Power supply module with sandwich structure

Abstract

The invention discloses a power supply module. Comprising an inductor group, a printed circuit board top plate located above the inductor group, a first power device chip and a second power device chip which are located on the printed circuit board top plate, and an output capacitor substrate layer located below the inductor group, a first set of discrete capacitors embedded within the output capacitor substrate layer and a second set of discrete capacitors embedded within the output capacitor substrate layer. The first power device chip is electrically connected to the first winding of the inductor group through the PCB top plate to provide a first output voltage at a first output voltage node. The second power device chip is electrically connected to a second winding of the inductor group through the PCB top plate to provide a second output voltage at a second output voltage node. A first set of discrete capacitors is connected in parallel between the first output voltage node and ground. A second set of discrete capacitors is connected in parallel between the second output voltage node and ground. The power supply module has relatively high integration level and current density.

Description

Technical Field

[0001] The embodiments of the present invention relate to an electronic circuit, and more specifically, to a power module. Background Art

[0002] Generally, a power converter is used to convert input power into output power with suitable voltage and current and provide it to the load. A multiphase power converter includes multiple power stages connected in parallel and working in staggered phases, so it has the advantages of small output voltage ripple, fast transient response, and low rated ripple current requirement for input capacitors. Due to the above advantages, multiphase power converters are widely used in applications with high output current and low voltage, such as servers, microprocessors, etc.

[0003] The rapid development of modern graphics processing units (GPUs) and central processing units (CPUs) has put forward higher and higher requirements on the current capability of multi-phase power converters. At the same time, the size of these processors is getting smaller and smaller, that is, the size of multi-phase power converters needs to be reduced accordingly. The increasing current and decreasing size have brought higher challenges to the heat dissipation of multi-phase power converters. Therefore, there is a need for a power converter with high current density, high efficiency and excellent heat dissipation capability. Summary of the invention

[0004] An embodiment of the invention discloses a power module.

[0005] According to an embodiment of the present invention, a power module is proposed, comprising: an inductor group, comprising a first winding and a second winding, each winding having a first end and a second end; a PCB (printed circuit board) top plate, located above the inductor group; a PCB bottom plate, located below the inductor group; a connector, connecting the PCB top plate and the PCB bottom plate; a first power device chip and a second power device chip, located above the PCB top plate, wherein the first power device chip has at least one pin electrically connected to the first winding through the PCB top plate, and the second power device chip has at least one pin electrically connected to the second winding through the PCB top plate; an output capacitor substrate layer, located below the PCB bottom plate; a first output capacitor, embedded in the output capacitor substrate layer, wherein the first output capacitor has a first end and a second end, the first end of the first output capacitor is connected to the second end of the first winding, and the second end of the first output capacitor is grounded; a second output capacitor, embedded in the output capacitor substrate layer, wherein the second output capacitor has a first end and a second end, the first end of the second output capacitor is connected to the second end of the second winding, and the second end of the second output capacitor is grounded; and an intermediate substrate layer, located below the output capacitor substrate layer.

[0006] According to an embodiment of the present invention, a power supply module is also proposed, comprising: a first output voltage node, which can be configured to provide a first output voltage; a second output voltage node, which can be configured to provide a second output voltage; an inductor group, comprising a first winding and a second winding; a PCB (printed circuit board) top plate, which is located above the inductor group; a first power device chip and a second power device chip, which are located above the PCB top plate, wherein the first power device chip has at least one pin electrically connected to the first winding through the PCB top plate to provide a first output voltage, and the second power device chip has at least one pin electrically connected to the second winding through the PCB top plate to provide a second output voltage; an output capacitor substrate layer, which is located below the inductor group; a first group of discrete capacitors, which are embedded in the output capacitor substrate layer, and the first group of discrete capacitors are connected in parallel between the first output voltage node and ground; and a second group of discrete capacitors, which are embedded in the output capacitor substrate layer, and the second group of discrete capacitors are connected in parallel between the second output voltage node and ground.

[0007] According to an embodiment of the present invention, a multi-phase power supply module is also proposed, comprising: a plurality of output voltage nodes; a PCB (printed circuit board) top plate having a top surface and a bottom surface; a plurality of inductor groups located below the PCB top plate, each inductor group comprising two windings; a plurality of power device chips mounted on the top surface of the PCB top plate, wherein the plurality of power device chips are electrically connected to the plurality of windings to provide a plurality of output voltages at the plurality of output voltage nodes respectively; and a plurality of output capacitors located below the plurality of inductor groups, wherein the plurality of output capacitors are electrically connected to the plurality of output voltage nodes respectively.

[0008] Compared with conventional technologies, the power module of the present invention has a higher integration level and thus also has a higher current density. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to better understand the present invention, the present invention will be described in detail according to the following drawings, wherein the same or similar elements have the same reference numerals.

[0010] Figure 1 A schematic diagram of a power module 100 according to an embodiment of the present invention is shown;

[0011] Figure 2 The embodiment of the present invention is shown Figure 1 The top view, bottom view and side view of the physical layout of the power module 100 are shown;

[0012] Figure 3 The embodiment of the present invention is shown Figure 2 A cross-sectional view of a substrate 200 of a power module 100 is shown;

[0013] Figure 4 A top view showing the physical layout of a power module 400 according to an embodiment of the present invention is shown;

[0014] Figure 5 The embodiment of the present invention is shown Figure 4 A side view of the power module 400 is shown;

[0015] Figure 6 The embodiment of the present invention is shown Figure 4 A cross-sectional view of the power module 400 is shown;

[0016] Figure 7 shows the top surface of the output capacitor substrate layer 453 according to an embodiment of the present invention;

[0017] Figure 8 shows a schematic block diagram of a two-stage power supply architecture 500 according to an embodiment of the present invention;

[0018] Fig. 9 A schematic diagram of the circuit structure of a switch resonant cavity converter 600 according to an embodiment of the present invention is shown;

[0019] Fig.10 A schematic diagram of the circuit structure of a multi-phase voltage regulator 700 according to an embodiment of the present invention is shown;

[0020] Fig.11A shows a schematic diagram of a power module 800 according to an embodiment of the present invention;

[0021] Fig. 11B shows a side view of a power module 802 according to an embodiment of the present invention;

[0022] Fig.12 shows a side view of a power module 900 according to an embodiment of the present invention;

[0023] Fig.13A shows a side view of a first power module 1000 according to an embodiment of the present invention;

[0024] Fig. 13B shows a side view of a first power module 1002 according to another embodiment of the present invention;

[0025] Fig. 13C shows a side view of a first power module 1004 according to yet another embodiment of the present invention;

[0026] Fig.14 shows a schematic plan view of a power module 1100 according to an embodiment of the present invention;

[0027] Fig.15 shows a side view of a second power module 1200 according to an embodiment of the present invention;

[0028] Fig.16 shows a side view of a second power module 1302 according to yet another embodiment of the present invention;

[0029] Fig.17 A plan view of a first printed circuit board 1310 of a second power module according to an embodiment of the present invention is shown;

[0030] Fig.18A A schematic diagram of a power module 1500 according to an embodiment of the present invention is shown;

[0031] Fig.18B shows a side view of a power module 1500 according to an embodiment of the present invention;

[0032] Fig.19 A schematic diagram of the circuit structure of an existing multi-phase power converter 10A is shown;

[0033] Fig. 20 A schematic diagram of a power module 20A with a sandwich structure and an integrated dual-phase power converter according to an embodiment of the present invention is shown;

[0034] Fig.21 shows a three-dimensional exploded view of an inductor group 30 according to an embodiment of the present invention;

[0035] Fig. 22 shows a three-dimensional exploded view of an inductor group 40 according to an embodiment of the present invention;

[0036] Fig.23 shows a three-dimensional exploded view of an inductor group 50 according to an embodiment of the present invention;

[0037] Fig.24 It shows a schematic structural diagram of a magnetic core 60 according to an embodiment of the present invention;

[0038] Fig.25 It shows a schematic structural diagram of a magnetic core 70 according to an embodiment of the present invention;

[0039] Fig.26 A circuit structure diagram of a multi-phase power converter 10B according to another embodiment of the present invention is shown;

[0040] Fig. 27 A schematic diagram of a power module 20B with a sandwich structure integrating an output capacitor and a dual-phase power converter according to an embodiment of the present invention is shown;

[0041] Fig.28 The embodiment according to the present invention is shown Fig. 27 A top view of the power module 20B is shown;

[0042] Fig.29The embodiment according to the present invention is shown Fig. 27 A side view of the power module 20B is shown;

[0043] Fig.30 The embodiment according to the present invention is shown Fig. 27 A cross-sectional view of the power module 20B shown;

[0044] Fig.31 shows a top view of an output capacitor substrate layer 210 according to an embodiment of the present invention;

[0045] Fig.32 The embodiment according to the present invention is shown Fig. 27 A bottom view of the power module 20B is shown;

[0046] Fig.33 A schematic diagram of a power module 20C with a sandwich structure integrating an output capacitor and a dual-phase power converter according to another embodiment of the present invention is shown;

[0047] Fig.34 shows a top view of a power module 20D according to yet another embodiment of the present invention;

[0048] Fig.35 The embodiment according to the present invention is shown Fig.34 FIG. 2 is a cross-sectional view of a power module 20D shown in FIG. DETAILED DESCRIPTION

[0049] The specific embodiments of the present invention will be described in detail below. It should be noted that the embodiments described herein are only for illustration and are not intended to limit the present invention. In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is obvious to those of ordinary skill in the art that these specific details do not have to be used to implement the present invention. In other examples, in order to avoid confusing the present invention, known circuits, materials or methods are not specifically described.

