Assembly

Abstract

The present invention provides an assembly which is a structure reflecting the utilization mode of a fiber body based on the technical concept of cooling by using the turbulence effect. The assembly comprises cooling liquid, a circuit assembly and a heat conduction fiber body. The heat conduction fiber body is provided with a contact part in contact with the circuit assembly and a bent part which is bent. The bent part is arranged in a liquid flow path of the cooling liquid.

Description

Technical Field

[0001] The invention relates to an assembly. Background Art

[0002] Patent Document 1 discloses a cooling component in which a metal fiber sheet is stored in a storage body connected to a heat generating body, and a refrigerant introduced into the storage body absorbs heat conducted from the heat generating body to the metal fiber sheet. The metal fiber sheet is composed of copper fibers or aluminum fibers with high thermal conductivity, and can be effectively cooled by the refrigerant.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-9433

[0006] Problems to be solved by the invention

[0007] The inventors have conducted intensive research and found that when the coolant passes through the fiber, turbulence is generated, and cooling is promoted by the turbulence effect. Furthermore, it is found that when the coolant passes through the surface of the fiber, turbulence is generated due to the disorder of the fiber surface, and cooling is also promoted by the turbulence effect.

[0008] This means that the cooling performance can be improved regardless of the material of the fiber body, which means that the fiber body can be used for cooling with a technical concept completely different from the technical concept described in Patent Document 1, that is, cooling using the thermal conductivity of the metal fiber sheet. Therefore, it is desirable to provide a component with a new structure that reflects the way of using the fiber body based on the technical concept of cooling using the turbulent effect. Summary of the invention

[0009] The present invention has been made in view of such a problem, and an object of the present invention is to provide a structure that reflects a method of utilizing a fiber body based on a technical concept of cooling by utilizing a turbulent flow effect.

[0010] A component according to one aspect of the present invention comprises a cooling liquid, a circuit component, and a heat-conducting fiber body. The heat-conducting fiber body comprises a contact portion that contacts the circuit component and a bent portion that is bent. The bent portion is disposed in a flow path of the cooling liquid.

[0011] Effects of the Invention

[0012] According to this method, turbulence is generated by arranging the bend in the liquid flow path, and as a result, the cooling of the bend itself is promoted. In addition, the bend is thermally connected to the circuit assembly via the contact portion. Therefore, by dissipating heat from the circuit assembly to the coolant via the bend, the circuit assembly can be cooled using the turbulence effect, thereby improving the cooling efficiency of the circuit assembly. In addition, since the structure of this heat-conducting fiber body is a structure whose length and flexibility can be appropriately adjusted, this means that the cooling flow path can be formed anywhere, which also helps to improve the overall layout freedom of the assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic structural diagram of the components of this embodiment.

[0014] Figure 2 This is a cross-sectional view showing the main parts of the inverter.

[0015] Figure 3 This is a cross-sectional view showing the bent portion and part of the passage in an enlarged manner.

[0016] Figure 4 It is an explanatory diagram of the bending direction of the bending portion. DETAILED DESCRIPTION

[0017] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0018] Figure 1 It is a schematic structural diagram of the component 100 of this embodiment. Figure 2 It is a cross-sectional view showing a main part of the inverter 10 . Figure 3 It is a cross-sectional view showing the bent portion 13b and the partial passage 53a in an enlarged manner. Figure 4 is Figure 3 The AA section shown in FIG. 1 is a diagram illustrating the bending direction of the bending portion 13b relative to the liquid flow direction F. Figure 1 In the figure, regarding the rotating electric machine 20 and the reducer 30, the illustration of the rotor and stator of the rotating electric machine 20, the reduction gear mechanism of the reducer 30, etc. is omitted, and the oil reservoir 21b of the rotating electric machine 20 and the oil reservoir 31b of the reducer 30 are schematically shown in cross section.

