Filter and electronic device

Abstract

The invention relates to a filter. The filter comprises a laminated body, a space coupling resonance structure, a zigzag type three-dimensional resonator, a first coupling structure, a second coupling structure, a third coupling structure, a first signal terminal and a second signal terminal. The size of the filter is smaller than that of a plane resonance unit, and miniaturization of the filter is facilitated; a higher quality factor is easy to realize, and excellent out-of-band rejection can be realized; and excellent out-of-band rejection performance is realized. The filter is very compact in internal structure and outstanding in miniaturization performance.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of filters, and in particular to a filter and an electronic device. Background Art

[0002] As a key component in wireless communication systems, filters play an important role in frequency selection and spurious suppression, and their performance directly determines the quality of system communication. With the rapid evolution of communication standards, the integration density and performance indicators of RF systems are constantly improving, which puts more stringent requirements on the size and out-of-band suppression performance of filters.

[0003] Traditional chip filters are based on planar resonant units and occupy a relatively large size. At the same time, the quality factor of the planar resonant unit is relatively low. In order to achieve the desired out-of-band suppression performance, the number of resonators is often increased to introduce more out-of-band transmission zeros. However, this will lead to a surge in the number of components inside the device, an increase in the size of the filter, and an increase in the in-band loss, making it difficult to meet the current miniaturization and low-loss requirements of RF microsystems. Therefore, how to achieve excellent frequency selection performance in a tiny space has become a challenge facing current filter design. Summary of the invention

[0004] In response to the above problems, the present invention discloses a filter, in which a zigzag three-dimensional resonator and a spatially coupled resonant structure are composed of conductor parts on different horizontal planes and conductive columns extending along the stacking direction to form a three-dimensional resonant unit, which is easy to achieve a smaller size than a planar resonant unit, which is conducive to the miniaturization of the filter. The three-dimensional resonant unit is easy to achieve a higher quality factor, which is conducive to achieving excellent out-of-band suppression. The filter realizes multi-path electric / magnetic hybrid coupling between resonant units based on the zigzag three-dimensional resonator, the spatially coupled resonant structure and the first to third coupling structures, realizes three out-of-band transmission zero-point attenuations, and has excellent out-of-band suppression performance. The internal structure of the filter is very compact and the miniaturization performance is outstanding.

[0005] The present invention provides a filter, comprising:

[0006] A laminate, comprising one or more dielectric layers arranged along a stacking direction; a spatially coupled resonant structure, the spatially coupled resonant structure comprising a first conductor portion, a second conductor portion, a third conductor portion, a fourth conductor portion, a fifth conductor portion, a first conductive column, a second conductive column, a third conductive column, and a fourth conductive column; the first to fifth conductor portions are formed inside the laminate or on the surface of the laminate, the third conductor portion is arranged between the first conductor portion and the mounting surface along the stacking direction, the fourth conductor portion is arranged between the second conductor portion and the mounting surface along the stacking direction, the fifth conductor portion is arranged between the first conductor portion and the mounting surface along the stacking direction, and the fifth conductor portion is arranged between the second conductor portion and the mounting surface along the stacking direction; the mounting surface is the surface of a mounting carrier, the mounting carrier is used to mount or fix a filter, or to mount or fix a partial structure of a filter, or to mount or fix any electronic device composed of a filter; the first conductive column, the second conductive column, the third conductive column and the fourth conductive column extend in the laminate along the stacking direction; a zigzag three-dimensional resonator, comprising a first zigzag three-dimensional resonator a first coupling structure, a second coupling structure and a third coupling structure, wherein the first to third coupling structures are all formed by coupling of metallized electrodes formed inside or on the surface of the stack; the first coupling structure is arranged on a coupling path between the first zigzag three-dimensional resonator and the second zigzag three-dimensional resonator, the second coupling structure is arranged on a coupling path between the first zigzag three-dimensional resonator and the spatial coupling resonant structure, and the third coupling structure is arranged on a coupling path between the second zigzag three-dimensional resonator and the spatial coupling resonant structure; and a first signal terminal and a second signal terminal, wherein the first signal terminal is coupled to the first zigzag three-dimensional resonator and the second signal terminal is coupled to the second zigzag three-dimensional resonator. The spatial coupling resonant structure is coupled to the first meandering three-dimensional resonator, and the spatial coupling resonant structure is coupled to the second meandering three-dimensional resonator. The spatial coupling resonant structure is configured to be sandwiched between the first meandering three-dimensional resonator and the second meandering three-dimensional resonator. The projection contours of the first meandering three-dimensional resonator, the second meandering three-dimensional resonator and the spatial coupling resonant structure on a plane perpendicular to the first direction overlap or partially overlap. The projections of the first conductive pillar, the second conductive pillar, the third conductive pillar and the fourth conductive pillar on a plane perpendicular to the second direction are sandwiched between the projection of at least one conductive pillar of the first meandering three-dimensional resonator on a plane perpendicular to the second direction and the projection of at least one conductive pillar of the second meandering three-dimensional resonator on a plane perpendicular to the second direction, and the second direction is perpendicular to the first direction.

[0007] Optionally, the outer contour of the first conductor part is set to have the same width, or the outer contour of the first conductor part has different widths at least in some positions. The outer contour of the second conductor part is set to have the same width, or the outer contour of the second conductor part has different widths at least in some positions. The first conductor part and the second conductor part are arranged adjacent to each other, there is a gap between the first conductor part and the second conductor part, and the projection of the first conductor part on the mounting surface or the surface perpendicular to the stacking direction does not overlap with the projection of the second conductor part on the mounting surface or the surface perpendicular to the stacking direction. The third conductor part is arranged adjacent to the fourth conductor part, there is a gap between the third conductor part and the fourth conductor part, and the projection of the third conductor part on the mounting surface or the surface perpendicular to the stacking direction does not overlap with the projection of the fourth conductor part on the mounting surface or the surface perpendicular to the stacking direction. The fifth conductor part is formed in a bent shape. The projection of the fifth conductor part on the mounting surface or the surface perpendicular to the stacking direction overlaps with the projection of the third conductor part on the mounting surface or the surface perpendicular to the stacking direction and the projection of the fourth conductor part on the mounting surface or the surface perpendicular to the stacking direction. The fifth conductor part and the third conductor part are partially coupled in a mutually facing relationship to form a first capacitive structure. The fifth conductor part and the fourth conductor part are partially coupled in a mutually facing relationship to form a second capacitive structure. The first to fifth conductor parts are made of metallized materials. The first conductor part is coupled to the first capacitive structure through the first conductive column and the second conductive column, and the first conductor part, the first capacitive structure, the first conductive column and the second conductive column and the coupling path therebetween form a first closed loop in three-dimensional space. The second conductor part is coupled to the second capacitive structure through the third conductive column and the fourth conductive column, and the second conductor part, the second capacitive structure, the third conductive column and the fourth conductive column and the coupling path therebetween form a second closed loop in three-dimensional space. The projection contours of the first closed loop and the second closed loop on a plane perpendicular to the first direction overlap or partially overlap.

[0008] Optionally, the fifth conductor portion is arranged between the third conductor portion and the mounting surface along the stacking direction.

[0009] Optionally, the fifth conductor portion is located between the fourth conductor portion and the mounting surface along the stacking direction.

[0010] Optionally, the sixth conductor portion is made of a metallized material, and its projection on the mounting surface or the surface perpendicular to the stacking direction forms a meandering shape that is bent at least twice. The seventh conductor portion is made of a metallized material, arranged between the sixth conductor portion and the mounting surface along the stacking direction, and includes a first connecting section and a second connecting section with a gap between the first connecting section. The eighth conductor portion is made of a metallized material, arranged between the seventh conductor portion and the mounting surface along the stacking direction, and the projection of the eighth conductor portion on the mounting surface or the surface perpendicular to the stacking direction partially overlaps with the projection of the seventh conductor portion on the mounting surface or the surface perpendicular to the stacking direction. The eighth conductor portion is conductively connected to the second connecting section of the seventh conductor portion. The portions of the eighth conductor portion and the first connecting section of the seventh conductor portion that face each other in the stacking direction are coupled to form a third capacitive structure, and the projection of the third capacitive structure on the mounting surface or the surface perpendicular to the stacking direction at least partially overlaps with the projection of the sixth conductor portion on the mounting surface or the surface perpendicular to the stacking direction. The sixth conductor part is coupled to the third capacitive structure through the fifth conductive column, and the sixth conductor part is coupled to the second connection section through the sixth conductive column. The first conductor part, the third capacitive structure, the fifth conductive column, the sixth conductive column, the second connection section and the coupling paths therebetween form a third closed loop in three-dimensional space. In this case, the zigzag three-dimensional resonator forms a three-dimensional structure in space, which is easy to achieve a smaller size than the planar resonant unit, which is conducive to the miniaturization of the filter. The three-dimensional resonant unit is easy to achieve a higher quality factor, which is conducive to achieving excellent out-of-band suppression.

[0011] Optionally, the outer contour width of the sixth conductor portion is consistent, or the outer contour of the sixth conductor portion has at least a portion of different widths. In this case, adjusting the width of different positions of the sixth conductor portion according to design requirements can more flexibly adjust the characteristic impedance of the first conductor portion, thereby improving the design freedom of the U-type three-dimensional resonator.

[0012] Optionally, the sixth conductor portion includes a third connecting segment, a fourth connecting segment, and a fifth connecting segment that are interconnected, the third connecting segment is perpendicular to the fourth connecting segment, the fourth connecting segment is perpendicular to the fifth connecting segment, and the third connecting segment and the fifth connecting segment are located on the same side of the fourth connecting segment relative to the fourth connecting segment. In this case, the planar size of the first conductor portion is reduced by multiple bends, which is conducive to improving the miniaturization level of the meander-type three-dimensional resonator.

[0013] Optionally, the second coupling structure is conductively connected to the first connection segment of the first meandering three-dimensional resonator, and the second coupling structure is conductively connected to the third conductor portion of the spatially coupled resonant structure. The third coupling structure is conductively connected to the first connection segment of the second meandering three-dimensional resonator, and the third coupling structure is conductively connected to the fourth conductor portion of the spatially coupled resonant structure.

[0014] In this case, increasing the coupling path between resonators through the coupling structure is beneficial for the filter to form multiple transmission zeros.

