Method for budgeting voltage withstanding capability of PCB (Printed Circuit Board) energy board

Abstract

The invention is applicable to the field of PCB (printed circuit board) energy boards, and provides a budgeting method for voltage resistance of a PCB energy board, which comprises the following steps of: confirming the maximum working voltage U required by a product; defining an interlayer thickness and a logic rule of the lamination; defining an interval requirement rule between inner layer lines; defining an interval requirement rule between outer layer lines; defining a drilling hole wall spacing requirement rule; high and low voltage modules for wiring are set, and a circuit diagram is designed for wiring. According to the scheme, the problems that in the prior art, 6oz thick copper ultra-small spacing (10mil) cannot be machined in batches, compared with a mechanical depth control gong, cutter breakage is solved, and batch production cannot be achieved are solved, and the scheme is high in efficiency and low in cost.

Description

Technical Field

[0001] The invention belongs to the field of PCB energy boards, and in particular relates to a method for estimating the voltage resistance capability of a PCB energy board. Background Art

[0002] As the concept of green production has gained popularity, carbon emission technology has gradually developed, and more and more low-carbon industries have grown rapidly; in the use of new energy vehicles, solar energy, wind energy, and tidal energy, more and more energy storage modules will use PCB as a module that can withstand high voltages such as energy conversion and storage, especially in inverters and charging piles. The demand for PCB is increasing; this type of PCB is referred to as an energy board.

[0003] Energy PCB products tend to work at steady-state voltages of 400V and 800V, and some parts may need to withstand voltages of 1500V or 2200V, which places higher requirements on the dielectric tolerance of the material. Especially when the power switch is switched, the instantaneous voltage can be as high as 5kV or even 10kV. Under the huge high-voltage impact, whether the insulation capacity of the material can be sufficient to avoid breakdown has strict requirements on product design and is an issue that needs to be urgently resolved. Summary of the invention

[0004] The purpose of the present invention is to provide a method for estimating the voltage resistance capability of a PCB energy board, aiming to solve the technical problems existing in the prior art identified in the background technology.

[0005] The present invention is implemented as follows: a method for estimating the voltage withstand capability of a PCB energy board, the method comprising: Confirm the maximum operating voltage U required by the product; Define the interlayer thickness and logic rules of the stack, and limit the minimum thickness t of the high-voltage power layer and the adjacent shielding layer to meet the logic rules; Define the spacing requirement rules between inner layer lines and limit the spacing S between inner layer lines 内 Satisfy the requirements rules; Define the outer layer line spacing requirement rules and limit the outer layer line spacing S 外 Satisfy the requirements rules; Define the drilling hole wall spacing requirement rules and limit the drilling hole wall spacing S 孔 Satisfy the requirements rules; Set the high and low voltage modules of the wiring and design the circuit diagram.

[0006] As a further solution of the present invention, the logic rule includes: When the voltage U≤100V, the minimum thickness of the high voltage power layer and the adjacent shielding layer t≥3mil; When the voltage is 1000V≤U≤2200V, the minimum thickness of the high voltage power layer and the adjacent shielding layer is t≥U / 500mil; When 2200V≤U≤6000V; the thickness of the minimum high-voltage power layer and the adjacent shielding layer is t≥U / 400mil.

[0007] As a further solution of the present invention, the inner layer line spacing requirement rule includes: When the voltage U≤100V, the line spacing S 内 ≥3.5mil; When the voltage is 1000V≤U≤2200V, the line spacing S 内 ≥U / 500+0.5mil; When the voltage is 2200V≤U≤6000V, the line spacing S 内 ≥U / 400+0.5mil.

[0008] As a further solution of the present invention, the outer layer line spacing requirement rule includes: When the voltage U≤2200V, the line spacing S 外 ≥U / 120mil; When the voltage is 2200V≤U≤10000V, the line spacing S 外 ≥U / 100mil.