[0019] The assembly 100 is mounted on, for example, an electric vehicle that uses a rotating electric machine 20 as a driving source. The assembly 100 includes: an inverter 10, a rotating electric machine 20, a reducer 30, and a cooling device 50. The inverter 10 is a circuit assembly, and includes a housing 11 and a circuit 12. The housing 11 is a storage body that stores the circuit 12. The housing 11 is made of, for example, an aluminum alloy. The housing 11 may also include a portion that is made of, for example, resin. The housing 11 includes a box-shaped portion 111 and a plate-shaped portion 112. The box-shaped portion 111 has a box-shaped shape with one side open, and the plate-shaped portion 112 blocks the opening of the box-shaped portion 111. The housing 11 is configured so that the plate-shaped portion 112 forms a lower surface in the direction of gravity.

[0020] The circuit 12 is provided in the housing 11. The circuit 12 includes a substrate 121 and a circuit portion 122. Figure 2 In the figure, the circuit part 122 is surrounded by a two-dot chain line. The substrate 121 is a printed substrate, and is arranged on the bottom wall of the housing 11. The circuit part 122 is mounted on the substrate 121. The circuit part 122 is electrically connected to the substrate 121 through the circuit pattern connected to the substrate 121.

[0021] The circuit part 122 includes: a semiconductor element 122a, a wire 122b, a lead frame 122c, a bonding component 122d, a heat dissipation component 122e, and a molding resin 122f. The semiconductor element 122a is, for example, a power element, such as an IGBT or a power MOSFET. A plurality of semiconductor elements 122a may be provided, for example, along Figure 2 The inner and front direction (with Figure 2 The semiconductor element 122a is electrically connected to the lead frame 122c via the wire 122b.

[0022] The bonding member 122d bonds the semiconductor element 122a to the heat dissipation member 122e, and the heat dissipation member 122e is used to dissipate heat from the semiconductor element 122a. The bonding member 122d and the heat dissipation member 122e are both heat-conducting members, and the heat of the semiconductor element 122a is transferred to the heat dissipation member 122e via the bonding member 122d. The bonding member 122d and the heat dissipation member 122e are members having a higher thermal conductivity than the molded resin 122f, for example.

[0023] The semiconductor element 122a is disposed in the molded resin 122f and sealed by the molded resin 122f. Heat dissipation of the semiconductor element 122a is performed, for example, via the molded resin 122f. On the other hand, the lead frame 122c protrudes from the molded resin 122f, and the heat dissipation component 122e is exposed from the molded resin 122f. Therefore, heat dissipation from the semiconductor element 122a can also be promoted via the lead frame 122c or the heat dissipation component 122e. The lead frame 122c and the heat dissipation component 122e together constitute a heat dissipation promotion portion that promotes heat dissipation from the semiconductor element 122a to the outside of the molded resin 122f.

[0024] The rotating electric machine 20 is controlled by the inverter 10 and generates power. The power generated by the rotating electric machine 20 is transmitted to the driving wheels of the vehicle via the speed reducer 30. The rotating electric machine 20 has a housing 21. The housing 21 has an inlet 21a and an oil reservoir 21b, and accommodates the rotor and stator of the rotating electric machine 20. The inverter 10 is set on the housing 21 from the outside. The inverter 10 is set on the housing 21 from the side.

[0025] The inlet 21a penetrates the upper wall of the housing 21 and communicates the inside and outside of the housing 21. Oil OL as a coolant is introduced into the housing 21 through the inlet 21a. The introduced oil OL falls under the action of gravity, and after lubricating the rotor and cooling the stator, it is stored in the oil reservoir 21b. A part of the stator can be arranged in the oil reservoir 21b, thereby also being able to use the oil OL stored in the oil reservoir 21b for cooling the stator.

[0026] The speed reducer 30 reduces the speed of the input rotation from the rotating electric machine 20 and outputs the speed reducer 30. The speed reducer 30 has a housing 31. The housing 31 has a discharge port 31a and an oil reservoir 31b, and accommodates a reduction gear mechanism. The housing 31 is integrated with the housing 21 by bolts, for example, and together with the housing 21, constitutes a housing 40 of the rotating electric machine 20 and the speed reducer 30.