[0015] Optionally, the projection of the second coupling structure on the mounting surface or the surface perpendicular to the stacking direction partially overlaps with the projection of the sixth conductor portion of the first zigzag three-dimensional resonator on the mounting surface or the surface perpendicular to the stacking direction, and / or the projection of the third coupling structure on the mounting surface or the surface perpendicular to the stacking direction partially overlaps with the projection of the sixth conductor portion of the second zigzag three-dimensional resonator on the mounting surface or the surface perpendicular to the stacking direction. In this case, the space utilization in the vertical direction can be improved, and the miniaturization level of the filter can be improved.

[0016] By configuring one or more additional reactance structures and flexibly configuring the additional reactance structures according to different application requirements, combined with the zigzag resonator and spatial coupling resonant structure, additional out-of-band transmission zeros can be introduced without increasing the order of the resonator, which is beneficial to further improve the frequency selectivity of the filter. Including the following situations:

[0017] Optionally, the filter further includes a first connection end, a second connection end, a third connection end and at least one additional reactance structure, wherein the additional reactance structure is configured on a coupling path between the first connection end and the first meandering three-dimensional resonator, and / or the additional reactance structure is configured on a coupling path between the second connection end and the second meandering three-dimensional resonator, and / or the additional reactance structure is configured on a coupling path between the third connection end and the spatial coupling resonant structure. The first to third connection ends and the additional reactance structure are made of metallized materials.

[0018] Optionally, the first connection terminal, the second connection terminal and the third connection terminal are used to be connected to a reference ground.

[0019] Optionally, the additional reactance structure is composed of a structure whose imaginary part of admittance is greater than zero, or the additional reactance structure is composed of a structure whose imaginary part of admittance is less than zero.

[0020] Optionally, the additional reactance structure is formed such that its projection on the mounting surface or the surface perpendicular to the stacking direction is formed by at least one of a straight line, a broken line, an arc line, and a spiral line extending from a point.

[0021] Optionally, the additional reactance structure is formed by coupling a plurality of metallized electrodes.

[0022] Optionally, the additional reactance structure is formed inside the stack, and / or the additional reactance structure is formed on the surface of the stack, and / or the additional reactance structure is formed inside the mounting carrier, and / or the additional reactance structure is formed on the surface of the mounting carrier.

[0023] Optionally, the filter includes first to third additional reactance structures. The first additional reactance structure is configured on a coupling path between the first connection end and the first meandering three-dimensional resonator. The second additional reactance structure is configured on a coupling path between the second connection end and the second meandering three-dimensional resonator. The third additional reactance structure is configured on a coupling path between the third connection end and the spatial coupling resonant structure.

[0024] Optionally, the first to third coupling structures are each composed of at least two metallized electrodes facing each other in the stacking direction, and the projections of the two metallized electrodes on the mounting surface or the surface perpendicular to the stacking direction partially overlap.

[0025] Optionally, the first coupling structure includes a first metallized electrode, a second metallized electrode, and a third metallized electrode. The second metallized electrode partially overlaps with the projection of the first metallized electrode on the mounting surface or the surface perpendicular to the stacking direction. The second metallized electrode partially overlaps with the projection of the third metallized electrode on the mounting surface or the surface perpendicular to the stacking direction, and the overlapping portion of the projection of the second metallized electrode and the first metallized electrode on the mounting surface or the surface perpendicular to the stacking direction is spaced from the overlapping portion of the projection of the second metallized electrode and the third metallized electrode on the mounting surface or the surface perpendicular to the stacking direction.

[0026] Optionally, the first coupling structure and the first meandering three-dimensional resonator share the same metallized electrode, and / or the first coupling structure and the second meandering three-dimensional resonator share the same metallized electrode. In this case, the integration of the structure can be improved, which is conducive to the miniaturization of the filter.

[0027] Optionally, one electrode of the first coupling structure is coupled to the first zigzag three-dimensional resonator through a seventh conductive column, and another electrode of the first coupling structure is coupled to the second zigzag three-dimensional resonator through an eighth conductive column, the seventh conductive column and the eighth conductive column extend along the stacking direction in the stacked body, and the eighth conductor portion of the first zigzag three-dimensional resonator and the eighth conductor portion of the second zigzag three-dimensional resonator are located between at least one electrode of the first coupling structure and the mounting surface along the stacking direction.

[0028] Optionally, the projection of the first coupling structure on the mounting surface or the surface perpendicular to the stacking direction is sandwiched between the projection of the first signal terminal on the mounting surface or the surface perpendicular to the stacking direction and the projection of the second signal terminal on the mounting surface or the surface perpendicular to the stacking direction. In this case, the integration of the structure can be improved, which is conducive to the miniaturization of the filter.

[0029] Optionally, the projection of the first coupling structure on the mounting surface or the surface perpendicular to the stacking direction partially overlaps with the projection of the sixth conductor portion of the first zigzag three-dimensional resonator on the mounting surface or the surface perpendicular to the stacking direction, or the projection of the first coupling structure on the mounting surface or the surface perpendicular to the stacking direction partially overlaps with the projection of the sixth conductor portion of the second zigzag three-dimensional resonator on the mounting surface or the surface perpendicular to the stacking direction. In this case, it is beneficial to improve the miniaturization performance of the filter.

[0030] Additional inductive structures can be configured and flexibly configured according to different application requirements. They can be used together with zigzag resonators and spatially coupled resonant structures to introduce additional out-of-band transmission zeros without increasing the order of the resonator, which is beneficial to further improve the frequency selectivity of the filter, including the following situations:

[0031] Optionally, the filter further includes an additional inductive structure, which is arranged on a coupling path between the first meandering three-dimensional resonator and the second meandering three-dimensional resonator. The additional inductive structure is composed of a structure whose imaginary part of admittance is less than zero. The projection of the additional inductive structure on a plane perpendicular to the stacking direction is formed by extending from a point by at least one of a straight line, a fold line, an arc, and a spiral.

[0032] Optionally, along the stacking direction, the additional inductive structure is at least partially formed on the same horizontal plane as at least one metallized electrode constituting the first coupling structure.

[0033] Optionally, the first coupling structure is arranged between the additional inductive structure and the mounting surface along the stacking direction, and the distance between the additional inductive structure and the mounting surface is greater than the distance between the first coupling structure and the mounting surface.

[0034] Optionally, one end of the additional inductive structure is coupled to an electrode in the first coupling structure through a ninth conductive column, and the other end of the additional inductive structure is coupled to another electrode of the first coupling structure through a tenth conductive column, and the ninth conductive column and the tenth conductive column extend in the stacked body along the stacking direction.

[0035] Optionally, the additional inductive structure is at least partially disposed on the surface of the mounting carrier or inside the mounting carrier.

[0036] Optionally, the additional inductive structure and the first coupling structure share the same metallized electrode, and / or the additional inductive structure and the first signal terminal share the same metallized electrode, and / or the additional inductive structure and the second signal terminal share the same metallized electrode.

[0037] Optionally, a projection of the additional inductive structure on the mounting surface or a surface perpendicular to the stacking direction partially overlaps with a projection of the first coupling structure on the mounting surface or a surface perpendicular to the stacking direction.

[0038] Optionally, the second coupling structure is configured to be sandwiched between the first zigzag three-dimensional resonator and the spatial coupling resonant structure. One electrode of the second coupling structure is connected to the first zigzag three-dimensional resonator, and the other electrode is connected to the spatial coupling resonant structure. The third coupling structure is configured to be sandwiched between the second zigzag three-dimensional resonator and the spatial coupling resonant structure. The third coupling structure electrode is connected to the second zigzag three-dimensional resonator, and the other electrode is connected to the spatial coupling resonant structure. In this case, multiple coupling paths are formed, which is conducive to the realization of out-of-band transmission zeros. At the same time, the compact layout improves the integration of the structure, which is conducive to the miniaturization of the filter.

[0039] Optionally, the projections of the first meandering three-dimensional resonator, the second meandering three-dimensional resonator and the spatial coupling resonant structure on the plane where the mounting surface is located are all located on the same side of the projection of the first coupling structure on the plane where the mounting surface is located. In this case, the structural layout is compact, which is conducive to the miniaturization of the filter.

[0040] Optionally, the first meandering three-dimensional resonator, the spatially coupled resonant structure, and the second meandering three-dimensional resonator are arranged sequentially in the first direction.

[0041] Optionally, the filter further includes at least one supporting member, which is disposed between the stacked body and the mounting surface and is used to fix the stacked body to the mounting surface.

[0042] The present invention provides an electronic device, comprising any one of the above filters.

[0043] The technical solution provided by the embodiment of the present invention is that the zigzag three-dimensional resonator and the spatial coupling resonant structure are composed of conductor parts on different horizontal planes and conductive columns extending along the stacking direction to form a three-dimensional resonant unit, which is easy to achieve a smaller size than the traditional planar resonant unit, which is conducive to the miniaturization of the filter. The three-dimensional resonant unit is easy to achieve a higher quality factor, which is conducive to achieving high roll-off out-of-band suppression performance. The first to second zigzag three-dimensional resonators and the spatial coupling resonant structure layout are designed, and the resonance unit is used together with the first to third coupling structures and additional inductive structures to form a multi-channel electric / magnetic hybrid coupling, and multiple out-of-band transmission zero-point attenuation is achieved, which has excellent out-of-band suppression performance. The internal structure of the filter is very compact and the miniaturization performance is outstanding. The combined effect of the introduced additional reactance structure and the resonator is conducive to further increasing the number of out-of-band transmission zero points without increasing the order of the resonator, which is conducive to further improving the frequency selectivity of the filter. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0045] Figure 1 is a schematic diagram of an equivalent circuit of a filter provided by an embodiment of the present invention;

[0046] Figure 2 It is a transparent stereoscopic diagram of a spatially coupled resonant structure in a filter provided by an embodiment of the present invention;

[0047] Figure 3 yes Figure 2 a see-through top view of the structure shown;

[0048] Figure 4 is a transparent stereoscopic image of a first zigzag three-dimensional resonator and a second zigzag three-dimensional resonator in a filter provided by an embodiment of the present invention;

[0049] Figure 5 yes Figure 4 a see-through top view of the structure shown;

[0050] Figure 6 A transparent stereoscopic diagram of a signal terminal and a coupling structure in a filter provided by an embodiment of the present invention;