[0050] Throughout the specification, references to "one embodiment", "an embodiment", "an example" or "an example" mean that a particular feature, structure or characteristic described in conjunction with the embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "in one embodiment", "in an embodiment", "an example" or "an example" that appear in various places throughout the specification do not necessarily refer to the same embodiment or example. In addition, particular features, structures or characteristics may be combined in one or more embodiments or examples in any appropriate combination and / or sub-combination. In addition, it should be understood by those of ordinary skill in the art that the drawings provided herein are for illustrative purposes and that the drawings are not necessarily drawn to scale. It should be understood that when an element is said to be "coupled to" or "connected to" another element, it may be directly coupled or coupled to another element or there may be an intermediate element. In contrast, when an element is said to be "directly coupled to" or "directly connected to" another element, there is no intermediate element. The same reference numerals indicate the same element. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0051] Figure 1 FIG. 1 is a schematic diagram of a power module 100 according to an embodiment of the present invention. Figure 1 In the example of , the power module 100 has two power converters 130 (i.e., 130-1, 130-2), each of which includes an output inductor 120 (i.e., 120-1, 120-2), an output capacitor 124 (i.e., 124-1, 124-2) and a switch module 110 (i.e., 110-1, 110-2). The switch module 110 is integrated in a monolithic integrated circuit (IC). In one embodiment, the output capacitor 124 includes a plurality of discrete capacitors connected in parallel. Figure 1 In the example of FIG. 1 , the power converter 130 is a buck converter. Those skilled in the art will appreciate that the power converter 130 may also be configured as a boost converter or other types of power converters depending on the application.

[0052] Power converters 130-1 and 130-2 receive input voltage VIN-A to generate output voltage VOUT-A (VOUT-A1, VOUT-A2, respectively). The output voltages of power converters 130-1 and 130-2 can be connected together and staggered to provide a multi-phase output voltage. For example, output voltage node 122 can be connected together with output voltage node 123, and each power converter 130 provides one phase of the multi-phase output voltage. In this example, power module 100 can include additional power converters to add more phases.

[0053] Output capacitors 124 are connected to various output voltage nodes. Figure 1In the example, output capacitor 124-1 has a first terminal connected to output voltage node 122 and a second terminal connected to ground. Similarly, output capacitor 124-2 has a first terminal connected to output voltage node 123 and a second terminal connected to ground. For the sake of clarity of the present invention, other capacitors (such as input capacitors, power supply capacitors) and other components that are not necessary for understanding the present invention are not shown in the figure. Figure 1 Shown in.

[0054] In one embodiment, the MP86976 Intelli-Phase TM The switch module 110 is implemented by a single chip IC of a solution. Other suitable single chip ICs may be used without departing from the scope of the present invention. The switch module 110 has a driver 115 and a pair of switches MA1 and MA2 integrated therein, such as metal oxide field effect transistors (MOSFET). For the sake of clarity, other auxiliary circuits of the driver 115, such as a 3.3V auxiliary power supply circuit, are not shown in the figure. Figure 1 As shown, the switch module 110 has a first pin for receiving a pulse width modulation (PWM) signal, a second pin for receiving an input voltage VIN-A, a third pin for grounding, and a fourth pin connected to a switch node SW-A formed by a connection point of switches MA1 and MA2. The drain of switch MA1 is connected to the input voltage VIN, and the source of switch MA2 is connected to the ground. The source of switch MA1 and the drain of switch MA2 are connected at the switch node SW-A.

[0055] Generally speaking, PWM control is a technology well known in the art. In short, the external PWM controller 140 generates a PWM signal, which is received by the driver 115 through the first pin of the switch module 110. The driver 115 turns on or off the switches MA1 and MA2 according to the PWM signal. When the switch MA2 is turned off and the switch MA1 is turned on, the switch node SW-A is connected to the input voltage VIN (through the switch M1), and when the switch MA2 is turned on and the switch MA1 is turned off, the switch node SW-A is connected to the ground (through the switch M2). The first end of the output inductor 120 is connected to the switch node SW-A, and the second end is connected to the output voltage node (i.e., 122, 123) that generates the output voltage VOUT. Figure 1 In the example of , the PWM controller 140 generates PWM signals SPWM-A1 and SPWM-A2 to adjust the corresponding output voltage VOUT-A. For the sake of clarity, other auxiliary circuits for implementing PWM control, such as sensor circuits, are not shown in the figure.

[0056] The input voltage VIN-A, the output voltage VOUT-A and the switching frequency of the switches MA1 and MA2 are determined by the monolithic IC switch module 110. In one embodiment, the MP86976 Intelli-Phase TM The monolithic IC of the solution is used to implement the monolithic IC switch module 110, the input voltage VIN-A ranges from 3V to 7V, the output voltage VOUT-A ranges from 0.4V to 2V (such as 0.8V), and the switching frequency of the switches MA1 and MA2 is between 1MHz and 2MHz (such as 1.5MHz). The relatively low input voltage VIN-A and the relatively high switching frequency of the switches MA1 and MA2 allow the output inductor 120 to have a relatively small physical size (such as 2.5mm×5mm×1.2mm). As will be more clearly explained below, the output inductor 120 can be embedded in the substrate of the power module 100 to reduce the size.

[0057] Figure 2 1 shows a top view, a bottom view and a side view of the physical layout of a power module 100 according to an embodiment of the present invention. The power module 100 has a substrate 200, which in one embodiment is a printed circuit board (PCB). The top view of the substrate 200 shows the "device side" of the substrate 200, while the bottom view shows the bottom side of the substrate 200. Figure 2 In the example of FIG. 1 , the switch module 110, the capacitor and other components are mounted on the component surface. In other embodiments, such as the following Figure 4 In an embodiment, the output capacitors are located in a separate output capacitor substrate layer.

[0058] exist Figure 2 In the example of , the bottom surface opposite to the device surface has a plurality of pins, which connect the nodes of the power module 100 to devices outside the power module 100, such as a PWM controller, etc. The pins can be pads or other structures for electrically connecting nodes and devices. The pins can be square (such as a planar grid array), circular (such as a ball grid array) or other shapes. The power module 100 can be used as part of a power supply (not shown). The pins of the power module 100 can be connected to corresponding sockets on the power substrate.

[0059] The top view of the power module 100 shows the switch module 110-1, the switch module 110-2 and various capacitors mounted on the device surface, such as input capacitors (e.g., 240), capacitors of RC filters that provide voltage for internal digital logic control (e.g., 250, 270), bootstrap capacitors (e.g., 260), filter capacitors that provide voltage for switch drivers (e.g., 280), etc. It should be understood that the number and type of capacitors on the voltage module 100 depends on the specific application. Generally, the capacitors of the power module 100 have relatively small capacitance values. Figure 2 In the example of FIG. 1 , the switch module 110 is the tallest device on the substrate 200. In one embodiment, the substrate 200 has a width D1 of about 8 mm, a length D2 of about 9 mm, and a thickness D3 of about 1.5 mm. In one embodiment, the height D4 from the bottom surface of the substrate 200 to the top surface of the switch module 110 is 2.3 mm.

[0060] The output inductors 120 - 1 and 120 - 2 are embedded in the substrate 200 . Figure 2 The first end (see 220) of the output inductor 120 is connected to the switch node of the corresponding switch module 110, and the second end (see 230) of the output inductor 120 is connected to the corresponding output voltage node. Since the inductance values ​​of the output inductors 120-1 and 120-2 are relatively small, combined with the layout of the power module 100, the output inductors 120-1 and 120-2 can be embedded in the substrate 200, thereby reducing the height of the power module 100. In one embodiment, the height D4 of the power module 100 is 2.3 mm, and the maximum height is 5 mm.

[0061] exist Figure 2 In the example of FIG. 1 , each pin of the power module 100 is square, such as 0.45 mm×0.45 mm. The pins are connected to the ground, and some of the pins connected to the ground are marked as “440” and drawn as black squares. For the sake of clarity, not all ground pins are shown in the figure. Figure 1 The pins connected to the output voltage node 123 (as shown in FIG. 1 ) are uniformly labeled as “410”; and the output voltage node 123 (as shown in FIG. 1 ) that provides the output voltage VOUT2 Figure 1The pins connected to the power module 100 (as shown) are uniformly labeled "402"; the pins connected to the input voltage VIN are uniformly labeled "430". Pin 411 is used to receive a PWM signal to the switch module 110-1; pin 418 is used to receive a PWM signal to the switch module 110-2; pin 412 is used to provide a current detection signal for the switch module 110-1; pin 417 is used to provide a current detection signal for the switch module 110-2; pin 413 is used to provide a temperature detection signal for the switch module 110-1; pin 416 is used to provide a temperature detection signal from the switch module 110-2; pin 414 is used to receive a power supply voltage of VCC; and pin 415 is used to receive an enable signal. It should be understood that the pin distribution of the power module 100 is determined by the specific application, such as the switch module 110 used. The pin arrangement on the bottom surface of the substrate 200 can be changed to suit the specific application.

[0062] Figure 3 A cross-sectional view of a substrate 200 according to an embodiment of the present invention is shown. Figure 3 A schematic diagram of the output inductor 120 is shown, which is not drawn to scale. In one embodiment, the output inductor 120 is a single-turn inductor. The output inductor 120 may also have a plurality of turns. The output inductor 120 includes a conductor 310 and a magnetic core 320 surrounding the conductor 310. In one embodiment, the conductor 310 includes copper, and the magnetic core 320 includes a suitable magnetic core material, such as ferrite or iron powder. The gap 330 is located between the magnetic core 320 and the substrate material, and in one embodiment, the substrate material includes a PCB. Generally speaking, the PCB is a sandwich structure of a conductive layer (such as copper) and an insulating / dielectric layer (such as a glass fiber epoxy laminate). The gap 330 can be an air gap filled with epoxy molding compound. The first end (see 340) of the conductor 310 is led out from the device surface of the substrate 200 and connected to the switch node of the corresponding switch module 110, and the second end (see 350) of the conductor 301 is led out from the bottom surface of the substrate 200 to a pin, which is connected to the corresponding output voltage node.

[0063] In one embodiment, the inductance of the output inductor 120 is less than 100 nH. It should be understood by those skilled in the art that the inductance of the output inductor 120 may be based on the volume of the substrate 200. The larger the substrate, the larger the inductor that can be embedded. For example, the thickness D3 (e.g. Figure 2 When the inductance of the output inductor 120 is 1.5 mm, the size of the output inductor 120 can be 2.5 mm×5 mm×1.2 mm, and the inductance value is about 30 nH.

