of a small vacuum gap inside the inductor, the potting glue 6 cannot be completely filled, and the gap between the magnetic core 13 and the inductor skeleton 11 makes it impossible for the heat of the magnetic core 13 to be dissipated through the skeleton. The internal magnetic core heat can only be conducted to the large magnetic cores at both ends through the magnetic core gasket 14, and the heat dissipation efficiency is poor. Therefore, a magnetic core gasket 14 of high thermal conductivity non-magnetic material is provided between the magnetic cores 13, which is not only used to form an air gap between the magnetic cores 13 but also to transfer heat between the magnetic cores 13.

[0032] When the boost motor controller follows Figure 5 When the Boost circuit shown in the figure is working, the inductor 10 and the magnetic core 13 will generate heat, wherein the heat generated by the inductor 10 is dissipated through two ways. First, the heat is transferred to the outside of the inductor 10 through the potting glue 6 in the inductor device, and second, the heat is transferred to the aluminum shell through the thermal conductive gasket 12 between the inductor 10 and the lower shell 8 of the inductor device, and the heat is dissipated outward through the heat dissipation fins 9 on the aluminum shell that are in direct contact with the cooling water. As shown in FIG. (4b), the large magnetic cores on the left and right sides dissipate heat outward through the potting glue 6, and the magnetic core in the middle uses the magnetic core gasket 14 to conduct the heat through the large magnetic cores on both sides to the potting glue 6 for heat dissipation. In order to meet the temperature limit requirements of the inductor device, high thermal conductivity non-magnetic materials such as aluminum nitride and silicon carbide are selected instead of common plastics as the material of the magnetic core gasket 14.

[0033] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A liquid cooling heat dissipation structure for an inductor of a boost motor controller, characterized in that: An inductor device and a cooling water channel matching the installation position of the inductor device are arranged inside the boost motor controller housing (1), wherein the inductor device comprises an inductor device housing, an inductor coil (10), an inductor skeleton (11), a thermally conductive pad (12) and a magnetic core (13); The inductor coil (10) and the matching magnetic core (13) are located in an inductor frame (11), and the inductor frame (11) is placed in an inner cavity formed by a housing of the inductor device; The thermally conductive pad (12) is located between the inductor coil (10) and the inductor device housing on the side close to the cooling water channel.

2. The liquid cooling heat dissipation structure of the boost motor controller inductor according to claim 1, characterized in that: The inductor device further comprises an input end busbar (4) and an output end busbar (5), and the housing of the inductor device comprises an upper housing (7) and a lower housing (8); The outer surface of the lower housing (8) is coupled to the cooling water channel, and the thermal conductive pad (12) is arranged between the inductor coil (10) and the lower housing (8); The upper shell (7) is a plastic shell, and an input end busbar (4) and an output end busbar (5) are overlapped on the surface of the upper shell (7), and the input end busbar (4) and the output end busbar (5) are connected to the inductor coil (10).

3. The liquid cooling heat dissipation structure of the boost motor controller inductor according to claim 2, characterized in that: A heat dissipation fin (9) matching the cooling water channel is provided on one side of the lower housing (8) facing the boost motor controller housing (1).

4. The liquid cooling heat dissipation structure of the boost motor controller inductor according to claim 3, characterized in that: The heat dissipation fins (9) and the inductor lower housing (8) are integrally formed by die-casting.

5. The liquid cooling heat dissipation structure of the boost motor controller inductor according to claim 3, characterized in that: The lower shell (8) is an aluminum shell.

6. The liquid cooling heat dissipation structure of the boost motor controller inductor according to claim 5, characterized in that: The lower housing (8) is connected to the boost motor controller housing (1) by welding.

7. The liquid cooling heat dissipation structure of the boost motor controller inductor according to claim 1, characterized in that: Potting glue (6) is filled between the housing of the inductor device and the built-in components, and between the components.

8. The liquid cooling heat dissipation structure of the boost motor controller inductor according to claim 1, characterized in that: Magnetic core gaskets (14) are provided between the magnetic cores (13).

9. The liquid cooling heat dissipation structure of the boost motor controller inductor according to claim 8, characterized in that: The magnetic core gasket (14) is a gasket made of a high thermal conductivity non-magnetic material.

10. The liquid cooling heat dissipation structure of the boost motor controller inductor according to claim 1, characterized in that: The inductor skeleton (11) is a hollow structure.

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