[0051] Figure 7 yes Figure 6 a see-through top view of the structure shown;

[0052] Figure 8 The embodiment of the present invention is based on Figure 1 The equivalent circuit schematic shown provides a see-through stereogram of the filter;

[0053] Fig. 9 yes Figure 8 a see-through top view of the structure shown;

[0054] Fig.10 yes Figure 8 Schematic diagram of reflection and transmission characteristics of the filter shown;

[0055] Fig.11 is a schematic diagram of an equivalent circuit of another filter with an additional reactance structure provided by an embodiment of the present invention;

[0056] Fig.12 The embodiment of the present invention is based on Fig.11 The equivalent circuit diagram shown provides a see-through stereogram of the filter;

[0057] Fig.13 yes Fig.12 A see-through stereogram of another viewing angle of the structure shown;

[0058] Fig.14 yes Fig.12 A schematic diagram of the structure shown when it is fixed to a mounting carrier;

[0059] Fig.15 yes Fig.12 Schematic diagram of reflection and transmission characteristics of the filter shown;

[0060] Fig.16 It is another filter transparent stereogram including an additional inductive structure according to an embodiment of the present invention. DETAILED DESCRIPTION

[0061] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0062] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0063] It should be understood that when an element or layer is referred to as being "on," "connected to," other elements or layers, it may be directly on or connected to other elements or layers, or there may be intervening elements or layers. It should be understood that although the terms first, second, etc. may be used to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer, or portion discussed below may be represented as a second element, component, region, layer, or portion; for example, a first direction may be referred to as a second direction, and similarly, a second direction may be referred to as a first direction; the first direction and the second direction are different directions.

[0064] Spatially relative terms such as "disposed on," "located above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, the element or feature described as "disposed on," "located above," will be oriented "below" the other elements or features. Therefore, the exemplary terms "disposed on" and "located above" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0065] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0066] Embodiments of the invention are described herein with reference to schematic diagrams that are idealized embodiments (and intermediate structures) of the invention, and variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances are contemplated. Thus, embodiments of the invention should not be limited to the particular shapes of the regions shown herein, but rather include deviations in shapes due to, for example, manufacturing techniques. The regions shown in the figures are schematic in nature, and their shapes do not represent the actual shapes of the regions of the device, and do not limit the scope of the invention.

[0067] An embodiment of the present invention provides a filter. Figure 1 is a schematic diagram of an equivalent circuit of a filter provided by an embodiment of the present invention, with reference to Figure 1 , the filter 1 includes a spatially coupled resonant structure, a first meander-type three-dimensional resonator, a second meander-type three-dimensional resonator, a first coupling structure, a second coupling structure, a third coupling structure, a first signal terminal, and a second signal terminal.

[0068] The first coupling structure is configured on a coupling path between the first meandering three-dimensional resonator and the second meandering three-dimensional resonator, the second coupling structure is configured on a coupling path between the first meandering three-dimensional resonator and the spatial coupling resonant structure, and the third coupling structure is configured on a coupling path between the second meandering three-dimensional resonator and the spatial coupling resonant structure. The first signal terminal is coupled to the first meandering three-dimensional resonator, and the second signal terminal is coupled to the second meandering three-dimensional resonator.

[0069] Specifically, the filter 1 has a first meander-type three-dimensional resonator 11, a second meander-type three-dimensional resonator 12, a spatial coupling resonant structure 21, a first coupling structure 41, a second coupling structure 42, and a third coupling structure 43. The spatial coupling resonant structure 21 includes a first conductor portion 51, a second conductor portion 52, a third conductor portion 53, a fourth conductor portion 54, a fifth conductor portion 55, a first conductive column 81, a second conductive column 82, a third conductive column 83, and a fourth conductive column 84. The first conductor portion 51, the second conductor portion 52, the third conductor portion 53, the fourth conductor portion 54, and the fifth conductor portion 55 are formed inside the stack 2 or on the surface of the stack 2. The first conductive column 81, the second conductive column 82, the third conductive column 83, and the fourth conductive column 84 penetrate the dielectric layer along the stacking direction. The stack 2 is formed by one or more dielectric layers arranged along the stacking direction. The spatially coupled resonant structure 21 is coupled to the first meander-type three-dimensional resonator 11 , and the spatially coupled resonant structure 21 is coupled to the second meander-type three-dimensional resonator 12 .

[0070] In one embodiment of the present invention, Figure 2 It is a transparent stereoscopic diagram of the spatially coupled resonant structure 21 in the filter 1 provided in an embodiment of the present invention.

[0071] Reference Figure 2, the first direction x, the second direction y and the stacking direction z are perpendicular to each other. The stack 2 is formed by stacking one or more dielectric layers along the stacking direction z, and the dielectric layer can be composed of one or more materials such as gallium arsenide, silicon carbide, silicon nitride, aluminum nitride, aluminum oxide, glass, silicon oxide, polyimide, etc. In this embodiment, the mounting surface is the surface of the mounting carrier, and the mounting carrier is located below the stack 2, which is used to mount or fix the filter 1, or to mount or fix a part of the structure of the filter 1, or to mount or fix any electronic device composed of the filter 1. The mounting carrier is a substrate including at least one layer of metallized material or at least one layer of dielectric layer, such as a PCB substrate, ABF substrate, FCBGA substrate, silicon-based adapter board, glass-based adapter board, etc. composed of at least one layer of metallized material and at least one layer of dielectric layer. In this embodiment, the filter is fixed on the FCBGA substrate through metallized micro-bumps (BGA, Bump, Cu-pillar, etc.), and is interconnected with other components such as power amplifiers and low-noise amplifiers to realize the function of the RF front-end module. In the spatial coupling resonant structure 21, the first conductor portion 51 and the second conductor portion 52 are formed into a shape extending in a straight line along the second direction y, and the width of the middle portion is smaller than the width of the two ends. The first conductor portion 51 and the second conductor portion 52 are arranged adjacent to each other, and there is a gap between them. The first conductor portion 51 and the second conductor portion 52 are arranged in parallel. The third conductor portion 53 is arranged below the first conductor portion 51 along the stacking direction z, and the third conductor portion 53 is arranged between the first conductor portion 51 and the mounting surface along the stacking direction z. The fourth conductor portion 54 is arranged below the second conductor portion 52 along the stacking direction z, and the fourth conductor portion 54 is arranged between the second conductor portion 52 and the mounting surface along the stacking direction z. The third conductor portion 53 and the fourth conductor portion 54 are arranged adjacent to each other, and there is a gap between them. The fifth conductor portion 55 is arranged below the third conductor portion 53 and the fourth conductor portion 54 along the stacking direction z, and the fifth conductor portion 55 is arranged between the third conductor portion 53 and the mounting surface along the stacking direction z, and the fifth conductor portion 55 is located between the fourth conductor portion 54 and the mounting surface along the stacking direction z, and the fifth conductor portion 55 is formed into a bent shape. When viewed from the stacking direction z, the structure of the fifth conductor portion 55 is approximately "U"-shaped. The fifth conductor portion 55 partially overlaps with the third conductor portion 53 and the fourth conductor portion 54 in the stacking direction z. The portions of the fifth conductor portion 55 and the third conductor portion 53 that face each other in the stacking direction z are coupled to form a first capacitive structure 91, and the portions of the fifth conductor portion 55 and the fourth conductor portion 54 that face each other in the stacking direction z are coupled to form a second capacitive structure 92.

[0072] The first conductive pillar 81 penetrates the dielectric layer of the laminate 2 along the stacking direction z, and one end is connected to the first conductor part 51, and the other end is connected to the third conductor part 53. The second conductive pillar 82 penetrates the dielectric layer of the laminate 2 along the stacking direction z, and one end is connected to the first conductor part 51, and the other end is coupled to the fifth conductor part 55 through the electrode E01. Thus, the first conductor part 51 is coupled to the first capacitive structure 91 through the first conductive pillar 81 and the second conductive pillar 82, and the first conductor part 51, the first capacitive structure 91, the first conductive pillar 81 and the second conductive pillar 82 and the coupling path therebetween form a first closed loop R1 in a three-dimensional space.

[0073] The third conductive pillar 83 penetrates the dielectric layer of the laminate 2 along the stacking direction z, and one end is connected to the second conductor part 52, and the other end is connected to the fourth conductor part 54. The fourth conductive pillar 84 penetrates the dielectric layer of the laminate 2 along the stacking direction z, and one end is connected to the second conductor part 52, and the other end is coupled to the fifth conductor part 55 through the electrode E01. Thus, the second conductor part 52 is coupled to the second capacitive structure 92 through the third conductive pillar 83 and the fourth conductive pillar 84, and the second conductor part 52, the second capacitive structure 92, the third conductive pillar 83 and the fourth conductive pillar 84 and the coupling path therebetween constitute a second closed loop R2 in three-dimensional space. The second closed loop R2 is magnetically coupled with the first closed loop R1 in space.

[0074] Please continue to refer to Figure 2 , along the first direction x, the contours of the first closed loop R1 and the second closed loop R2 partially overlap. Further, the projection contours of the first closed loop R1 and the second closed loop R2 on the plane perpendicular to the first direction x overlap or partially overlap each other.

[0075] The first conductor part 51, the second conductor part 52, the third conductor part 53, the fourth conductor part 54 and the fifth conductor part 55 can be made of one or more metallized materials such as Ag, Au, Cu, etc. The first conductive pillar 81, the second conductive pillar 82, the third conductive pillar 83 and the fourth conductive pillar 84 can be made of through holes made of one or more metallized materials such as Ag, Au, Cu, etc., or can be made of solid pillars made of one or more metallized materials such as Ag, Au, Cu, etc.

[0076] Furthermore, the fifth conductor portion 55 may be coupled to the outside through an interface in the form of a conductive bump, a BGA solder ball, a bump, a Cu-Pillar, etc.

[0077] For example, Figure 3 yes Figure 2 A through-view top view of the structure shown, see Figure 2 and Figure 3The first conductor portion 51 and the second conductor portion 52 of the spatial coupling resonant structure 21 are arranged adjacent to each other, the third conductor portion 53 and the fourth conductor portion 54 are arranged adjacent to each other, the projection of the first conductor portion 51 on the plane where the mounting surface is located does not overlap with the projection of the second conductor portion 52 on the plane where the mounting surface is located, and the projection of the third conductor portion 53 on the plane where the mounting surface is located does not overlap with the projection of the fourth conductor portion 54 on the plane where the mounting surface is located.