[0064] Figure 4 FIG. 4 is a top view of the physical layout of the power module 400 according to an embodiment of the present invention. Figure 4The top view shows the top surface of the PCB of the power module 400, on which the switch modules 110 (i.e., 110-1, 110-2, ... 110-18), capacitors 461 (such as input capacitors, bootstrap capacitors, filter capacitors, power supply capacitors, etc.) and other devices (not shown) in the power module 400 are mounted. Figure 1 As described above, each switch module 110 of the power module 400 can be used for the power converter 130. Generally speaking, the number of power converters and the number of switch modules on the power module depends on the specific application.

[0065] exist Figure 4 In the example of , the switch modules 110 are physically arranged in groups of two (e.g., switch modules 110-1 and 110-2 are one group; switch modules 110-13 and 110-14 are another group; and so on), and the length D10 of each group is 8 mm and the width D11 is 8 mm. The switch module 110 can be configured to provide one or more output voltages. For example, the output voltage node of the switch module 110-1 can provide a first output voltage, and the output voltage node of the switch module 110-2 can provide a second output voltage, and each of the first and second output voltages is an independent, separate output voltage. In another example, the output voltage nodes of the switch modules 110-1 to 110-12 can be connected together to provide a first multi-phase output voltage, and the output voltage nodes of the switch modules 110-13 to 110-18 can be connected together to provide a second multi-phase output voltage. All the output voltages of the switch module 110 can be connected together to provide a single multi-phase output voltage.

[0066] The power module 400 with 18 switch modules is for illustration only. Those skilled in the art will appreciate that the number of switch modules 110 may depend on the number of power converters provided by the power module 400. The specific layout of the components of the power module 400 may be set according to the specific application.

[0067] The power module 400 can be used in different applications, including graphics processing units (GPUs), central processing units (CPUs), application-specific integrated circuits (ASICs), and the like. During fast load transients, a sufficient number of output capacitors are required to limit output voltage undershoot and overshoot. However, output capacitors consume a large amount of circuit board space and reduce circuit density. This problem is particularly troublesome in applications using fixed circuit board form factors, because as the circuit board space required for the output capacitors increases, the number of power converters in the power module is correspondingly reduced, thereby limiting the power provided to the GPU, CPU, and the like. In an embodiment of the present invention, in order to save circuit board space, the output capacitors of the power converter 130 use multiple discrete capacitors in parallel embedded in the output capacitor substrate layer of the PCB, rather than being placed on the top surface of the PCB.

[0068] Figure 5 Shown along Figure 4 A side view of the power module 400 viewed in the direction of arrow 462. The power module 400 uses a PCB, which includes multiple substrate layers, namely, an output inductor substrate layer 452, an output capacitor substrate layer 453, and an intermediate substrate layer 454. Advantageously, the output inductor substrate layer 452 is located between the switch module 110 and the output capacitor substrate layer 453, so that the terminal of the output inductor can be effectively connected to the switch node of the switch module 110.

[0069] exist Figure 5 In the example, the top surface 455 of the output inductor substrate layer 452 serves as the top surface of the PCB, on which the switch module 110, the capacitor 461 and other components of the power module 400 are mounted, for example, the switch module 110, the capacitor 461 and other components of the power module 400 are mounted on the top surface of the PCB. The bottom surface 458 of the intermediate substrate layer 454 serves as the bottom surface of the PCB, and the pins of the power module 400 exposed on the bottom surface are used for external connections (such as Figure 2 For example, output voltage nodes 122 and 123 ( Figure 1 The pins of the power module 400 may be square (such as a flat grid array), circular (such as a ball grid array), or other shapes. It should be understood that the pinout of the power module 400 depends on the specific application, such as the specific switch module 110 used. The pin arrangement of the bottom surface 458 can be changed to suit the specific application.

[0070] exist Figure 5In the example of , the output inductor substrate layer 452 has a bottom surface 456 that is in direct contact with the top surface of the output capacitor substrate layer 453. The interposer substrate layer 454 has a top surface 457 that is in direct contact with the bottom surface of the output capacitor substrate layer 453. In one embodiment, the thickness D17 of the output inductor substrate layer 452 is 2.32 mm, the thickness D18 of the output capacitor substrate layer 453 is 0.5 mm, and the thickness D19 of the interposer substrate layer 454 is 0.4 mm. The overall height D16 of the power module 400 is 4 mm, and the overall height is measured from the bottom surface 458 of the interposer substrate layer to the top surface of the tallest device mounted in the power module 400, which in one embodiment is the switch module 110. The power module 400 can have an overall height of up to 8 mm.

[0071] The output inductor substrate layer 452 is the output inductor 120 ( Figure 1 ) provides an embeddable substrate layer. Figure 2 , Figure 3 As shown, the output inductor 120 may be embedded in the output inductor substrate layer 452, and Figure 2 , Figure 3 The difference is that in Figure 5 , one end of the output inductor 120 extending from the bottom surface extends to the top surface of the output capacitor substrate layer 453. Electrical connections between and through the substrate layers 452-454 may be achieved through vias and / or nodes in the substrate layers 452-454.

[0072] Figure 6 A cross-sectional view of a power module 400 according to an embodiment of the present invention is shown. Figure 6 Taken from Figure 4 In one embodiment, the output capacitor 124 is implemented by a plurality of discrete (i.e., individual, separate devices; not part of an integrated circuit), embedded capacitors 463 connected in parallel and embedded within the output capacitor substrate layer 453. Note that for clarity of illustration, Figure 6 Not all embedded capacitors 463 are labeled. In one embodiment, embedded capacitors 463 are 0201-size capacitors. It should be understood that other sizes of discrete capacitors, such as 0402-size, may also be used depending on the available space in output capacitor substrate layer 453 and the specific capacitance value of output capacitor 124. Embedded capacitors 463 may be mounted in one or more cavities or other cut-out areas in output capacitor substrate layer 453. In one embodiment, embedded capacitors 463 are the only discrete devices embedded in output capacitor substrate layer 453. Figure 6Embedded capacitors 463 are shown embedded within the cavity of the output inductor substrate layer 453, including output capacitors 124-1, 124-3, and 124-5.

[0073] Figure 7 FIG. 4 shows a top view of the output capacitor substrate layer 453 according to an embodiment of the present invention. Figure 7 In the example of , every 33 embedded capacitors 463 are physically arranged into 1 capacitor module, and each capacitor module is a separate output capacitor 124. Figure 7 In the embodiment, the capacitor modules are arranged in a 6×3 array. Figure 7 Embedded capacitors 463 are shown forming output capacitors 124-1, 124-2, 124-3, etc. For clarity of illustration, Figure 7 Only a portion of the embedded capacitor 463 that forms the output capacitor 124 is marked.

[0074] Figure 8 A schematic block diagram of a two-stage power supply architecture 500 according to an embodiment of the present invention is shown. In this embodiment, a first stage 510 and a second stage 520 are used to provide power to a load. For example, the first stage 510 includes an intermediate bus converter 512. The intermediate bus converter 512 is used to receive an input voltage (e.g., 48V) and provide an intermediate voltage (e.g., 12V). In one embodiment, the intermediate bus converter 512 can use an LLC converter, a switched tank converter (Switched Tank Converter, STC), a hybrid switched capacitor (Hybrid Switched Capacitor, HSC) converter, or other converters.

[0075] Depending on the power of the load, the second stage 520 may use a low dropout regulator (LDO), a buck converter and / or a multi-phase regulator. For example, a multi-phase regulator is used to power servers and storage devices that require large currents, while a point of load (POL) converter (e.g., a buck converter) or LDO is used to power fans and / or other adjacent devices.

[0076] Compared with the primary converter, the secondary converter has a lower input voltage and less need to operate at a low duty cycle. This can reduce losses and improve efficiency. In addition, transistors and other electronic components do not need to withstand high voltage, so component costs can be saved. At the same time, the size of the components is smaller. Therefore, compared with the existing solutions, the two-stage power distribution solution proposed in the present disclosure can improve efficiency and further reduce size and reduce cost.

[0077] In one embodiment, the intermediate bus converter 512 comprises a switched resonant cavity converter. Fig. 9FIG. 4 is a schematic diagram showing a circuit structure of a switching resonant cavity converter 600 according to an embodiment of the present invention. Fig. 9 As shown, the switching resonant cavity converter 600 includes a plurality of resonant cavities. Each resonant cavity includes a resonant inductor (such as L1, L2) and a resonant capacitor (such as C1, C2). The switching resonant cavity converter 600 also includes at least one capacitor (such as C1, C3). The switching resonant cavity converter 600 also includes a plurality of switches S1, S2, S3, S4, S5, S6, S7, S8, S9 and S10, and an output capacitor C. The switching resonant cavity converter 600 receives an input voltage Vin-B from a power source, converts the output voltage Vin-B into an output voltage Vout-B, and provides it to a load R.

[0078] In one embodiment, the second stage includes a multi-phase regulator. Fig.10 FIG. 2 is a schematic diagram of a circuit structure of a multi-phase voltage regulator 700 according to an embodiment of the present invention. The multi-phase voltage regulator 700 includes a multi-phase controller 710, a plurality of power elements 720-1, 720-2, ..., 720-n, a plurality of inductors L 1 , L 2 ,…,L n and an output capacitor Cout, where n is a positive integer greater than 1. Each phase of the voltage regulator includes a power element and an inductor. In this embodiment, the voltage regulator is a buck converter. It should be understood that the voltage regulator can also be configured as a boost converter or other types of power converters depending on the application. Each phase of the voltage regulator can be connected to provide a multi-phase output voltage at an output node Vout-B. The output capacitor Cout is coupled to the output node Vout-B.

[0079] In one example, the multi-phase controller 710 is an integrated circuit (IC). The multi-phase controller 710 includes a plurality of pins (e.g., PWM-B1, PWM-B2, ..., PWM-Bn), which are respectively used to provide n-phase control signals (e.g., SPWM-B1, SPWM-B2, ..., SPWM-Bn) to the corresponding n power elements 720-1, 720-2, ..., 720-n.