[0027] The housing 40 has a communication port 41 that connects the oil reservoir 21b in the housing 21 with the oil reservoir 31b in the housing 31. Therefore, the oil OL can be introduced from the oil reservoir 21b to the oil reservoir 31b via the communication port 41. The wall provided with the communication port 41 is constituted by a part of the housing 21, for example.

[0028] The oil reservoir 31b stores the oil OL introduced from the oil reservoir 21b. The oil OL stored in the oil reservoir 31b is stirred up by rotating parts such as gears and used for lubrication of the reduction gear mechanism. The oil OL is discharged from the oil reservoir 31b through the discharge port 31a from the housing 31. The speed reducer 30 corresponds to a power transmission mechanism.

[0029] The cooling device 50 includes an oil pump 51, an oil cooler 52, and a connecting passage 53. The oil pump 51 has a suction port 51a and a discharge port 51b, and pumps the oil OL. The discharge port 51b is connected to the oil cooler 52, and the oil cooler 52 cools the oil OL pumped by the oil pump 51.

[0030] The connection passage 53 is branched from the discharge port 51b of the oil pump 51 through the oil cooler 52 and connected to the inverter 10 and the rotary electric machine 20. One end of the branched connection passage 53 is connected to the introduction port 21a of the rotary electric machine 20. The other end of the branched connection passage 53 is connected to one end of the partial passage 53a.

[0031] The partial passage 53a is a portion of the connecting passage 53 provided in the housing 11, and has two ends that pass through the housing 11. One end of the partial passage 53a is Figure 1 , Figure 2 The front side of the housing 11 is penetrated, and the other end is Figure 1 , Figure 2 The inner side of the connecting passage 53 passes through the housing 11. The connecting passage 53 is connected to the suction port 51a of the oil pump 51 after the other end of the partial passage 53a merges with the discharge port 31a of the speed reducer 30.

[0032] Thus, a first circulation path C1 and a second circulation path C2 are formed in the assembly 100. The first circulation path C1 is a circulation path in which the oil OL passes through the oil cooler 52 and the inverter 10 from the oil pump 51 in sequence and returns to the oil pump 51. The second circulation path C2 is a circulation path in which the oil OL passes through the oil cooler 52, the rotary electric machine 20 and the speed reducer 30 from the oil pump 51 in sequence and returns to the oil pump 51. The first circulation path C1 corresponds to a liquid flow path, and the oil OL flows in the partial passage 53a with the oil pump 51 assembled in the first circulation path C1 as a coolant supply source.

[0033] like Figure 2 As shown, the inverter 10 further includes a fiber body 13. The fiber body 13 is a heat-conductive fiber body, and is a fiber body made of a material having heat conductivity such as a metal or carbon containing an alloy. For example, the fiber body 13 is a heat-conductive fiber body made of a material having a higher thermal conductivity than the molding resin 122f. The fiber body 13 is disposed in the housing 11 and has a plate-like or belt-like extended shape. The fiber body 13 has a contact portion 13a and a bent portion 13b.

[0034] The contact portion 13a is provided at one end of the fiber body 13 and contacts the heat sink 122e. The contact portion 13a is disposed between the heat sink 122e and the substrate 121, and contacts the surface of the heat sink 122e through a plate-like or belt-like surface. The contact portion 13a and the heat sink 122e can be joined, for example, by beam welding or ultrasonic welding. The contact portion 13a is thermally connected to the semiconductor element 122a by contacting the heat sink 122e.

[0035] The bent portion 13b is provided at the other end of the fiber body 13. The bent portion 13b is formed by the bent portion of the fiber body 13 and is provided separately from the contact portion 13a. By arranging the bent portion 13b in the partial passage 53a, the bent portion 13b is arranged in the first circulation path C1, that is, in the flow (liquid flow) of the oil OL in the first circulation path C1.

[0036] When the oil OL flows on the surface of the bend 13b, turbulence occurs. As a result, the cooling of the bend 13b itself is promoted. In addition, the bend 13b is thermally connected to the semiconductor element 122a via the contact portion 13a. Therefore, the semiconductor element 122a is cooled by utilizing the turbulence effect by dissipating heat from the semiconductor element 122a to the oil OL via the bend 13b. As a result, since the cooling of the semiconductor element 122a is promoted, the cooling efficiency of the semiconductor element 122a is improved. In addition, the fiber body 13 has a structure in which the length and flexibility can be appropriately adjusted. Therefore, the layout freedom for forming a partial passage 53a at any location is also improved, which also helps to improve the overall layout freedom of the component 100.