[0078] The projection of the fifth conductor portion 55 on the plane where the mounting surface is located partially overlaps with the projection of the third conductor portion 53 on the plane where the mounting surface is located. The projection of the fifth conductor portion 55 on the plane where the mounting surface is located partially overlaps with the projection of the fourth conductor portion 54 on the plane where the mounting surface is located.

[0079] The projection of the first capacitive structure 91 on the plane where the mounting surface is located at least partially overlaps with the projection of the first conductor portion 51 on the plane where the mounting surface is located, and the projection of the second capacitive structure 92 on the plane where the mounting surface is located at least partially overlaps with the projection of the second conductor portion 52 on the plane where the mounting surface is located. This structure can make the size of the spatial coupling resonant structure 21 more compact, which is conducive to the miniaturization of the filter.

[0080] In addition, in other variations, the fifth conductor portion 55 may be disposed above the third conductor portion 53 along the stacking direction z, that is, the third conductor portion 53 is disposed between the fifth conductor portion 55 and the mounting carrier along the stacking direction z. Alternatively, the fifth conductor portion 55 may be disposed above the fourth conductor portion 54 along the stacking direction z, that is, the fourth conductor portion 54 is disposed between the fifth conductor portion 55 and the mounting carrier along the stacking direction z.

[0081] On the basis of the above embodiments, in one embodiment of the present invention, the meander-type three-dimensional resonator comprises a sixth conductor portion, a seventh conductor portion, an eighth conductor portion, a fifth conductive pillar, and a sixth conductive pillar. The sixth conductor portion, the seventh conductor portion, and the eighth conductor portion are formed inside the laminate or on the surface of the laminate. The fifth conductive pillar and the sixth conductive pillar penetrate the dielectric layer along the stacking direction.

[0082] Specifically, Figure 4 1 is a perspective view of the first zigzag three-dimensional resonator 11 and the second zigzag three-dimensional resonator 12 in the filter 1 provided by the embodiment of the present invention. Figure 4, the first direction x, the second direction y and the stacking direction z are perpendicular to each other. The mounting surface is the surface of the mounting carrier, and the mounting carrier is located below the stack 2. The mounting carrier is a substrate including at least one layer of metallized material or at least one layer of dielectric layer, such as a PCB substrate, an ABF substrate, an FCBGA substrate, a silicon-based adapter board, a glass-based adapter board, etc., which are composed of at least one layer of metallized material and at least one layer of dielectric layer. In this embodiment, the filter is fixed on the FCBGA substrate through metallized micro-bumps (BGA, Bump, Cu-pillar, etc.), and is interconnected with other components such as a power amplifier and a low-noise amplifier to realize the function of the RF front-end module. In the first zigzag three-dimensional resonator 11, the sixth conductor portion 56 is formed into a meandering shape extending in a broken line and bending at least twice. When viewed from above, the main structure of the sixth conductor portion 56 is approximately "U"-shaped. The seventh conductor portion 57 is located below the sixth conductor portion 56 along the stacking direction z, and is composed of a first connecting segment 71 and a second connecting segment 72. There is a gap between the first connecting segment 71 and the second connecting segment 72, and they are not directly interconnected. Figure 4 In the example, the first connection section 71 and the second connection section 72 are arranged perpendicular to each other. The eighth conductor part 58 is located below the seventh conductor part 57 along the stacking direction and is connected to the second connection section 72 through a conductor. The fifth conductive pillar 85 penetrates the dielectric layer of the laminate 2 along the stacking direction, one end of which is connected to the sixth conductor part 56, and the other end of which is connected to the first connection section 71. The sixth conductive pillar 86 penetrates the dielectric layer of the laminate 2 along the stacking direction, one end of which is connected to the sixth conductor part 56, and the other end of which is connected to the second connection section 72. Partial coupling between the eighth conductor part 58 and the first connection section 71 formed in different dielectric layers and facing each other forms a third capacitive structure 93. The sixth conductor part 56 is coupled to the third capacitive structure 93 through the fifth conductive pillar 85 and the sixth conductive pillar 86. The sixth conductor part 55, the third capacitive structure 93, the fifth conductive pillar 85, the sixth conductive pillar 86, the second connection section 72 and the coupling paths therebetween form a third closed loop R3 in a three-dimensional space. The sixth conductor part 56, the seventh conductor part 57, and the eighth conductor part 58 may be made of one or more metallized materials such as Ag, Au, and Cu. The fifth conductive pillar 85 and the sixth conductive pillar 86 may be made of through holes made of one or more metallized materials such as Ag, Au, and Cu, or may be made of solid pillars made of one or more metallized materials such as Ag, Au, and Cu.

[0083] In the second zigzag three-dimensional resonator 12, the sixth conductor portion 59 is formed in a meandering shape extending along a zigzag line and bending at least twice, and when viewed from above, the main structure of the sixth conductor portion 54 is a zigzag shape. The seventh conductor portion 60 is located below the sixth conductor portion 59 along the stacking direction, and is composed of a first connecting segment 73 and a second connecting segment 74. There is a gap between the first connecting segment 73 and the second connecting segment 74, and they are not directly connected. Figure 4In the example, the first connection section 73 and the second connection section 74 are arranged vertically. The eighth conductor part 61 is located below the seventh conductor part 60 along the stacking direction and is connected to the second connection section 74 through a conductor. The fifth conductive pillar 87 penetrates the dielectric layer of the stacked body 2 along the stacking direction, one end of which is connected to the sixth conductor part 59, and the other end of which is connected to the first connection section 73. The sixth conductive pillar 88 penetrates the dielectric layer of the stacked body 2 along the stacking direction, one end of which is connected to the sixth conductor part 59, and the other end of which is connected to the second connection section 74. Partial coupling between the eighth conductor part 61 and the first connection section 73 formed in different dielectric layers and facing each other forms a third capacitive structure 94. The sixth conductor part 59 is coupled to the third capacitive structure 94 through the fifth conductive pillar 87 and the sixth conductive pillar 88. The sixth conductor part 59, the third capacitive structure 94, the fifth conductive pillar 87, the sixth conductive pillar 88, the second connection section 74 and the coupling paths therebetween form a third closed loop R4 in a three-dimensional space. The sixth conductor portion 59, the seventh conductor portion 60, and the eighth conductor portion 61 may be made of one or more metallized materials such as Ag, Au, and Cu. The fifth conductive pillar 87 and the sixth conductive pillar 88 may be made of through holes made of one or more metallized materials such as Ag, Au, and Cu, or may be made of solid pillars made of one or more metallized materials such as Ag, Au, and Cu.

[0084] The first meandering three-dimensional resonator 11 and the second meandering three-dimensional resonator 12 can be electrically coupled to the outside through interfaces in the form of conductive bumps, BGA solder balls, bumps, Cu-pillars, etc.

[0085] Optionally, the sixth conductor portion (56 / 59) is arranged to have a consistent width, or the sixth conductor portion (56 / 59) has different widths at least in some positions. In addition, the sixth conductor portion (56 / 59) may include a third connecting segment, a fourth connecting segment and a fifth connecting segment, the third connecting segment is arranged perpendicularly to the fourth connecting segment, the fourth connecting segment is arranged perpendicularly to the fifth connecting segment, and the third connecting segment and the fifth connecting segment are located on the same side of the fourth connecting segment relative to the fourth connecting segment.

[0086] For example, Figure 5 yes Figure 4 A through-view top view of the structure shown, see Figure 4 and Figure 5, the sixth conductor part 56 includes a third connecting section S1, a fourth connecting section S2 and a fifth connecting section S3. The third connecting section S1 is perpendicular to the fourth connecting section S2, the fourth connecting section S2 is perpendicular to the fifth connecting section S3, the third connecting section S1 is parallel to the fifth connecting section S3, and the third connecting section S1 and the fifth connecting section S3 are located on the same side of the fourth connecting section S2. The sixth conductor part 59 includes a third connecting section S4, a fourth connecting section S5 and a fifth connecting section S6. The third connecting section S4 is perpendicular to the fourth connecting section S5, the fourth connecting section S5 is perpendicular to the fifth connecting section S6, the third connecting section S4 is parallel to the fifth connecting section S6, and the third connecting section S4 and the fifth connecting section S6 are located on the same side of the fourth connecting section S2. The sixth conductor part 56 is configured such that the width of the outer contour is different at some positions, and the width of the two ends is wider than the middle part. The sixth conductor part 59 is configured such that the width of the outer contour is different at some positions, and the width of the two ends is wider than the middle part.

[0087] Please continue to refer to Figure 4 and Figure 5 The projection of the eighth conductor portion 58 of the first zigzag 3D resonator 11 on the plane where the mounting surface is located partially overlaps with the projection of the seventh conductor portion 57 on the plane where the mounting surface is located, and the projection of the third capacitive structure 93 on the plane where the mounting surface is located at least partially overlaps with the projection of the sixth conductor portion 56 on the plane where the mounting surface is located, making the size of the first zigzag 3D resonator 11 more compact. The projection of the eighth conductor portion 61 of the second zigzag 3D resonator 12 on the plane where the mounting surface is located partially overlaps with the projection of the seventh conductor portion 60 on the plane where the mounting surface is located, and the projection of the third capacitive structure 94 on the plane where the mounting surface is located at least partially overlaps with the projection of the sixth conductor portion 59 on the plane where the mounting surface is located, making the size of the first zigzag 3D resonator 12 more compact.

[0088] On the basis of the above embodiments, in one embodiment of the present invention, the first coupling structure, the second coupling structure, and the third coupling structure are all composed of at least two metallized electrodes facing each other, and the projections of at least two metallized electrodes on the plane where the mounting surface is located partially overlap. In other words, the first coupling structure is formed by stacking metallized electrodes facing each other in the dielectric layer in a stacking direction.

[0089] Optionally, the first coupling structure includes a first metallized electrode, a second metallized electrode and a third metallized electrode; the second metallized electrode partially overlaps with the projection of the first metallized electrode on the plane where the mounting surface is located; the second metallized electrode partially overlaps with the projection of the third metallized electrode on the plane where the mounting surface is located, and the overlapping portion of the projection of the second metallized electrode and the first metallized electrode on the plane where the mounting surface is located does not partially overlap or intersect with the overlapping portion of the projection of the second metallized electrode and the third metallized electrode on the plane where the mounting surface is located.