[0080] Each power element includes a drive circuit DRV and two switches MB1 and MB2. The high-side switch M1 is connected to the input voltage Vin. Switches MB1 and MB2 are driven by drive signals G1 and G2, respectively. In one example, each power element is a monolithic IC having a PWM-B pin, a VIN-B pin, a PGND pin, and a SW-B pin. The PWM pin is used to receive a pulse width modulation (PWM) control signal provided by the multi-phase controller 310; the VIN-B pin is coupled to a voltage source to receive an input voltage Vin-B; the PGND pin is coupled to ground; and the SW-B pin is coupled to an output node Vout-B through an inductor to provide an output voltage to a load.

[0081] In one example, multiple inductors L 1 , L 2 ,…,L n Integrated in an inductor module. The inductor module includes one or more magnetic cores and multiple windings. In one example, the output capacitor Cout is implemented by multiple capacitors connected in parallel. In another example, multiple power component ICs and inductors are integrated in a power module. In some examples, the multi-phase controller IC 710, the power component IC, the inductor module and the output capacitor are integrated in a power module.

[0082] Fig.11A FIG. 8 is a schematic diagram of a power module 800 according to an embodiment of the present invention. The power module 800 includes a first power module 810 and a second power module 820. Fig.11A As shown, at least one input pad IN is fixed on the upper surface of the first power module 810 and is used to receive the input voltage Vin-B. The first power module 810 further includes at least one power pad 80 disposed on the lower surface of the first power module 810, and the power pad 80 is used to provide the intermediate voltage Vbus. The second power module 820 is disposed below the first power module 810. The second power module 820 is used to receive the intermediate voltage Vbus and provide the output voltage Vout. Specifically, at least one signal pad for receiving the intermediate voltage Vbus is fixed on the upper surface of the second power module 820, and at least one output pad OUT for providing the output voltage Vout-B is fixed on the lower surface of the second power module 820.

[0083] like Fig.11AAs shown, the power supply of the power module 800 is vertically transmitted from the upper surface of the first power module 810 to the bottom of the second power module 820 to provide vertical power supply to the load. Compared with the traditional design (i.e., all components are arranged on the plane of the printed circuit board), since the first power module 810 and the second power module 820 are vertically stacked. Therefore, each printed circuit board of the present invention can have a smaller size. In addition, since the path of the current flowing through the three-dimensional stacking structure is shorter, the impedance of the power supply path of the present invention is lower. In other words, the loss of power transmission is reduced. In addition, the connection loss (such as the intermediate bus loss) is also reduced, thereby improving the power density and efficiency.

[0084] Fig. 11B FIG. 8 shows a side view of a power module 802 according to an embodiment of the present invention. Fig. 11B As shown, the first power module 810 is disposed above the second power module 820. As shown, the IC and the electronic components are disposed between the upper surface of the first power module 810 and the lower surface of the second power module 820. Therefore, the power module 802 may have a flat upper surface and a flat lower surface. Therefore, the power module 802 may be more easily connected to other devices, such as a power supply end or a load end, for signal transmission and power transmission.

[0085] In one embodiment, the power module further includes a heat sink. Fig.12 FIG. 8 shows a side view of a power module 900 according to an embodiment of the present invention. Fig.12 As shown, the heat sink 930 is disposed between the first power module 910 and the second power module 920. For example, the heat sink 930 includes a heat sink or a heat exchanger. The heat sink 930 can be a block structure made of a material with high thermal conductivity (such as copper). In another example, the heat sink 930 includes heat sink fins to provide air circulation. The heat sink 930 can also be a heat pipe, which includes a container and a conduit filled with a working fluid.

[0086] In one embodiment, the first power module comprises a switched resonant cavity converter. Fig.13A FIG. 1 shows a side view of a first power module 1000 according to an embodiment of the present invention. Fig.13AAs shown, the first power module 1000 includes a first printed circuit board (PCB) 1010, a second PCB 1020 disposed below the first PCB, and a switch resonant cavity converter 1030. The switch resonant cavity converter 1030 includes at least one IC and a plurality of electronic components, and the switch resonant cavity converter 1030 is disposed between the lower surface of the first PCB 1010 and the upper surface of the second PCB 1020. The switch resonant cavity converter 1030 also includes a resistor, an inductor, a capacitor, a transistor and / or other electronic components. The switch resonant cavity converter 1030 is used to receive an input voltage through at least one input pad fixed on the upper surface of the first PCB 1010, and to provide an intermediate voltage through at least one signal pad fixed on the lower surface of the second PCB 1020.

[0087] In one embodiment, the inductor L is the component with the largest height in the power module 1000, so the inductor L determines the height of the power module 1000 (i.e., the height from the upper surface of the first PCB 1010 to the lower surface of the second PCB 1020). For example, the height of the power module 1000 is about 3.4 mm.

[0088] In this embodiment, the power module 1000 further includes a heat sink 1050 disposed below the second PCB 1020. Since the STC circuit structure uses an inductor L instead of a transformer, and the inductor L can be disposed between the lower surface of the first PCB 1010 and the upper surface of the second PCB 1020, a flat upper surface and lower surface of the first power module 1000 (i.e., STC) can be provided. In this way, the flat surface helps the design and thermal management of the heat dissipation structure, and provides a reliable output and output interface. The STC circuit structure can also realize a low-height power module.

[0089] Fig. 13B FIG. 1 shows a side view of a first power module 1002 according to another embodiment of the present invention. Fig. 13B As shown, the first power module 1002 is surrounded by a heat sink 1052 . Fig. 13C FIG. 1 shows a side view of a first power module 1004 according to another embodiment of the present invention. Fig. 13C As shown, the first PCB 1010 , the second PCB 1020 , and the switching resonant cavity converter 1030 of the first power module 1004 are embedded in the heat sink 1054 .

[0090] Fig.14 FIG. 1 is a schematic plan view of a power module 1100 according to an embodiment of the present invention. The power module 1100 includes a first PCB, a second PCB disposed below the first PCB, and a voltage conversion circuit disposed on the first PCB and the second PCB. Fig.14 As shown, 1112 shows the upper surface of the first PCB, 1114 shows the lower surface of the first PCB, 1122 shows the upper surface of the second PCB, and 1124 shows the lower surface of the second PCB. In one embodiment, the voltage conversion circuit is a switch resonant cavity converter. In one example, a plurality of input pads IN for receiving an input voltage Vin-B are fixed on the upper surface 1112 of the first PCB. In some examples, one or more pads 112 are fixed on the upper surface 1112 of the first PCB for receiving or transmitting a detection signal, an enable signal, a control signal and / or a ground signal. The switch resonant cavity converter includes at least one IC and a plurality of electronic components, and the switch resonant cavity converter is disposed on the lower surface 1114 of the first PCB and on the upper surface 1122 of the second PCB. The at least one IC has a plurality of pins, which are coupled to the aforementioned one or more pads 112 to receive and transmit signals. For example, the STC controller IC, transistor IC, gate driver IC, rectifier IC and / or buck converter IC, and one or more resistors, inductors, capacitors, transistors and / or other electronic components are disposed on the lower surface 1114 of the first PCB or on the upper surface 1122 of the second PCB. A plurality of power pads 114 for providing the intermediate voltage Vbus are fixed on the lower surface 1124 of the second PCB. It should be noted that Fig.14 The positions, sizes and shapes of the pads, ICs and electronic components shown are for illustration only. The specific layout of the pads, ICs and electronic components on the first PCB and the second PCB can be designed according to actual applications.

[0091] In one example, the lengths of the first PCB and the second PCB of the first power module are approximately 24 mm, and the widths of the first PCB and the second PCB are approximately 16.7 mm.

[0092] Fig.15 FIG. 1 shows a side view of a second power module 1200 according to an embodiment of the present invention. Fig.15 As shown, the second power module 1200 includes a first PCB 1210, a second PCB 1220, a power circuit 1230 and an inductor module 1240. The inductor module 1240 is disposed between the first PCB 1210 and the second PCB 1220. Specifically, the power circuit 1230 includes at least one IC and a plurality of electronic components, and is disposed on the upper surface of the first PCB 1210.

[0093] In one embodiment, the second power module 1200 includes a multi-phase regulator. For example, a multi-phase controller IC and a plurality of power components having a drive circuit and two switches are disposed on the upper surface of the first PCB 1210. The inductor module 1240 is coupled between the plurality of power components and an output pad disposed on the lower surface of the second PCB 1220. The inductor module 1240 includes a plurality of output inductors, and each output inductor is coupled between a corresponding power component and a corresponding output capacitor. The output capacitor is disposed below the inductor module 1240. In one example, the output capacitor is disposed on the upper surface of the second PCB 1220.

[0094] In another example, the output capacitor is embedded in the substrate layer. Fig.16 FIG. 1 shows a side view of a second power module 1302 according to yet another embodiment of the present invention. Fig.16 As shown, the plurality of capacitors 132 are embedded in a substrate layer 1360 , and the substrate layer 1360 is disposed between the inductor module 1340 and the second PCB 1320 .

[0095] In some embodiments, the second power module 1302 does not require the second PCB 1320. Instead, the inductor module 1240 / 1340 and / or the substrate layer 1360 may be disposed on a system circuit board of the load. Thus, the output pad for providing the output voltage is fixed on the lower surface of the inductor module 1240 / 1340, or fixed on the lower surface of the substrate layer 1360.