[0037] The bent portion 13b is bent at multiple locations. Therefore, compared to the case where there is no bend, the surface area of ​​the bent portion 13b in the partial passage 53a increases, and the oil OL flowing on the surface of the bent portion 13b causes more turbulence. As a result, the cooling of the semiconductor element 122a is further promoted. In the present embodiment, the bent portion 13b is bent into a spiral shape by bending the fiber body 13 into a circle along the extension direction of the fiber body 13. Therefore, the surface area of ​​the bent portion 13b increases not only in the outermost portion of the spiral shape, but also in the portion closer to the inside than the portion.

[0038] The bending portion 13b in the partial passage 53a is arranged so that the bending direction of the bending portion 13b intersects with the flow direction F of the oil OL passing through the bending portion 13b. Therefore, it is possible to reduce the flow resistance compared to the case where the bending direction is parallel to the flow direction F. In the present embodiment, the bending direction of the bending portion 13b is substantially orthogonal to the flow direction F. As a result, the flow resistance can be reduced as much as possible. The flow direction F is the extension direction of the partial passage 53a.

[0039] The portion of the via 53a may be arranged along the direction of arrangement of the plurality of semiconductor elements 122a (eg, Figure 2 Therefore, in the component 100, by providing the fiber body 13 to each of the plurality of semiconductor elements 122a, it is possible to improve the cooling efficiency of each of the plurality of semiconductor elements 122a.

[0040] The oil OL has insulating properties. Therefore, even if the bent portion 13b is disposed in the partial passage 53a, the insulating state of the circuit 12 is not particularly deteriorated by the oil OL itself. Furthermore, since the partial passage 53a can be made of, for example, resin, the insulating property of the circuit 12 is also ensured. The insulating property of the circuit 12 can also be ensured by, for example, forming a part of the partial passage 53a with resin. The portion of the connection passage 53 other than the partial passage 53a can be made of an appropriate material such as metal.

[0041] In the rotating electrical machine 20 and the speed reducer 30, metal contaminants such as metal flakes and metal powder are generated from bearings and gears, and the metal contaminants are the main cause of reducing the insulation of the oil OL. In contrast, the assembly 100 may include a filter that assists in removing the contaminants in the connecting passage 53 of the downstream portion of the speed reducer 30, for example. Thus, even if the oil OL is shared by the inverter 10, the rotating electrical machine 20, and the speed reducer 30, it is possible to suppress the deterioration of the insulation state of the circuit 12 due to the metal contaminants mixed in the oil OL.

[0042] Next, the main effects of this embodiment will be described.

[0043] (1) The assembly 100 includes the oil OL, the inverter 10, and the fiber body 13. The fiber body 13 includes the contact portion 13a that contacts the semiconductor element 122a of the inverter 10 and the bent portion 13b. The bent portion 13b is disposed in the first circulation path C1 of the oil OL.

[0044] As described above, the contact portion 13a in contact with the semiconductor element 122a is in direct contact with the heat dissipation component 122e, and is in indirect contact with the semiconductor element 122a via other heat-conducting components (here, the bonding component 122d and the heat dissipation component 122e). That is, the case where the contact portion 13a is in contact includes the case where it is in indirect contact via other heat-conducting components. The other heat-conducting components may be components having a higher thermal conductivity than the molded resin 122f.

[0045] According to such a structure, turbulence is generated by arranging the bent portion 13b in the first circulation path C1, and as a result, the cooling of the bent portion 13b itself is promoted. In addition, the fiber body 13 is a heat-conductive fiber body, and the bent portion 13b is thermally connected to the semiconductor element 122a via the contact portion 13a. Therefore, by dissipating heat from the semiconductor element 122a to the oil OL via the bent portion 13b, the semiconductor element 122a can be cooled using the turbulence effect, thereby improving the cooling efficiency of the semiconductor element 122a.