[0090] Specifically, the first coupling structure 41 is formed by stacking five metallized electrodes facing each other in the stacking direction, the second coupling structure 42 is formed by stacking three metallized electrodes facing each other in the stacking direction, and the third coupling structure 43 is formed by stacking three metallized electrodes facing each other in the stacking direction.

[0091] In other embodiments of the present invention, the first coupling structure is composed of a pair of metallized electrodes coupled in a facing relationship, the second coupling structure is composed of a pair of metallized electrodes coupled in a facing relationship, and the third coupling structure is composed of a pair of metallized electrodes coupled in a facing relationship.

[0092] Figure 6 A transparent stereoscopic diagram of a first signal terminal, a second signal terminal, a first coupling structure, a second coupling structure and a third coupling structure in a filter provided by an embodiment of the present invention. Figure 7 for Figure 6 Top view of the structure. Figure 6, the first direction x, the second direction y and the stacking direction z are perpendicular to each other. The mounting carrier is located below the stack 2. The mounting carrier is a substrate including at least one layer of metallized material or at least one layer of dielectric layer, such as a PCB substrate, an ABF substrate, an FCBGA substrate, a silicon-based adapter board, a glass-based adapter board, etc., which are composed of at least one layer of metallized material and at least one layer of dielectric layer. In this embodiment, the filter is fixed on the FCBGA substrate through metallized micro-bumps (BGA, Bump, Cu-pillar, etc.), and is interconnected with other components such as a power amplifier and a low-noise amplifier to realize the function of the RF front-end module. The first signal terminal 31 and the second signal terminal 32, the first coupling structure 41, the second coupling structure 42, and the third coupling structure 43 are formed inside the stack 2 or on the surface of the stack 2. The first signal terminal 31 is connected to one end of the first coupling structure 41, and the first signal terminal 32 is connected to the other end of the first coupling structure 41. The first signal terminal 31 includes an electrode E02 and an electrode E03, and the electrode E02 and the electrode E03 are connected in the stacking direction via a conductor, and the second signal terminal 32 includes an electrode E04 and an electrode E05, and the electrode E04 and the electrode E05 are connected in the stacking direction via a conductor. The electrode E02, the electrode E03, the electrode E04 and the electrode E05 can be composed of one or more metallized materials such as Ag, Au, Cu, etc. The first coupling structure 41 includes electrodes E06, E07, E08, E09 and E10, wherein electrode E07 is formed below electrode E06, electrode E06 and electrode E07 face each other and their projections on a plane perpendicular to the stacking direction overlap, electrode E08 is formed above electrode E07, electrode E08 is not connected to electrode E06, electrode E08 and electrode E07 face each other and their projections on a plane perpendicular to the stacking direction overlap, electrode E09 is formed below electrode E08, is not connected to electrode E07, electrode E09 and electrode E08 face each other and their projections on a plane perpendicular to the stacking direction overlap, and electrode E10 is formed above electrode E09, electrode E10 is not connected to electrode E08, electrode E09 and electrode E10 face each other and their projections on a plane perpendicular to the stacking direction overlap. Electrode E06, electrode E07, electrode E08, electrode E09 and electrode E10 are coupled through a dielectric layer therebetween to form a first coupling structure 41. Electrode E06, electrode E07, electrode E08, electrode E09 and electrode E10 may be made of one or more metallized materials such as Ag, Au, Cu, etc. Electrode E06 of the first coupling structure 41 is connected to electrode E03 of the first signal terminal 31, and electrode E10 of the first coupling structure 41 is connected to electrode E05 of the second signal terminal 32.

[0093] The second coupling structure 42 includes electrode E11, electrode E12 and electrode E13, wherein electrode E12 is formed below electrode E11, electrode E12 and electrode E11 face each other and their projections on a plane perpendicular to the stacking direction overlap, electrode E13 is formed above electrode E12, electrode E13 is not connected to electrode E11, electrode E13 and electrode E12 face each other and their projections on a plane perpendicular to the stacking direction overlap, and electrodes E11, electrode E12 and electrode E13 are coupled through a dielectric layer therebetween to form the second coupling structure 42.

[0094] The third coupling structure 43 includes electrode E14, electrode E15 and electrode E16, wherein electrode E15 is formed below electrode E14, electrode E15 and electrode E14 face each other and their projections on a plane perpendicular to the stacking direction overlap, electrode E16 is formed above electrode E15, electrode E16 is not connected to electrode E14, electrode E16 and electrode E15 face each other and their projections on a plane perpendicular to the stacking direction overlap, and electrodes E14, electrode E15 and electrode E16 are coupled through a dielectric layer therebetween to form the third coupling structure 43.

[0095] Optionally, the first coupling structure 41 may share the same metallized electrode with the first signal terminal 31, and / or the first coupling structure 41 may share the same metallized electrode with the second signal terminal 32. For example, in the above embodiment, the electrode E06 and the electrode E03 are formed as the same metallized electrode, or the electrode E10 and the electrode E05 are formed as the same metallized electrode.

[0096] Reference Figure 7 , the projection S7 of the first coupling structure 41 on the plane where the mounting surface is located is sandwiched between the projection S8 of the first signal terminal 31 on the plane where the mounting surface is located and the projection S9 of the second signal terminal 32 on the plane where the mounting surface is located. The overlapping portion of the projections of the electrode E12 and the electrode E11 on the plane where the mounting surface is located does not overlap and does not intersect with the overlapping portion of the projections of the electrode E13 and the electrode E12 on the plane where the mounting surface is located. The overlapping portion of the projections of the electrode E15 and the electrode E14 on the plane where the mounting surface is located is spaced from the overlapping portion of the projections of the electrode E15 and the electrode E16 on the plane where the mounting surface is located, and does not overlap or intersect.

[0097] In addition, in other embodiments of the present invention, the first coupling structure may also have a partially metallized electrode formed above the eighth conductor portion, and coupled to the first zigzag three-dimensional resonator or the second zigzag three-dimensional resonator through a conductive column. For example, it may be formed that one electrode of the first coupling structure 41 is coupled to the first zigzag three-dimensional resonator 11 through a seventh conductive column, and another electrode of the first coupling structure 41 is coupled to the second zigzag three-dimensional resonator through an eighth conductive column, the seventh conductive column and the eighth conductive column extend in the stacking direction z in the stacking body 2, and the eighth conductor portion 58 of the first zigzag three-dimensional resonator 11 and the eighth conductor portion 61 of the second zigzag three-dimensional resonator are located between at least one electrode of the first coupling structure 41 and the mounting carrier along the stacking direction z.

[0098] Based on the above embodiments, in one embodiment of the present invention, according to Figure 1 The circuit schematic diagram shown provides a filter 1 such as Figure 8 As shown. The first direction x, the second direction y and the stacking direction z are perpendicular to each other. The mounting carrier is located below the stack 2, and is used to mount or fix the filter 1, or to mount or fix a part of the structure of the filter 1, or to mount or fix any electronic device composed of the filter 1. The mounting carrier is a substrate including at least one layer of metallized material or at least one layer of dielectric layer, such as a PCB substrate, ABF substrate, FCBGA substrate, silicon-based adapter board, glass-based adapter board, etc. composed of at least one layer of metallized material and at least one layer of dielectric layer. In this embodiment, the filter is mounted on the FCBGA substrate through metallized micro-bumps (BGA, Bump, Cu-pillar, etc.) for fixation, and is interconnected with other components such as a power amplifier and a low-noise amplifier to realize the function of the RF front-end module. The second coupling structure 42 is configured to be sandwiched between the first zigzag three-dimensional resonator 11 and the spatial coupling resonant structure 21, and one end of the second coupling structure 42 is connected to the first zigzag three-dimensional resonator 11, and the other end is connected to the spatial coupling resonant structure 21. The third coupling structure 43 is arranged between the second meandering three-dimensional resonator 12 and the spatially coupled resonant structure 21 . One end of the third coupling structure 43 is connected to the second meandering three-dimensional resonator 12 , and the other end is connected to the spatially coupled resonant structure 21 .

[0099] The first meandering three-dimensional resonator 11 , the second meandering three-dimensional resonator 12 , and the spatial coupling resonant structure 21 are all disposed on the same side of the first coupling structure 41 .

[0100] refer to Figure 8, the first meandering three-dimensional resonator 11, the second meandering three-dimensional resonator 12 and the spatial coupling resonant structure 21 are arranged in sequence along the first direction x. Further, the projection contours of the first meandering three-dimensional resonator 11, the second meandering three-dimensional resonator 12 and the spatial coupling resonant structure 21 on the plane perpendicular to the first direction x overlap or partially coincide.

[0101] Specifically, Figure 8 As shown, the first signal terminal 31 is connected to the first meander type three-dimensional resonator 11 via the electrode E03, and the second signal terminal 32 is connected to the second meander type three-dimensional resonator 12 via the electrode E05.

[0102] The electrode E06 of the first coupling structure 41 is connected to the first connection segment 71 of the first zigzag three-dimensional resonator 11 via the electrode E03, and the electrode E10 of the first coupling structure 41 is connected to the first connection segment 73 of the second zigzag three-dimensional resonator 12 via the electrode E05. The electrode E11 of the second coupling structure 42 is connected to the first connection segment 71 of the first zigzag three-dimensional resonator 11, and the electrode E13 of the second coupling structure 42 is connected to the third conductor portion 53 of the spatial coupling resonant structure 21, so that coupling is formed between the first zigzag three-dimensional resonator 11 and the spatial coupling resonant structure 21. The electrode E14 of the third coupling structure 43 is connected to the first connection segment 73 of the second zigzag three-dimensional resonator 12, and the electrode E14 of the third coupling structure 43 is connected to the fourth conductor portion 54 of the spatial coupling resonant structure 21, so that coupling is formed between the second zigzag three-dimensional resonator 12 and the spatial coupling resonant structure 21. That is, the first coupling structure 41 is configured on the coupling path between the first meander type three-dimensional resonator 11 and the second meander type three-dimensional resonator 12, the second coupling structure 42 is configured on the coupling path between the first meander type three-dimensional resonator 11 and the spatial coupling resonant structure 21, and the third coupling structure 43 is configured on the coupling path between the second meander type three-dimensional resonator 12 and the spatial coupling resonant structure 21.