[0096] Fig.17 FIG. 1 shows a plan view of a first PCB 1310 of a second power module according to an embodiment of the present invention. Fig.17 As shown, 1412 shows the upper surface of the first PCB 310, and 1414 shows the lower surface of the first PCB 1310. In one embodiment, the voltage conversion circuit is a multi-phase regulator. In one example, a plurality of signal pads 134 for receiving the intermediate voltage Vbus are fixed on the upper surface 1412 of the first PCB. In some examples, one or more pads 136 are fixed on the upper surface 1412 of the first PCB and are used to receive or transmit detection signals, enable signals, control signals and / or ground signals. A multi-phase control IC, a plurality of power supply ICs and a plurality of electronic components are arranged on the upper surface 1412 of the first PCB. A plurality of pads 144 are fixed on the lower surface 1414 of the first PCB and are used to provide an output voltage Vout-B. In some examples, one or more pads 146 are used to receive or transmit detection signals, enable signals, control signals and / or ground signals. It should be noted that, Fig.17The positions, sizes and shapes of the various pads, ICs and electronic components shown are for illustration only. The specific layout of the pads, ICs and electronic components on the first PCB can be designed according to actual applications.

[0097] In one example, the length of the first PCB 1310 of the second power module is about 29.6 mm, and the widths of the first PCB and the second PCB are about 16.7 mm. The height of the inductor module is about 2.3 mm.

[0098] Fig.18A FIG. 1 is a schematic diagram of a power module 1500 according to an embodiment of the present invention. Fig.18B FIG. 1 shows a side view of a power module 1500 according to an embodiment of the present invention. Figures 18A to 18B As shown, the power module 1500 has a sandwich structure. The first power module 1510 is disposed above the second power module 1520. The power module 1500 further includes a heat sink 1530, which is disposed between the first power module 1510 and the second power module 1520. In one embodiment, the first power module 1510 is embedded in the heat sink 1530.

[0099] In one embodiment, the power module 1500 further includes a connector 1532. The connector 1532 is connected between the first power module 1510 and the second power module 1520 and is used to receive and transmit signals. Figures 18A to 18B As shown, connector 1532 is disposed adjacent to heat sink 1530, or is disposed to be surrounded by heat sink 1530. It should be understood by those skilled in the art that one or more connectors can be connected between different layers of the PCB to provide vertical electrical connections. For example, the connector may include signal pins formed by metal columns to connect to pads on the PCB. The connector can be further implemented by metal wires, metal sheets, metal contacts, through holes and other conductive connectors.

[0100] In one example, the length of the power module 1500 is approximately 29.6 mm, the width of the power module 1500 is approximately 16.7 mm, and the height of the power module 1500 is approximately 15 mm.

[0101] Based on the above, the present disclosure provides a power module with vertical power transmission, so that the current passes through each layer of the PCB from top to bottom. Since the PCB of the present disclosure is vertically stacked, it can have a smaller size. In addition, since the path of the current flowing through the three-dimensional stacked structure is shorter, the impedance of the power transmission network is lower. In addition, the conduction loss (such as the loss of the intermediate bus) is also reduced, thereby improving the power density and efficiency. The flat surface facilitates the design and thermal management of the heat sink and provides a reliable input and output interface. The sandwich structure can also achieve a low height.

[0102] Fig.19 FIG. 1 shows a schematic diagram of the circuit structure of an existing multi-phase power converter 10. Fig.19 As shown, the multi-phase power converter 10A includes a controller 101, N power devices 103 and N inductors L1, where N is an integer and N>1. Fig.19 As shown, each power stage 102, also referred to as each phase 102, includes a power device 103 and an inductor L1. Each power device 103 includes power switches M1, M2 and a driver DR1 for driving the power switches M1, M2. The controller 101 provides N-phase control signals 105-1 to 105-N to control the N power devices 103 respectively, so as to control the N phases 102 to work in staggered phases, that is, the N inductors L1 sequentially draw energy from the input end and sequentially provide energy to the load 104. It should be understood that in Fig.19 In the embodiment, the output of each phase of the multi-phase power converter 10A is connected together to provide energy to the load, which is only one application. In other applications, the multi-phase power converter 10A can also work in the manner of multiple single-phase power converters, that is, each phase can be connected to an independent load separately and provide different output voltages to meet the needs of different loads.

[0103] Fig.19 The power stage 102 with the BUCK topology is shown as an example only. Those skilled in the art should understand that power stages with other topologies are also applicable to the multi-phase power converter of the embodiment of the present invention.

[0104] In the following embodiments of the present invention, the inductor L1 may be implemented by a coupled inductor or by N single inductors.

[0105] When N=2, the multiphase power converter 10A is used as a two-phase power converter, or two independent power converters.

[0106] Fig. 20 FIG. 2 shows a schematic diagram of a power module 20A with a sandwich structure and an integrated dual-phase power converter according to an embodiment of the present invention. Fig.19In the example, when N=2, the power stage 102 can be implemented using the power module 20A. The sandwich structure power module 20A includes: a PCB (Printed Circuit Board) bottom plate 201, located at the bottom of the power module 20A; an inductor group 206, located on the PCB bottom plate 201, including two inductors, wherein each inductor has a first end and a second end; a PCB top plate 202, located on the inductor group 206; a connector 204, having a plurality of metal pillars 205, each of which is respectively soldered to corresponding pads on the PCB top plate 202 and the PCB bottom plate 201; and two power device chips 203, located on the top of the PCB top plate 202, wherein each power device chip 203 has one or more pins, which are connected to the second end of the inductor in the inductor group 206 through the PCB top plate 202; wherein each inductor has a winding 207, wherein the two ends of the winding 207 are bent to a plane perpendicular to the length direction of the winding 207, and extend on the PCB top plate 202 and the PCB bottom plate 201.

[0107] exist Fig. 20 In the embodiment, the power module 20A further includes a discrete component 208 located on the PCB top plate 202. The discrete component 208 is a general term, including discrete resistors, discrete capacitors, etc. involved in the power converter 10, such as an input capacitor for providing a pulse current at the input end of the power converter 10, a filter capacitor and a resistor for supplying power to a power switch driver and an internal logic circuit, etc.

[0108] In one embodiment, the metal pillar 205 includes a copper pillar, which is used to solder the PCB bottom plate 201 to the PCB top plate 202. Those skilled in the art should understand that any metal pillar that can be used to electrically connect two PCB boards can be used in the present invention.

[0109] The power module 20A is usually placed on the mainboard of the processor to provide power to the components on the mainboard. The PCB base plate 201 is welded on the mainboard, and some pins of the power module 20A are welded to the mainboard through the PCB base plate 201. In some embodiments, the PCB base plate 201 can also be omitted. The power module 20A can be directly welded to the mainboard through the connector 204 and the inductor group 206.

[0110] In the present invention, the power device chip is stacked on the inductor group, such as Fig. 20 As shown, the area of ​​the power converter 10A on the PCB is saved. Each power device chip 203 integrates Fig.19 The power device 103 shown includes: Fig.19 The power switches M1 and M2 shown in the figure and the driver DR1 for driving the power switches M1 and M2, and Fig.19The circuit connected to the auxiliary winding is not shown in the figure. The pins of the power device chip 203 are soldered to the pads of the PCB top plate 202, and then the pads of the PCB top plate 202 are electrically connected to the pads of the PCB bottom plate 201 through the inductor group 206 and the connector 204. In this way, the power device chip 203 can be electrically connected through the PCB bottom plate 201. The power module 20A also includes a metal sheet 209 for conducting large current signals such as a reference ground. The metal sheet 209 wraps a portion of the area of ​​the magnetic core of the inductor group 206 and is soldered to the PCB top plate 202 and the PCB bottom plate 201 at the same time. The position of the metal sheet 209 depends on the position of the ground pin of the power device chip 203. Fig. 20 In the illustrated embodiment, the metal sheet 209 is mainly wrapped around the side of the inductor group 206, with its two ends bent to form welding areas close to corresponding pads on the PCB board on the upper and lower surfaces of the inductor group 206, so that on the horizontal plane, that is, the plane of the PCB board, a large area of ​​the metal sheet 209 is used to replace the PCB wiring to carry a large current, thereby reducing circuit losses and improving circuit efficiency.

[0111] Fig.21 FIG. 3 shows a three-dimensional exploded view of an inductor group 30 according to an embodiment of the present invention. The inductor group 30 can be used as Fig. 20 The inductor group 206 in the power module. Fig.21 As shown, the inductor group 30 includes: a magnetic core, including a first magnetic core part 301 and a second magnetic core part 302, wherein the first magnetic core part 301 and the second magnetic core part 302 are combined together to form two channels 303-1 and 303-2 at the joint surface of the two; and windings 304-1 and 304-2, passing through the channels 303-1 and 303-2 respectively.

[0112] exist Fig.21 In the embodiment shown, when the inductor group 30 is applied to Fig. 20 In the power module 20A shown in FIG. 1 , the channels 303 - 1 and 303 - 2 are parallel to the PCB bottom plate 201 and the PCB top plate 202 , that is, the channels 303 - 1 and 303 - 2 have a direction along which the channels 303 - 1 and 303 - 2 are parallel to the PCB bottom plate 201 and the PCB top plate 202 . Fig. 20 Radial to the axis A shown.

[0113] exist Fig.21In the illustrated embodiment, the winding 304-1 has a first end 304-3 bent 90 degrees and extending on the surface of the magnetic core, and covering a portion of the surface. The extended portion is also equivalent to extending on the surface of the PCB top plate 202 and soldered to the PCB top plate 202. The winding 304-1 has a second end 304-5 bent 90 degrees and extending on the surface of the magnetic core, and covering a portion of the surface. The extended portion is also equivalent to extending on the surface of the PCB bottom plate 201 and soldered to the PCB bottom plate 201. In other words, the first end 304-3 and the second end 304-5 of the winding 304-1 extend along a plane perpendicular to the magnetic core channels 303-1 and 303-2, and the side edges of the extended surface also extend on the surfaces of the PCB top plate 202 and the PCB bottom plate 201. Similarly, the winding 304-2 has a first end 304-4 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB top plate 202, and is soldered to the PCB top plate 202, and has a second end 304-6 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB bottom plate 201, and is soldered to the PCB bottom plate 201. In other words, the first end 304-4 and the second end 304-6 of the winding 304-2 extend along a plane perpendicular to the magnetic core channels 303-1 and 303-2, and the side edges of the extended surface also extend on the surfaces of the PCB top plate 202 and the PCB bottom plate 201.