[0046] In addition, the structure of the fiber body 13 is a structure whose length and flexibility can be appropriately adjusted, which means that the structure of forming the cooling flow path exemplified by the partial passage 53a can be any place. Therefore, according to such a structure, it is also helpful to improve the layout freedom of the entire assembly 100. The assembly 100 can improve the cooling efficiency of the inverter 10 by cooling the semiconductor element 122a.

[0047] (2) In the module 100, the contact portion 13a contacts the semiconductor element 122a at one end of the fiber body 13, and the bent portion 13b is bent at the other end of the fiber body 13. With this structure, the fiber body 13 does not need to be too long, and the bent portion 13b can be easily formed.

[0048] (3) In the assembly 100 , the bent portion 13 b is bent at multiple locations. With this structure, the surface area of ​​the bent portion 13 b in the partial passage 53 a can be increased compared to a case where the bent portion 13 b is not bent, so more turbulent flow can be generated, thereby improving cooling efficiency.

[0049] (4) In the module 100, the bending direction of the bent portion 13b intersects with the direction of the liquid flow passing through the bent portion 13b. According to such a configuration, the liquid flow resistance can be reduced compared to the case where the bending direction is parallel to the liquid flow direction F.

[0050] Although the embodiments of the present invention have been described above, the above embodiments merely represent a part of application examples of the present invention, and the technical scope of the present invention is not limited to the specific configurations of the above embodiments.

[0051] For example, the contact portion 13a may be configured to be in contact with the housing 11. In this case, the inverter 10 can be cooled by utilizing the turbulent effect by dissipating heat from the housing 11 to the oil OL via the fiber body 13. In this case, for example, a partial passage 53a may not be provided in the housing 11, which improves the degree of freedom of layout and contributes to improving the degree of freedom of layout of the entire assembly 100.

[0052] The coolant is not necessarily the oil OL, and for example, a liquid having insulating properties other than the oil OL may be used as the coolant.

[0053] The component 100 may also be configured to have a rotating motor 20 and / or a reducer 30, that is, at least one of the rotating motor 20 and the reducer 30. In this case, the component 100 may also be referred to as, for example, a motor component (a component having at least a motor), a power transmission device (a device having at least a power transmission mechanism). The motor is a rotating motor having a motor function and / or a generator function (at least one of the motor function and the generator function). The power transmission mechanism is, for example, a gear mechanism and / or a differential gear mechanism. A device (component) having a motor and a power transmission mechanism is included in the concepts of both the motor component and the power transmission device. In contrast, the circuit component exemplified by the inverter 10 may be used as a constituent element of the above-mentioned component 100, and may be configured to have a circuit and a storage body for storing the circuit.

[0054] Explanation of symbols

[0055] 10: Inverter (circuit component)

[0056] 11: Shell

[0057] 12: Circuit

[0058] 121: Substrate

[0059] 122: Circuit

[0060] 122a: Semiconductor components (part of a circuit assembly)

[0061] 13: Fiber body (thermal conductive fiber body)

[0062] 13a: Contact part

[0063] 13b: Bending part

[0064] 20: Rotating motor

[0065] 30: Reducer

[0066] 50: Cooling device

[0067] 53: Connecting Path

[0068] 53a: Partial access

[0069] 100: Components

[0070] C1: First circulation path (liquid flow path)

[0071] OL: Oil (coolant)

Claims

1. A component comprising: a cooling liquid, a circuit component, and a heat-conducting fiber body, The thermally conductive fiber body comprises: a contact portion contacting the circuit component and a bent portion. The bent portion is arranged in a liquid flow path of the coolant.

2. The assembly of claim 1, wherein: The contact portion contacts the circuit component at one end of the heat conductive fiber body. The bent portion is bent at the other end of the thermally conductive fiber body.

3. The assembly of claim 1, wherein: The bent portion is bent at multiple locations.

4. The assembly of claim 1 or 3, wherein: The bending direction of the bent portion intersects with the direction of the liquid flow passing through the bent portion.

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