[0103] In the first direction x, the first conductive pillar 81, the second conductive pillar 82, the third conductive pillar 83 and the fourth conductive pillar 84 are sandwiched between the fifth conductive pillar 85 of the first zigzag three-dimensional resonator and the fifth conductive pillar 87 of the second zigzag three-dimensional resonator. Further, the projections of the first conductive pillar 81, the second conductive pillar 81, the third conductive pillar 83 and the fourth conductive pillar 84 on the plane perpendicular to the second direction y are sandwiched between the projections of at least one conductive pillar of the first zigzag three-dimensional resonator 11 on the plane perpendicular to the second direction y and the projections of at least one conductive pillar of the second zigzag three-dimensional resonator 12 on the plane perpendicular to the second direction y, and the second direction y is perpendicular to the first direction x.

[0104] Part of the conductor routing of the sixth conductor portion 56 of the first meandering three-dimensional resonator 11 is parallel to the first conductor portion 51 of the spatial coupling resonant structure 21, and part of the conductor routing of the sixth conductor portion 59 of the second meandering three-dimensional resonator 12 is parallel to the second conductor portion 52 of the spatial coupling resonant structure 21. Along the first direction x, the third closed loop R3 of the first meandering three-dimensional resonator 11 and the first closed loop R1 of the spatial coupling resonant structure 21 partially overlap, that is, there is an overlap between the projection contours of the first meandering three-dimensional resonator 11 and the spatial coupling resonant structure 21 on the plane perpendicular to the first direction x. Along the first direction x, the third closed loop R4 of the second meandering three-dimensional resonator 12 and the second closed loop R2 of the spatial coupling resonant structure 21 partially overlap, that is, there is an overlap between the projection contours of the second meandering three-dimensional resonator 12 and the spatial coupling resonant structure 21 on the plane perpendicular to the first direction x. This layout is conducive to spatial coupling of the spatially coupled resonant structure 21 with the first meandering three-dimensional resonator 11, and spatial coupling of the spatially coupled resonant structure 21 with the second meandering three-dimensional resonator 12. The spatially coupled resonant structure 21 is configured to be sandwiched between the first meandering three-dimensional resonator 11 and the second meandering three-dimensional resonator 12, which is conducive to adjusting the coupling amount between the first meandering three-dimensional resonator 11 and the spatially coupled resonant structure 21, and the coupling amount between the second meandering three-dimensional resonator 12 and the spatially coupled resonant structure 21.

[0105] The spatially coupled resonant structure 21 is disposed at a position sandwiched between the first meandering three-dimensional resonator 11 and the second meandering three-dimensional resonator 12 .

[0106] In addition, in other embodiments, one or more supporting members are further provided under the stacked body 2 to fix the stacked body 2 to the mounting carrier. The supporting member may be one or more structures such as BGA solder balls, BUMPs, and Cu-Pillars.

[0107] Fig. 9 yes Figure 8 Please combine the transparent top view of the structure shown in Figure 8 The projection of the spatial coupling resonant structure 21 on the plane where the mounting surface is located is sandwiched between the projection of the first zigzag three-dimensional resonator 11 on the plane where the mounting surface is located and the projection of the second zigzag three-dimensional resonator 12 on the plane where the mounting surface is located. This layout is conducive to improving the space utilization of the filter layout and realizing a miniaturized structure.

[0108] Part of the structure of the sixth conductor portion 56 is formed above the second coupling structure 42, and the projection of the second coupling structure 42 on the plane where the mounting surface is located at least partially overlaps with the projection of the sixth conductor portion 56 of the first zigzag three-dimensional resonator 11 on the plane where the mounting surface is located. Part of the structure of the sixth conductor portion 59 is formed above the third coupling structure 43, and the projection of the third coupling structure 43 on the plane where the mounting surface is located at least partially overlaps with the projection of the sixth conductor portion 59 of the second zigzag three-dimensional resonator on the plane where the mounting surface is located. This layout is conducive to further reducing the size of the filter.

[0109] The projections of the first meandering three-dimensional resonator 11, the second meandering three-dimensional resonator 12 and the spatial coupling resonant structure 21 on the plane where the mounting surface is located are all located on the same side of the projection of the first coupling structure 41 on the plane where the mounting surface is located. This layout can further improve space utilization and is conducive to the miniaturization of the filter structure.

[0110] The zigzag three-dimensional resonator and spatial coupling resonance structure are composed of conductor parts on different horizontal planes and conductive columns extending along the stacking direction to form a three-dimensional resonance unit, which is easy to achieve a smaller size than a planar resonance unit, which is conducive to the miniaturization of the filter. The three-dimensional resonance unit is easy to achieve a higher quality factor, which is conducive to achieving excellent out-of-band suppression. The internal layout of the filter is very compact, and the miniaturization performance is outstanding. Fig.10 yes Figure 8 An S-parameter characteristic diagram of the filter shown. Fig.10 The first meander-type three-dimensional resonator 11, the second meander-type three-dimensional resonator 12, the spatial coupling resonant structure 21 and the first to third coupling structures form a multi-path electric / magnetic hybrid coupling, generating three transmission zeros TZ1, TZ2 and TZ3, and the filter has excellent frequency selection performance. The transmission zeros TZ1 and TZ2 are on the left side of the passband, which improves the frequency selectivity on the left side of the passband, and the transmission zero TZ3 is on the right side of the passband, which improves the frequency selectivity on the right side of the passband.

[0111] Based on the above embodiments, in one embodiment of the present invention, Fig.11 is a schematic diagram of an equivalent circuit of another filter provided by an embodiment of the present invention, with reference to Fig.11The filter 1A has a first meander type three-dimensional resonator 11, a second meander type three-dimensional resonator 12, a spatial coupling resonant structure 21, a first signal terminal 31, a second signal terminal 32, a first coupling structure 41, a second coupling structure 42, a third coupling structure 43, a first connection terminal 101, a second connection terminal 102, a third connection terminal 103, an additional reactance structure 111, an additional reactance structure 112 and an additional reactance structure 113. The additional reactance structure 111 is arranged on a coupling path between the first connection terminal 101 and the first meander type three-dimensional resonator 11. The additional reactance structure 112 is arranged on a coupling path between the second connection terminal 102 and the second meander type three-dimensional resonator 12. The additional reactance structure 113 is arranged on a coupling path between the third connection terminal 103 and the spatial coupling resonant structure 21.

[0112] The first signal terminal 31, the second signal terminal 32, the first connection terminal 101, the second connection terminal 102, the third connection terminal 103, the additional reactance structure 111, the additional reactance structure 112 and the additional reactance structure 113 can be made of one or more metallized materials such as Ag, Au, Cu, etc. The first connection terminal 101, the second connection terminal 102 and the third connection terminal 103 are used to connect to the reference ground.

[0113] Reference Fig.12 , and combined with Fig.11, the first direction x, the second direction y and the stacking direction z are perpendicular to each other. The mounting carrier is located below the stack 2, and is used to mount or fix the filter 1A, or to mount or fix a part of the structure of the filter 1A, or to mount or fix any electronic device composed of the filter 1A. The mounting carrier is a substrate including at least one layer of metallized material or at least one layer of dielectric layer, such as a PCB substrate, ABF substrate, FCBGA substrate, silicon-based adapter board, glass-based adapter board, etc. composed of at least one layer of metallized material and at least one layer of dielectric layer. In this embodiment, the filter is fixed on the FCBGA substrate through metallized micro-bumps (BGA, Bump, Cu-pillar, etc.), and is interconnected with other components such as a power amplifier and a low-noise amplifier to realize the function of the RF front-end module. The fifth conductor portion 55 is connected to the additional reactance structure 113 through a conductive bump 121, that is, the additional reactance structure 113 is coupled to the spatial coupling resonant structure 21. The eighth conductor portion 58 is connected to the additional reactance structure 111 through the conductive bump 122, that is, the additional reactance structure 111 is coupled to the first meander-type three-dimensional resonator 11. The eighth conductor portion 61 is connected to the additional reactance structure 112 through the conductive bump 123, that is, the additional reactance structure 112 is coupled to the second meander-type three-dimensional resonator 12. The additional reactance structure 111 and the additional reactance structure 112 are formed into a meandering shape extending in a broken line and bending multiple times. The additional reactance structure 113 is formed in a rectangular shape, extending outward from the position connected to the conductive bump 121. The additional reactance structure 111 is composed of elements whose imaginary part of admittance is less than zero, with port Port1 and port Port2 as the two ports of the additional reactance structure 111 respectively. The relationship between the voltage and current between port Port1 and port2 can be represented by the admittance matrix [Y]. In the admittance matrix [Y] of the additional reactance structure 111 within the filter operating band, Y 11 The imaginary part of the admittance is less than zero, which shows as reactance inductance. Similarly, the additional reactance structure 112 and the additional reactance structure 113 are also composed of elements whose imaginary part of admittance is less than zero, which shows as reactance inductance within the filter operating frequency band. The first connection terminal 101 is formed at the end of the additional reactance structure 111, and is used to connect to the reference ground. The second connection terminal 102 is formed at the end of the additional reactance structure 112, and is used to connect to the reference ground. The third connection terminal 103 is formed at the end of the additional reactance structure 113, and is used to connect to the reference ground.

[0114] Reference Fig.14, the additional reactance structure 111, the additional reactance structure 112 and the additional reactance structure 113 are all formed on the surface of the mounting carrier. The advantage of this arrangement is that the space on the mounting carrier below the filter can be effectively utilized, the size of the filter can be further reduced, and a miniaturized design of the filter can be achieved. In other embodiments of the present invention, the additional reactance structure 111, the additional reactance structure 112 and the additional reactance structure 113 can also be formed inside the mounting carrier, or inside the stack 2, or on the surface of the stack 2.

[0115] Reference Fig.15 ,compared to Figure 8 The filter 1 shown does not include an additional reactance structure. The filter 1A of the embodiment of the present invention generates three additional controllable transmission zeros without configuring additional resonance units through the combined action of the additional reactance structure 111, the additional reactance structure 112 and the additional reactance structure 113 with the zigzag three-dimensional resonator and the spatial coupling resonance structure, thereby realizing the frequency response characteristics of six out-of-band transmission zeros, and the filter has excellent frequency selectivity. The filter structure is compact and has outstanding miniaturization performance.