[0114] exist Fig.21 In the embodiment shown, the shapes of the first magnetic core part 301 and the second magnetic core part 302 of the magnetic core are not symmetrical, wherein the first magnetic core part 301 has a planar shape, the second magnetic core part 302 has two channels, and the channels 303-1 and 303-2 are respectively formed by the two channels of the second magnetic core part 302 and a surface 301-1 of the first magnetic core part 301, as shown in FIG. Fig.21 shown.

[0115] exist Fig.21 In the illustrated embodiment, the metal sheets 305-1 and 305-2 have an L shape. The two ends of the metal sheets 305-1 and 305-2 are respectively welded to the PCB top plate 202 and the PCB bottom plate 201. The ends of the metal sheets 305-1 and 305-2 welded to the PCB top plate 202 are bent 90 degrees and extended on the surface of the magnetic core, which is equivalent to extending on the surface of the PCB top plate 202, and are electrically connected to the ground pin of the power device chip 203 through the pad of the PCB top plate 202, so as to reduce the routing of the PCB top plate 202 and its routing impedance.

[0116] Fig. 22 FIG. 4 shows a three-dimensional exploded view of an inductor group 40 according to an embodiment of the present invention. The inductor group 40 can be used as Fig. 20The inductor group 206 in the power module. Fig. 22 As shown, the inductor group 40 includes: a magnetic core, including a first magnetic core part 401 and a second magnetic core part 402, wherein the first magnetic core part 401 and the second magnetic core part 402 are combined together to form two channels 403-1 and 403-2 at the joint surface of the two; and windings 404-1 and 404-2, passing through the channels 403-1 and 403-2 respectively.

[0117] exist Fig. 22 In the embodiment shown, when the inductor group 40 is applied to Fig. 20 In the power module 20A shown in FIG. 1 , the channels 403-1 and 403-2 are perpendicular to the PCB bottom plate 201 and the PCB top plate 202, that is, the channels 403-1 and 403-2 have a direction along which the channels 403-1 and 403-2 are perpendicular to the PCB bottom plate 201 and the PCB top plate 202. Fig. 20 Radial to the axis B shown.

[0118] exist Fig. 22 In the illustrated embodiment, the winding 404-1 has a first end 404-3 bent 90 degrees and extending on the surface of the magnetic core, and covering a portion of the surface. The extended portion is also equivalent to extending on the surface of the PCB top plate 202 and soldered to the PCB top plate 202. The winding 404-1 has a second end 404-5 bent 90 degrees and extending on the surface of the magnetic core, and covering a portion of the surface. The extended portion is also equivalent to extending on the surface of the PCB bottom plate 201 and soldered to the PCB bottom plate 201. In other words, the first end 404-3 and the second end 404-5 of the winding 404-1 extend along a plane perpendicular to the magnetic core channels 403-1 and 403-2, and the extended surface also extends on the surfaces of the PCB top plate 202 and the PCB bottom plate 201. Similarly, the winding 404-2 has a first end 404-4 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB top plate 202, and is soldered to the PCB top plate 202, and has a second end 404-6 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB bottom plate 201, and is soldered to the PCB bottom plate 201. In other words, the first end 404-4 and the second end 404-6 of the winding 404-2 extend along a plane perpendicular to the magnetic core channels 403-1 and 403-2, and the extended surface also extends on the surfaces of the PCB top plate 202 and the PCB bottom plate 201.

[0119] In some embodiments, the second end 404-5 of the winding 404-1 and the second end 404-6 of the winding 404-2 may not be bent. Whether the second end of the winding is bent, the direction of the bending, and the shape of the extended surface, etc., depend on the position of the corresponding pad on the PCB bottom plate 201, or if there is no PCB bottom plate 202, it depends on the position of the corresponding pad on the main board where the power module 20A is located.

[0120] exist Fig. 22 In the illustrated embodiment, the shapes of the first core portion 401 and the second core portion 402 of the magnetic core are not symmetrical, wherein the first core portion 401 has a planar shape, the second core portion 402 has two channels, and the channels 403-1 and 403-2 are respectively formed by the two channels of the second core portion 402 and a surface 401-1 of the first core portion 401.

[0121] exist Fig. 22 In the illustrated embodiment, the metal sheets 405-1 and 405-2 have a C-shape. The two ends of the metal sheets 405-1 and 405-2 are respectively welded to the PCB top plate 202 and the PCB bottom plate 201. One end of the metal sheets 405-1 and 405-2 welded to the PCB bottom plate 201 is bent 90 degrees and extended on the surface of the magnetic core, which is equivalent to extending on the surface of the PCB bottom plate 201. The extended surface is welded to the corresponding pad of the PCB bottom plate 201, thereby reducing the routing of the PCB bottom plate 201 and its routing impedance. Similarly, one end of the metal sheets 405-1 and 405-2 welded to the PCB top plate 202 is bent 90 degrees and extended on the surface of the magnetic core, which is equivalent to extending on the surface of the PCB top plate 202, and is electrically connected to the ground pin of the power device chip 203 through the pad of the PCB top plate 202, thereby reducing the routing of the PCB top plate 202 and its routing impedance.

[0122] Fig.23 FIG. 4 shows a three-dimensional exploded view of an inductor group 50 according to an embodiment of the present invention. The inductor group 50 can be used as Fig. 20 The inductor group 206 in the power module. Fig.23 As shown, the inductor group 50 includes: a magnetic core, including a first magnetic core part 501 and a second magnetic core part 502, wherein the first magnetic core part 501 and the second magnetic core part 502 are combined together to form two channels 503-1 and 503-2 at the joint surface of the two; and windings 504-1 and 504-2, passing through the channels 503-1 and 503-2 respectively.

[0123] exist Fig.23 In the embodiment shown, when the inductor group 50 is applied to Fig. 20 In the power module 20A shown in FIG. 1 , the channels 503-1 and 503-2 are perpendicular to the PCB bottom plate 201 and the PCB top plate 202, that is, the channels 503-1 and 503-2 have a direction along which the channels 503-1 and 503-2 are perpendicular to the PCB bottom plate 201 and the PCB top plate 202. Fig. 20 Radial to the axis B shown.

[0124] exist Fig.23In the illustrated embodiment, the metal sheet 505 has a C-shape. The two ends of the metal sheet 505 are respectively welded to the PCB top plate 202 and the PCB bottom plate 201. One end of the metal sheet 505 welded to the PCB bottom plate 201 is bent 90 degrees and extended on the surface of the magnetic core, which is equivalent to extending on the surface of the PCB bottom plate 201. The extended surface is welded to the corresponding pad of the PCB bottom plate 201, so as to reduce the routing of the PCB bottom plate 201 and its routing impedance. Similarly, one end of the metal sheet 505 welded to the PCB top plate 202 is bent 90 degrees and extended on the surface of the magnetic core, which is equivalent to extending on the surface of the PCB top plate 202, and is electrically connected to the ground pin of the power device chip 203 through the pad of the PCB top plate 202, so as to reduce the routing of the PCB top plate 202 and its routing impedance. Fig.23 In the illustrated embodiment, the portion of the metal sheet 505 that wraps around the side of the magnetic core is extended as much as possible to increase the area so as to reduce its own impedance.

[0125] and Fig. 22 Compared with the inductor group 40 shown, Fig.23 The inductor group 50 in the embodiment has a single metal sheet 505 for electrically connecting the ground pin of the power device chip 203 to the PCB bottom plate 201. Fig. 22 compared to, Fig.23 Since one metal sheet is missing, the metal sheet 505 and the windings 504 - 1 and 504 - 2 have a larger extensible area on the upper and lower surfaces of the magnetic core, thereby making the distribution of the ground pins of the power device chip 203 more flexible.

[0126] Fig.23 In the embodiment, the first magnetic core part 501 and the second magnetic core part 502 of the magnetic core are connected to Fig. 22 The core structure is similar to that in FIG. 1 , and for the sake of simplicity, it will not be described in detail here.

[0127] Fig.24 FIG. 4 shows a schematic structural diagram of a magnetic core 60 according to an embodiment of the present invention. Fig.24 In the embodiment, the magnetic core 60 comprises a first magnetic core portion 601 and a second magnetic core portion 602 of symmetrical shapes, wherein each magnetic core portion has two channels. Figure 21 to Figure 25 In the inductor assembly of the embodiment, the channels of the two magnetic core parts overlap to form two channels for the winding to pass through.

[0128] Fig.25 FIG. 1 shows a schematic structural diagram of a magnetic core 70 according to an embodiment of the present invention. Fig.25In the embodiment, the magnetic core 70 includes a first magnetic core portion 701, a second magnetic core portion 702 and third magnetic core portions 703-1 to 703-3. The first magnetic core portion 701, the second magnetic core portion 702 and the third magnetic core portions 703-1 and 703-2 form a first channel 704-1. The first magnetic core portion 701, the second magnetic core portion 702 and the third magnetic core portions 703-2 and 703-3 form a second channel 704-2. Fig.25 As can be seen in FIG. 1 , when there are more third core parts, more core channels can be constructed. The first core part 701 , the second core part 702 and the third core parts 703 - 1 to 703 - 3 can be made of different materials, thereby providing a more flexible and adjustable inductance-current curve.

[0129] In some embodiments of the present invention, the core parts of the core may be made of the same material but have different shapes, or may be made of different materials, such as ferrite, iron powder or other suitable materials, in order to achieve the desired inductance-current characteristic curve, for example, a large inductance value at a low current and a small inductance value at a high current. A large inductance value at a low current can make the system more efficient, while a small inductance value at a high current can make the system more transient.

[0130] In order to briefly explain the principle of the present invention, Figure 21 to Figure 25 In the embodiment of the present invention, only a magnetic core having two channels through which two windings can be passed is shown. Those skilled in the art should know that, according to the needs of the application, the magnetic core can have any number of channels through which any number of windings can be passed, and single or multiple channels are in line with the spirit of the present invention.

[0131] In some embodiments, there may be air gaps between different core parts of the magnetic core to form coupled inductors. In some embodiments, there are no air gaps between the core parts to form multiple single inductors.

[0132] In the present invention, in order to make the surface of the inductor module flat, the winding and metal sheet covering the surface of the magnetic core are embedded in the surface of the magnetic core, such as Figure 21 to Figure 25 shown.

[0133] Fig.26 FIG. 2 shows a circuit structure diagram of a multi-phase power converter 10B according to another embodiment of the present invention. Fig.19Compared to the power converter 10A shown in FIG. 1 , each phase 102 (i.e., 102-1, 102-2, ..., 102-N) of the power converter 10B further includes an output capacitor 107 (i.e., 107-1, 107-2, ..., 107-N). In one embodiment, the output capacitor 107 includes a plurality of discrete capacitors connected in parallel. The power device 103 is coupled to the input voltage Vin. The power switch M1 of each power device 103 is coupled to the input voltage Vin, and the power switch M2 of each power device 103 is coupled to the ground GND. Referring to the aforementioned Fig.19 In the description of the power converter 10A shown in FIG. 1 , the controller 101 provides N phase control signals 105 (i.e., 105-1, 105-2, ..., 105-N) to control N power devices 103 respectively, so as to control the N phases 102 to work in staggered phases. Fig.26 In the illustrated embodiment, each phase 102 has a corresponding output voltage node 108 (i.e., 108-1, 108-2, ..., 108-N) to provide output voltages Vout1, Vout2, ..., and VoutN. In one embodiment, all output voltage nodes 108 are connected together to supply power to the load 104. In another embodiment, the multiple output voltage nodes 108 may not be connected together, and the N phases 102 operate as N single-phase converters.

[0134] like Fig.26 As shown, each output capacitor 107 is connected to a corresponding output voltage node 108. Fig.26 In the illustrated embodiment, each output capacitor 107 has a first terminal and a second terminal. The first terminal of the output capacitor 107-1 is connected to the output voltage node 108-1, and the second terminal is connected to the ground GND. Similarly, the first terminal of the output capacitor 107-2 is connected to the output voltage node 108-2, and the second terminal is connected to the ground GND, and so on. In order to clearly explain the content of the present invention, other capacitors (such as input capacitors, power supply capacitors) and other devices that are not necessary for understanding the present invention are not shown in the figure. Fig.26 Shown in.

[0135] Fig. 27 FIG. 2 shows a schematic diagram of a power module 20B with a sandwich structure and an integrated dual-phase power converter according to an embodiment of the present invention. Fig.26 In the example, when N=2, the power stage 102 can be implemented using the power module 20B. Fig. 27As shown, the power module 20B includes an inductor group 206, a PCB (Printed Circuit Board) bottom plate 201, a PCB top plate 202, a connector 204, a discrete component 208, and two power device chips 203. The inductor group 206 includes two windings, each of which has a first end and a second end. The PCB top plate 202 is located above the inductor group 206, and the PCB bottom plate 201 is located below the inductor group 206. The connector 204 is placed between the PCB bottom plate 201 and the PCB top plate 202, and is used to connect the pads on the PCB bottom plate 201 with the pads on the PCB top plate 202. The discrete component 208 and the two power device chips 203 are integrated on the top of the PCB top plate 202, and each power device chip 203 has one or more pins, which are connected to the second end of the corresponding winding in the inductor group 206 through the PCB top plate 202. In some embodiments, the detailed structure of the inductor group 206 is as shown in FIG. Figures 22 to 25 As shown, those skilled in the art should understand that the shape of the magnetic core and winding in the inductor group 206 is not limited to Figures 22 to 25 Example shown.

[0136] and Fig. 20 Compared to the power module 20A shown, Fig. 27 The power module 20B shown further integrates an output capacitor 107, which is placed below the inductor group 206. Fig. 27 In the illustrated embodiment, the power module 20B further includes an output capacitor substrate layer 210 located below the PCB bottom plate 201, and the output capacitor 107 is embedded in the output capacitor substrate layer 210. In some embodiments, the PCB bottom plate 201 can be omitted, and the connector 204 and the inductor group 206 are directly soldered to the output capacitor substrate layer 210. The power module 20B with integrated output capacitor 107 further improves the current density of the power module.

[0137] exist Fig. 27 In the illustrated embodiment, the power module 20B further includes an intermediate substrate layer 211 located below the output capacitor substrate layer 210 and in contact with the output capacitor substrate layer 210. The power module 20B can be applied to the mainboard of the load 104 to supply power to the devices on the mainboard, and the load 104 includes, for example, a CPU, a GPU, or an ASIC. The intermediate substrate layer 211 is soldered to the mainboard, and at least part of the pins of the power module 20B are connected to the mainboard through the intermediate substrate layer 211. In some embodiments, the intermediate substrate layer 211 can be omitted, in which case the pins of the power module 20B are exposed on the bottom surface of the output capacitor substrate layer 210, and the output capacitor substrate layer 210 is directly soldered to the mainboard.

[0138] exist Fig. 27In the illustrated embodiment, the pins of the power device chip 203 are electrically connected to the pads of the intermediate substrate layer 211 through the PCB top plate 202, the inductor group 206, the connector 204 and the output capacitor substrate layer 210 to ensure that all necessary signals are obtained from the intermediate substrate layer 211. In addition, the power module 20B has a metal sheet 209, which directly solders the reference ground pin and / or the power pin (i.e., the pin receiving the input voltage Vin) of the power device chip 203 to the PCB bottom plate 201 or the output capacitor substrate layer 210 through the PCB top plate 202, thereby using a large area of ​​the metal sheet 209 to replace the PCB traces to transmit large currents on the horizontal plane (i.e., on the plane of the PCB board), reducing circuit losses and improving circuit efficiency.

[0139] exist Fig. 27 In the illustrated embodiment, the connector 204 includes a plurality of metal pillars 205. The plurality of metal pillars 205 respectively connect the pads of the PCB bottom plate 201 and the pads of the PCB top plate 202. It should be understood by those skilled in the art that the connector 204 may also be in other shapes, for example, the connector 204 may be integrated with the inductor group 206. In one embodiment, the metal pillars 205 include copper pillars. It should be understood by those skilled in the art that the metal pillars 205 may be made of any known material capable of connecting two PCB boards.

[0140] In an embodiment of the present invention, in order to save board space, the output capacitor 107 is implemented by a plurality of discrete capacitors connected in parallel and embedded in the output capacitor layer 210 .

[0141] Fig.28 The embodiment of the present invention is shown Fig. 27 A top view of the power module 20B in FIG. Fig.28 As shown, the power device chip 203 and the discrete component 208 are mounted on the top surface of the PCB top plate 202. In one embodiment, the width D21 of the PCB top plate 202 is about 9 mm, and the length D22 is about 10 mm.

[0142] Fig.29 The embodiment of the present invention is shown along Fig.28 A side view of the power module 20B viewed in the direction of arrow 233. Fig.29As shown, the bottom surface 236 of the intermediate substrate layer 211 serves as the bottom surface of the power module 20B, and the pins of the power module 20B are exposed to the bottom surface 236 of the intermediate substrate layer 211 for external connection. In one embodiment, the height D20 of the inductor group 206 from the bottom surface to the top surface is in the range of 2mm to 8mm, for example, 5.8mm. The inductance value of each winding of the inductor group 206 ranges from 40nH to 150nH, for example, 100nH. It can be understood by those skilled in the art that the height of the inductor group 206 and the inductance value of each winding depend on the specific application. In one embodiment, the power device chip 203 is the highest component mounted on the PCB top plate 202, and the total height D23 of the power module 20B (i.e., the height from the bottom surface of the PCB top plate 202 to the top surface of the power device 203) is in the range of 4mm to 12mm, for example, 10mm.

[0143] exist Fig.29 In the illustrated embodiment, the PCB bottom plate 201 has a bottom surface that is in direct contact with the top surface of the output capacitor substrate layer 210. The interposer substrate layer 211 has a top surface that is in direct contact with the bottom surface of the output capacitor substrate layer 210. As previously mentioned, in some embodiments, the PCB bottom plate 201 may be omitted.

[0144] Fig.30 The embodiment of the present invention is shown Fig. 27 sectional view of the power module 20B in FIG. Fig.30 Taken from Fig.28 In one embodiment, the output capacitor 107 is implemented by a plurality of discrete (i.e., individual, separate devices, not part of an integrated circuit), embedded capacitors 212, which are connected in parallel and embedded in the output capacitor substrate layer 210. Note that for clarity of illustration, Fig.30 Not all embedded capacitors 212 are labeled. In one embodiment, the embedded capacitors 212 are 0201 size capacitors. It should be understood that other sizes of discrete capacitors, such as 0402 size, may also be used depending on the available space in the output capacitor substrate layer 210 and the specific capacitance value of the output capacitor 107. The embedded capacitors 212 can be mounted in one or more cavities or other cut-out areas in the output capacitor substrate layer 210. In one embodiment, the embedded capacitors 212 are the only discrete devices embedded in the output capacitor substrate layer 210. Fig.30 Embedded capacitors 212 are shown embedded within the cavities of output capacitor substrate layer 210 , including output capacitors 107 - 1 and 107 - 2 .

[0145] Fig.31 FIG. 2 shows a top view of an output capacitor substrate layer 210 according to an embodiment of the present invention. Fig.31 In the example of FIG. 1 , the embedded capacitor 212 is physically arranged in a cavity within the output capacitor substrate layer 210 (in Fig.31 Indicated by a dotted box). Fig.31 Embedded capacitor 212 is shown forming output capacitor 107 - 1 and output capacitor 107 - 2 . Fig.31 Also shown are pads for input voltage Vin, output voltage Vout1, output voltage Vout2, ground GND and other signals located on the top surface of the output capacitor substrate layer 210 (in FIG. Fig.31 Those skilled in the art will appreciate that the cavity arrangement within the output capacitor substrate layer 210 and the pads on the output capacitor substrate layer 210 may be changed to suit a specific application.