[0116] In addition, in other embodiments of the present invention, the structure of the additional reactance structure 111 or the additional reactance structure 112 or the additional reactance structure 113 can also be formed so that its projection on the plane where the installation surface is located is formed by at least one of a straight line, a broken line, an arc line, and a spiral extending from a point.

[0117] In addition, in other embodiments of the present invention, the additional reactance structure 111 or the additional reactance structure 112 or the additional reactance structure 113 may also be composed of elements whose imaginary part of the admittance is greater than zero, that is, Y in the admittance matrix [Y] of the additional reactance structure within the filter operating frequency band is 11 The imaginary part of is greater than zero. The additional reactance structure can be formed by coupling a plurality of metallized electrodes.

[0118] On the basis of the above embodiments, in a variation of the present invention, an additional inductive structure L1 is further included, and the additional inductive structure L1 is arranged on the coupling path between the first meandering three-dimensional resonator 11 and the second meandering three-dimensional resonator 12. Fig.16, the first direction x, the second direction y and the stacking direction z are perpendicular to each other. The stack 2 is formed by stacking one or more dielectric layers along the stacking direction z, and the dielectric layer can be composed of one or more materials such as gallium arsenide, silicon carbide, silicon nitride, aluminum nitride, aluminum oxide, glass, silicon oxide, polyimide, etc. In this embodiment, the mounting surface is the surface of the mounting carrier, and the mounting carrier is located below the stack 2. The mounting carrier is a substrate including at least one layer of metallized material or at least one layer of dielectric layer, such as a PCB substrate, ABF substrate, FCBGA substrate, silicon-based adapter board, glass-based adapter board, etc. composed of at least one layer of metallized material and at least one layer of dielectric layer. In this embodiment, the filter is fixed on the FCBGA substrate through metallized micro-bumps (BGA, Bump, Cu-pillar, etc.), and is interconnected with other components such as power amplifiers and low-noise amplifiers to realize the function of the RF front-end module. The additional inductive structure L1 is formed above the first coupling structure 41 along the stacking direction z. The first coupling structure 41 is located between the additional inductive structure L1 and the mounting carrier. The distance between the additional inductive structure L1 and the mounting surface is greater than the distance between the first coupling structure 41 and the mounting surface. The projection of the additional inductive structure L1 on the mounting surface partially overlaps with the projection of the first coupling structure 41 on the mounting surface. The additional inductive structure L1 is formed into a shape with multiple bends. Port 3 and Port 4 are ports formed on the additional inductive structure L1. The relationship between the voltage and current between Port 3 and Port 4 can be represented by the admittance matrix [Y]'. In the admittance matrix [Y]', Y 33 The imaginary part of is less than zero, and the additional inductive structure L1 exhibits reactance inductance within the working frequency band. The additional inductive structure L1 can be composed of one or more metallized materials such as Ag, Au, Cu, etc. One end of the additional inductive structure L1 is coupled to the electrode E06 of the first coupling structure 41 through the ninth conductive column 89, and the other end of the additional inductive structure L1 is coupled to the electrode E10 of the first coupling structure 41 through the tenth conductive column 90. The ninth conductive column 89 and the tenth conductive column 90 can be composed of through holes composed of one or more metallized materials such as Ag, Au, Cu, etc., or can be composed of solid columns composed of one or more metallized materials such as Ag, Au, Cu, etc.

[0119] The additional inductive structure L1 works together with the first meander-type three-dimensional resonator 11 and the second meander-type three-dimensional resonator 12 to introduce additional out-of-band transmission zeros, further improving the frequency selection performance of the filter.

[0120] In addition, the additional inductive structure can be formed by extending at least one of a straight line, a broken line, an arc line, and a spiral line from a point on a projection on a plane perpendicular to the stacking direction. For example, in other embodiments or variations, the additional inductive structure can be formed in a spiral or arc shape.

[0121] In addition, the additional inductive structure may be at least partially disposed on the surface of the mounting carrier or inside the mounting carrier, and coupled with the first meandering three-dimensional resonator and the second meandering three-dimensional resonator in the form of conductive bumps, solder balls, etc. For example, when the mounting carrier is a PCB substrate, the additional inductive structure may be formed as a metallized trace on the surface of the PCB substrate, or the additional inductive structure may be formed as a metallized trace inside the PCB substrate.

[0122] In addition, a portion of the additional inductive structure may be formed on the same horizontal plane as a metallized electrode of the first coupling structure. In addition, the additional inductive structure may share the same metallized electrode with the first coupling structure. The additional inductive structure may also share the same metallized electrode with the first signal terminal or the second signal terminal.

[0123] The embodiment of the present invention further provides an electronic device, comprising the filter described in any of the above embodiments, which has the same technical effect and will not be described in detail here.

[0124] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features of the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0125] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A filter, comprising: A stack comprising one or more dielectric layers arranged along a stacking direction; A spatially coupled resonant structure, the spatially coupled resonant structure comprising a first conductor portion, a second conductor portion, a third conductor portion, a fourth conductor portion, a fifth conductor portion, a first conductive pillar, a second conductive pillar, a third conductive pillar, and a fourth conductive pillar; the first to fifth conductor portions are formed inside the laminate or on the surface of the laminate, the third conductor portion is arranged between the first conductor portion and the mounting surface along the stacking direction, the fourth conductor portion is arranged between the second conductor portion and the mounting surface along the stacking direction, the fifth conductor portion is arranged between the first conductor portion and the mounting surface along the stacking direction, and the fifth conductor portion is arranged between the second conductor portion and the mounting surface along the stacking direction; the mounting surface is the surface of a mounting carrier, the mounting carrier is a carrier for mounting or fixing the filter, or a carrier for mounting or fixing a partial structure of the filter, or a carrier for mounting or fixing any electronic device composed of the filter; the first conductive pillar, the second conductive pillar, the third conductive pillar, and the fourth conductive pillar extend in the laminate along the stacking direction; A zigzag three-dimensional resonator, comprising a first zigzag three-dimensional resonator and a second zigzag three-dimensional resonator, wherein the zigzag three-dimensional resonator comprises a sixth conductor portion, a seventh conductor portion, an eighth conductor portion, a fifth conductive column, and a sixth conductive column; the sixth conductor portion, the seventh conductor portion, and the eighth conductor portion are formed inside the stack or on the surface of the stack and are stacked along the stacking direction; the fifth conductive column and the sixth conductive column extend in the stack along the stacking direction; a first coupling structure, a second coupling structure and a third coupling structure, wherein the first to third coupling structures are all formed by metallized electrode coupling formed inside the stack or on the surface of the stack; the first coupling structure is arranged on a coupling path between the first zigzag three-dimensional resonator and the second zigzag three-dimensional resonator, the second coupling structure is arranged on a coupling path between the first zigzag three-dimensional resonator and the spatial coupling resonant structure, and the third coupling structure is arranged on a coupling path between the second zigzag three-dimensional resonator and the spatial coupling resonant structure; as well as, a first signal terminal and a second signal terminal, the first signal terminal being coupled to the first meandering three-dimensional resonator, and the second signal terminal being coupled to the second meandering three-dimensional resonator; The spatially coupled resonant structure is coupled to the first meandering three-dimensional resonator, and the spatially coupled resonant structure is coupled to the second meandering three-dimensional resonator; The spatially coupled resonant structure is configured to be sandwiched between the first meander type three-dimensional resonator and the second meander type three-dimensional resonator; The projection profiles of the first meandering three-dimensional resonator, the second meandering three-dimensional resonator and the spatially coupled resonant structure on a plane perpendicular to the first direction overlap or partially coincide; The projections of the first conductive column, the second conductive column, the third conductive column and the fourth conductive column on the plane perpendicular to the second direction are sandwiched between the projection of at least one conductive column of the first zigzag three-dimensional resonator on the plane perpendicular to the second direction and the projection of at least one conductive column of the second zigzag three-dimensional resonator on the plane perpendicular to the second direction, and the second direction is perpendicular to the first direction.

2. The filter according to claim 1, characterized in that The outer contour of the first conductor part is set to have a uniform width, or the outer contour of the first conductor part has different widths at least in some positions; the outer contour of the second conductor part is set to have a uniform width, or the outer contour of the second conductor part has different widths at least in some positions; the first conductor part and the second conductor part are arranged adjacent to each other, there is a gap between the first conductor part and the second conductor part, and the projection of the first conductor part on the mounting surface or the surface perpendicular to the stacking direction does not overlap with the projection of the second conductor part on the mounting surface or the surface perpendicular to the stacking direction; The third conductor portion is disposed adjacent to the fourth conductor portion, a gap exists between the third conductor portion and the fourth conductor portion, and a projection of the third conductor portion on the mounting surface or a surface perpendicular to the stacking direction does not overlap with a projection of the fourth conductor portion on the mounting surface or a surface perpendicular to the stacking direction; The fifth conductor portion is formed into a bent shape; The projection of the fifth conductor portion on the mounting surface or the surface perpendicular to the stacking direction overlaps with the projection of the third conductor portion on the mounting surface or the surface perpendicular to the stacking direction and the projection of the fourth conductor portion on the mounting surface or the surface perpendicular to the stacking direction; the portions of the fifth conductor portion and the third conductor portion facing each other are coupled to form a first capacitive structure; the portions of the fifth conductor portion and the fourth conductor portion facing each other are coupled to form a second capacitive structure; The first to fifth conductor parts are made of metallized materials; the first conductor part is coupled to the first capacitive structure through the first conductive pillar and the second conductive pillar, and the first conductor part, the first capacitive structure, the first conductive pillar and the second conductive pillar and the coupling paths therebetween form a first closed loop in three-dimensional space; The second conductor portion is coupled to the second capacitive structure through the third conductive pillar and the fourth conductive pillar, and the second conductor portion, the second capacitive structure, the third conductive pillar and the fourth conductive pillar and the coupling paths therebetween form a second closed loop in a three-dimensional space; Projection contours of the first closed loop and the second closed loop on a plane perpendicular to the first direction overlap or partially coincide.

3. The filter according to claim 2, characterized in that The fifth conductor portion is provided between the third conductor portion and the mounting surface along the stacking direction.

4. The filter according to claim 2, characterized in that The fifth conductor portion is located between the fourth conductor portion and the mounting surface along the stacking direction.