[0146] Fig.32 FIG. 2 shows a bottom view of a power module 20B according to an embodiment of the present invention. Fig.32 In the illustrated embodiment, the bottom surface of the intermediate substrate layer 211 serves as the bottom surface of the power module 20B. The bottom surface of the intermediate substrate layer 211 has a plurality of pins, which connect the nodes of the power module 20B to devices (such as a PWM controller, etc.) outside the power module 20B. The pins can be pads or other structures for electrically connecting nodes and devices. The pins can be square (such as a planar grid array), circular (such as a ball grid array) or other shapes. The power module 20B can be used as part of a power supply (not shown). The pins of the power module 20B can be connected to corresponding sockets on the power substrate.

[0147] exist Fig.32In the illustrated embodiment, each pin of the power module 20B is square, such as a square with a size of 0.45 mm×0.45 mm. The pins are connected to the ground GND, and some of the pins connected to the ground GND are marked as "245" and drawn as black squares. For the sake of clarity of the diagram, not all pins connected to the ground GND are shown in the figure. The pins connected to the output voltage node 108-1 to provide the first output voltage Vout1 are uniformly marked as "246", and the pins connected to the output voltage node 108-2 to provide the second output voltage Vout2 are uniformly marked as "247". In another embodiment, the pins providing the first output voltage Vout1 and the pins providing the second output voltage Vout2 are connected together. The pins connected to the input voltage VIN are uniformly marked as "248". Pin 249 is used to receive a PWM signal and provide the PWM signal to the power device chip 203-1; pin 251 is used to receive a PWM signal and provide the PWM signal to the power device chip 203-2; pin 252 is used to provide a current detection signal from the power device chip 203-1; pin 253 is used to provide a current detection signal from the power device chip 203-2; pin 254 is used to provide a temperature detection signal from the power device chip 203-1; pin 255 is used to provide a temperature detection signal from the power device chip 203-2; pin 256 is used to receive a power supply voltage of VCC; and pin 257 is used to receive an enable signal and provide the enable signal to the power device chip 203-1, and pin 258 is used to receive an enable signal and provide the enable signal to the power device chip 203-2.

[0148] Fig.33 FIG. 2 shows a schematic diagram of a power module 20C with a sandwich structure and an integrated dual-phase power converter according to an embodiment of the present invention. Fig.33 In the illustrated embodiment, the inductor group 206, the metal sheet 209, and the connector 204 are located between the PCB top plate 202 and the integrated bottom substrate layer 214. The output capacitor 107 is embedded in the integrated bottom substrate layer 214, and the pins of the power module 20C are exposed on the bottom surface of the integrated bottom substrate layer 214. In another embodiment, the PCB bottom plate 201 of the power module 20C, the output capacitor substrate layer 210, and the intermediate substrate layer 211 are molded together to form the integrated bottom substrate layer 214.

[0149] Fig.34 FIG. 2 shows a top view of a power module 20D according to an embodiment of the present invention. Fig.34 In the illustrated embodiment, the power module 20D has 18 phases. Fig.34The top surface of the PCB top plate 202 in the power module 20D, the power device chips 203 (ie, 203-1, 203-2, ..., 203-18), the discrete components 208, and other components of the power module 20D ( Fig.34 (not shown) is mounted on the top surface of the PCB top plate 202. Fig.19 and Fig.26 As described above, each power device chip 203 of the power module 20D can be used for the power device 103. The power module 20D with 18 power device chips 203 is for illustration only. In general, the number of power device chips in the power module (i.e., the number of phases of the power module) depends on the specific application. It should be understood by those skilled in the art that the specific layout of the components of the power module 20D can be set according to the specific application.

[0150] Fig.35 The embodiment of the present invention is shown Fig.34 20D in FIG. Fig.35 Taken from Fig.34 The power module 20D includes a plurality of inductor groups 206, each of which integrates two windings. Fig.35 In the illustrated embodiment, the power module 20D includes nine inductor groups 206, Fig.35 The cross-sectional view of FIG. 2 shows the inductor groups 206 - 1 , 206 - 2 , and 206 - 3 . Those skilled in the art will appreciate that the number of inductor groups 206 depends on the specific application. In other embodiments of the present invention, each inductor group 206 may also include more than two windings.

[0151] The power module 20D further includes output capacitors 107 for 18 phases, and the output capacitors 107 are implemented by embedded capacitors 212. Fig.35 In the illustrated embodiment, the embedded capacitors 212 are placed in a plurality of cavities or other cut-out areas of the output capacitor substrate layer 210. The structures and connections of other parts of the power module 20D (e.g., the PCB top plate 202, the PCB bottom plate 201, and the connector 204, etc.) are similar to those of the power module 20B, and are not described in detail here for the sake of simplicity. In another embodiment, the PCB bottom plate 201, the output capacitor substrate layer 210, and the intermediate substrate layer 211 are replaced by an integrated bottom substrate layer 214, and the output capacitor 107 is embedded in the integrated bottom substrate layer 214.

[0152] Although the present invention has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in a variety of forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A power module, comprising: an inductor group, comprising a first winding and a second winding, each winding having a first end and a second end; The top plate of the PCB (printed circuit board), located above the inductor group; PCB bottom plate, located below the inductor group; Connector, connecting the PCB top plate and the PCB bottom plate; A first power device chip and a second power device chip are located on the top plate of the PCB, wherein the first power device chip has at least one pin electrically connected to the first winding through the top plate of the PCB, and the second power device chip has at least one pin electrically connected to the second winding through the top plate of the PCB; Output capacitor substrate layer, located below the PCB bottom plate; a first output capacitor embedded in the output capacitor substrate layer, wherein the first output capacitor has a first end and a second end, the first end of the first output capacitor is connected to the second end of the first winding, and the second end of the first output capacitor is grounded; a second output capacitor embedded in the output capacitor substrate layer, wherein the second output capacitor has a first end and a second end, the first end of the second output capacitor is connected to the second end of the second winding, and the second end of the second output capacitor is grounded; as well as The interposer substrate layer is located below the output capacitor substrate layer.

2. The power module according to claim 1, further comprising: A plurality of pins are led out from the bottom surface of the interposer substrate layer, wherein a first pin among the plurality of pins receives a first control signal to control a first power device chip, and a second pin among the plurality of pins receives a second control signal to control a second power device chip. 3 . The power module of claim 2 , wherein a third pin among the plurality of pins is electrically connected to the second end of the first winding, and a fourth pin among the plurality of pins is electrically connected to the second end of the second winding. 4 . The power module of claim 2 , wherein a fifth pin among the plurality of pins receives an input voltage and is electrically connected to the first power device chip and the second power device chip.

5. The power module of claim 1, wherein a top surface of the output capacitor substrate layer contacts a bottom surface of the PCB bottom plate, and a bottom surface of the output capacitor substrate layer contacts a top surface of the interposer substrate layer.

6. The power module of claim 1, wherein the first output capacitor and the second output capacitor each comprise a plurality of discrete capacitors connected in parallel. 7 . The power module of claim 1 , wherein the first output capacitor and the second output capacitor are respectively located in cavities within the output capacitor substrate layer.

8. The power module according to claim 1, wherein: The height of the power module measured from the bottom surface of the power module to the top surface of the highest device mounted on the top plate of the PCB is at least 4 mm and at most 12 mm.

9. A power module, comprising: a first output voltage node configurable to provide a first output voltage; a second output voltage node configurable to provide a second output voltage; An inductor group, comprising a first winding and a second winding; The top plate of the PCB (printed circuit board), located above the inductor group; A first power device chip and a second power device chip are located on the top plate of the PCB, wherein the first power device chip has at least one pin electrically connected to the first winding through the top plate of the PCB to provide a first output voltage, and the second power device chip has at least one pin electrically connected to the second winding through the top plate of the PCB to provide a second output voltage; Output capacitor substrate layer, located below the inductor group; a first set of discrete capacitors embedded in the output capacitor substrate layer, the first set of discrete capacitors connected in parallel between a first output voltage node and ground; as well as A second set of discrete capacitors is embedded in the output capacitor substrate layer, the second set of discrete capacitors being connected in parallel between a second output voltage node and ground.

10. The power module of claim 9, further comprising: The PCB bottom plate is located between the inductor group and the output capacitor substrate layer; as well as The connector connected between the PCB top plate and the PCB bottom plate is configured to connect the pads on the PCB bottom plate to the pads on the PCB top plate respectively.

11. The voltage conversion circuit of claim 9, further comprising an interposer substrate layer below the output capacitor substrate layer.

12. The power module of claim 9, wherein the first set of discrete capacitors and the second set of discrete capacitors are respectively located in cavities within the output capacitor substrate layer.

13. A multiphase power supply module, comprising: Multiple output voltage nodes; A PCB (printed circuit board) top plate having a top surface and a bottom surface; A plurality of inductor groups are located below the top plate of the PCB, each inductor group including two windings; A plurality of power device chips are mounted on the top surface of the PCB top plate, wherein the plurality of power device chips are electrically connected to the plurality of windings to provide a plurality of output voltages at a plurality of output voltage nodes respectively; as well as A plurality of output capacitors are located below the plurality of inductor groups, wherein the plurality of output capacitors are electrically connected to a plurality of output voltage nodes respectively.

14. The multi-phase power module of claim 13, further comprising: An output capacitor substrate layer, wherein the plurality of output capacitors are embedded within the output capacitor substrate layer.

15. The multi-phase power module of claim 14, wherein the plurality of output capacitors are located in at least one cavity within the output capacitor substrate layer.

16. The multi-phase power module of claim 13, further comprising: A PCB bottom plate, located between the inductor group and the plurality of output capacitors; The connector connected between the PCB top plate and the PCB bottom plate is configured to connect the pads on the PCB bottom plate to the pads on the PCB top plate respectively.

17. The multi-phase power module of claim 14, further comprising: The interposer substrate layer includes an output capacitor substrate layer disposed between the inductor group and the interposer substrate layer.

18. The multi-phase power module of claim 13, wherein each of the plurality of output capacitors comprises a plurality of discrete capacitors connected in parallel.

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