5. The filter according to claim 1, characterized in that The sixth conductor portion is made of a metalized material, and its projection on the mounting surface or the surface perpendicular to the stacking direction is formed into a meandering shape that is bent at least twice; The seventh conductor portion is made of a metalized material, is disposed between the sixth conductor portion and the mounting surface along the stacking direction, and includes a first connecting section and a second connecting section with a gap between the first connecting section and the seventh conductor portion. The eighth conductor portion is made of a metalized material and is disposed between the seventh conductor portion and the mounting surface along the stacking direction. The projection of the eighth conductor portion on the mounting surface or a surface perpendicular to the stacking direction partially overlaps with the projection of the seventh conductor portion on the mounting surface or a surface perpendicular to the stacking direction. The eighth conductor portion is conductively connected to the second connecting section of the seventh conductor portion. The parts of the first connecting sections of the eighth conductor portion and the seventh conductor portion facing each other in the stacking direction are coupled to form a third capacitive structure, and a projection of the third capacitive structure on the mounting surface or a surface perpendicular to the stacking direction at least partially overlaps with a projection of the sixth conductor portion on the mounting surface or a surface perpendicular to the stacking direction; The sixth conductor portion is coupled to the third capacitive structure through the fifth conductive column, and the sixth conductor portion is coupled to the second connecting segment through the sixth conductive column. The first conductor portion, the third capacitive structure, the fifth conductive column, the sixth conductive column, the second connecting segment, and the coupling paths therebetween form a third closed loop in three-dimensional space.

6. The filter according to claim 5, characterized in that The outer contour of the sixth conductor portion has a consistent width, or at least a portion of the outer contour of the sixth conductor portion has a different width.

7. The filter according to claim 5, characterized in that The sixth conductor portion includes a third connecting segment, a fourth connecting segment and a fifth connecting segment that are interconnected, the third connecting segment is perpendicular to the fourth connecting segment, the fourth connecting segment is perpendicular to the fifth connecting segment, and the third connecting segment and the fifth connecting segment are located on the same side of the fourth connecting segment relative to the fourth connecting segment.

8. The filter according to claim 5, characterized in that The second coupling structure is conductively connected to the first connecting section of the first meander-type three-dimensional resonator, and the second coupling structure is conductively connected to the third conductor portion of the spatially coupled resonant structure; The third coupling structure is conductively connected to the first connecting section of the second meandering three-dimensional resonator, and the third coupling structure is conductively connected to the fourth conductor portion of the spatially coupled resonant structure.

9. The filter according to claim 5, characterized in that The projection of the second coupling structure on the mounting surface or the surface perpendicular to the stacking direction partially overlaps with the projection of the sixth conductor portion of the first zigzag three-dimensional resonator on the mounting surface or the surface perpendicular to the stacking direction, and / or the projection of the third coupling structure on the mounting surface or the surface perpendicular to the stacking direction partially overlaps with the projection of the sixth conductor portion of the second zigzag three-dimensional resonator on the mounting surface or the surface perpendicular to the stacking direction.

10. The filter according to claim 1, characterized in that It also includes a first connection end, a second connection end, a third connection end and at least one additional reactance structure, wherein the additional reactance structure is configured on a coupling path between the first connection end and the first meandering three-dimensional resonator, and / or the additional reactance structure is configured on a coupling path between the second connection end and the second meandering three-dimensional resonator, and / or the additional reactance structure is configured on a coupling path between the third connection end and the spatially coupled resonant structure; the first to third connection ends and the additional reactance structure are composed of metallized materials.

11. The filter according to claim 10, characterized in that The first connection end, the second connection end and the third connection end are used to be connected to a reference ground.

12. The filter according to claim 10, characterized in that The additional reactance structure is composed of a structure whose imaginary part of admittance is greater than zero, or the additional reactance structure is composed of a structure whose imaginary part of admittance is less than zero.

13. The filter according to claim 10, characterized in that The additional reactance structure is formed such that its projection on the mounting surface or the surface perpendicular to the stacking direction is formed by at least one of a straight line, a broken line, an arc line, and a spiral line extending from a point.

14. The filter according to claim 10, characterized in that The additional reactance structure is formed by coupling a plurality of metallized electrodes.

15. The filter according to claim 10, characterized in that The additional reactance structure is formed inside the stack, and / or the additional reactance structure is formed on the surface of the stack, and / or the additional reactance structure is formed inside the mounting carrier, and / or the additional reactance structure is formed on the surface of the mounting carrier.

16. The filter according to claim 10, characterized in that It comprises first to third additional reactance structures; the first additional reactance structure is arranged on the coupling path between the first connection end and the first meandering three-dimensional resonator; the second additional reactance structure is arranged on the coupling path between the second connection end and the second meandering three-dimensional resonator; the third additional reactance structure is arranged on the coupling path between the third connection end and the spatial coupling resonant structure.

17. The filter according to claim 1, characterized in that The first to third coupling structures are each composed of at least two metallized electrodes facing each other in the stacking direction, and the projections of the two metallized electrodes on the mounting surface or the surface perpendicular to the stacking direction partially overlap.

18. The filter according to claim 17, characterized in that The first coupling structure includes a first metallized electrode, a second metallized electrode and a third metallized electrode; the second metallized electrode partially overlaps with the projection of the first metallized electrode on the mounting surface or the surface perpendicular to the stacking direction; the second metallized electrode partially overlaps with the projection of the third metallized electrode on the mounting surface or the surface perpendicular to the stacking direction, and the overlapping portion of the projection of the second metallized electrode and the first metallized electrode on the mounting surface or the surface perpendicular to the stacking direction is spaced from the overlapping portion of the projection of the second metallized electrode and the third metallized electrode on the mounting surface or the surface perpendicular to the stacking direction.

19. The filter according to claim 17, characterized in that The first coupling structure and the first meandering three-dimensional resonator share a same metallized electrode, and / or the first coupling structure and the second meandering three-dimensional resonator share a same metallized electrode.

20. The filter according to claim 17, characterized in that One electrode of the first coupling structure is coupled to the first zigzag three-dimensional resonator through a seventh conductive column, and the other electrode of the first coupling structure is coupled to the second zigzag three-dimensional resonator through an eighth conductive column, the seventh conductive column and the eighth conductive column extend along the stacking direction in the stacked body, and the eighth conductor portion of the first zigzag three-dimensional resonator and the eighth conductor portion of the second zigzag three-dimensional resonator are located between at least one electrode of the first coupling structure and the mounting surface along the stacking direction.

21. The filter according to claim 1, characterized in that The projection of the first coupling structure on the mounting surface or the surface perpendicular to the stacking direction is sandwiched between the projection of the first signal terminal on the mounting surface or the surface perpendicular to the stacking direction and the projection of the second signal terminal on the mounting surface or the surface perpendicular to the stacking direction.

22. The filter according to claim 1, characterized in that The projection of the first coupling structure on the mounting surface or the surface perpendicular to the stacking direction partially overlaps with the projection of the sixth conductor portion of the first zigzag three-dimensional resonator on the mounting surface or the surface perpendicular to the stacking direction, or the projection of the first coupling structure on the mounting surface or the surface perpendicular to the stacking direction partially overlaps with the projection of the sixth conductor portion of the second zigzag three-dimensional resonator on the mounting surface or the surface perpendicular to the stacking direction.

23. The filter according to claim 1, characterized in that It also includes an additional inductive structure, which is arranged on the coupling path between the first zigzag three-dimensional resonator and the second zigzag three-dimensional resonator; the additional inductive structure is composed of a structure whose imaginary part of admittance is less than zero; the projection of the additional inductive structure on a plane perpendicular to the stacking direction is formed by extending from a point by at least one of a straight line, a broken line, an arc, and a spiral.

24. The filter according to claim 23, characterized in that Along the stacking direction, the additional inductive structure is at least partially formed on the same level as at least one metallized electrode constituting the first coupling structure.

25. The filter according to claim 23, characterized in that The first coupling structure is arranged between the additional inductive structure and the mounting surface along the stacking direction, and the distance between the additional inductive structure and the mounting surface is greater than the distance between the first coupling structure and the mounting surface.

26. The filter according to claim 23, characterized in that One end of the additional inductive structure is coupled to an electrode in the first coupling structure through a ninth conductive column, and the other end of the additional inductive structure is coupled to another electrode of the first coupling structure through a tenth conductive column. The ninth conductive column and the tenth conductive column extend in the stacked body along the stacking direction.

27. The filter according to claim 23, characterized in that The additional inductive structure is at least partially disposed on the surface of the mounting carrier or inside the mounting carrier.

28. The filter according to claim 23, characterized in that The additional inductive structure and the first coupling structure share the same metallized electrode, and / or the additional inductive structure and the first signal terminal share the same metallized electrode, and / or the additional inductive structure and the second signal terminal share the same metallized electrode.

29. The filter according to claim 23, characterized in that The projection of the additional inductive structure on the mounting surface or the surface perpendicular to the stacking direction partially overlaps with the projection of the first coupling structure on the mounting surface or the surface perpendicular to the stacking direction.

30. The filter according to claim 1, characterized in that The second coupling structure is configured to be sandwiched between the first meander-type three-dimensional resonator and the spatially coupled resonant structure; One electrode of the second coupling structure is connected to the first zigzag three-dimensional resonator, and the other electrode is connected to the spatial coupling resonant structure; The third coupling structure is configured to be sandwiched between the second meander type three-dimensional resonator and the spatially coupled resonant structure; The third coupling structure electrode is connected to the second meander-type three-dimensional resonator, and another electrode is connected to the spatial coupling resonant structure.

31. The filter according to claim 1, characterized in that The projections of the first meandering three-dimensional resonator, the second meandering three-dimensional resonator and the spatial coupling resonant structure on the plane where the mounting surface is located are all located on the same side of the projection of the first coupling structure on the plane where the mounting surface is located.

32. The filter according to claim 1, characterized in that The first meandering three-dimensional resonator, the spatially coupled resonant structure and the second meandering three-dimensional resonator are arranged in sequence in the first direction.

33. The filter according to claim 1, characterized in that It also comprises at least one supporting member, which is arranged between the stacked body and the mounting surface and is used to fix the stacked body to the mounting surface.

34. An electronic device, characterized in that: A filter comprising the filter described in any one of claims 1 to 33.

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