[0009] As a further solution of the present invention, the drilling hole wall spacing requirement rules include: When the voltage U≤2200V, the drilling hole wall spacing S 孔 Should meet ≥U / 120+2mil; When the voltage is 2200V≤U≤10000V, the drilling hole wall spacing S 孔 ≥U / 100+2mil.

[0010] As a further embodiment of the present invention, the materials involved in the steps include epoxy resin, modified epoxy resin and polyphenylene ether resin system.

[0011] As a further aspect of the present invention, the method further includes performing simulation tests to predict the performance of the PCB under high voltage.

[0012] As a further solution of the present invention, the method also includes quality detection and verification.

[0013] The beneficial effects of the present invention are: This solution has significant advantages in breaking through the limitations of traditional technology, and has successfully achieved batch processing of 6oz thick copper ultra-fine pitch (10mil) circuits, becoming an important innovation in the field of PCB manufacturing. First, in terms of technological breakthroughs, this solution achieves high-precision processing and solves the problem of insufficient precision of traditional technology when processing thick copper. Through advanced process technology, a fine pitch of 10mil can be maintained even when the copper thickness increases. In addition, by optimizing drill and cutting technology, this solution significantly reduces tool loss, solves problems such as tool breakage caused by previous thick copper processing, and improves the stability and reliability of the manufacturing process.

[0014] In terms of cost and efficiency, compared with the traditional mechanical controlled depth gong process, this solution reduces equipment wear and raw material waste, significantly reducing production costs. This not only reduces the cost of a single product, but also makes mass production more economical and efficient. In addition, the new solution uses an automated processing process, which significantly increases production speed and shortens production cycles, enabling companies to respond to market demand more quickly and improve their competitiveness.

[0015] In terms of mass production capacity, this solution solves the problem that traditional processes cannot achieve mass production, making thick copper PCBs widely used in many fields such as high-power electronic equipment and the power industry. Through a strict quality control system, the solution ensures the quality consistency of each PCB and achieves high-quality mass production. These advantages not only achieve breakthroughs in technology, but also show significant effects in cost, efficiency and production capacity, providing new solutions for industry development. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is the diagram showing the dielectric thickness requirements between different layers for different voltages; Figure 2 This is the spacing requirement diagram between inner layers for different voltages; Figure 3 This is the outer layer wire spacing requirement diagram for different voltages; Figure 4 This is a diagram showing the requirements for hole wall spacing at different voltages. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0018] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but unless otherwise specified, these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first xx script may be referred to as a second xx script, and similarly, a second xx script may be referred to as a first xx script.

[0019] The present invention relates to a budgeting method for improving the voltage withstand capability of PCB energy board. By defining a series of rules for layer thickness, line spacing and hole wall spacing, the method ensures the reliability and safety of PCB in high voltage working environment. The following is a detailed description and expansion of each step.

[0020] 1. Confirm the maximum operating voltage U required by the product At the initial stage of PCB design, confirm the maximum operating voltage U required by the product. This is the most basic but also the most important part of the design, because the structure and material selection of the entire PCB are based on this parameter.

[0021] This step clarifies the maximum operating voltage to ensure the accuracy of subsequent design rules, thereby avoiding over-design or under-design problems. By accurately defining the operating voltage, designers can better target material selection and structural planning. It also reduces the number of design iterations and improves design efficiency and accuracy.

[0022] Voltage classification is a crucial step in PCB design. This process not only guides the design direction, but also affects material selection and cost control.

[0023] Handling multiple voltages on the same PCB requires special design strategies. Isolation and shielding techniques for different voltage layers can effectively reduce interference between voltages.

[0024] The introduction of a dynamic voltage regulation mechanism enables the PCB to automatically adjust the voltage according to different operating modes, which has obvious advantages in power consumption and heat control.

[0025] Voltage classification details: Low voltage applications less than 100V are often used in consumer electronic devices, which require lower spacing rules but still guarantee basic insulation performance.

[0026] The medium voltage range of 1000V to 2200V is suitable for industrial equipment and some electric vehicle applications, which require stricter spacing and thickness control to ensure electrical safety.

[0027] The high voltage range over 2200V is mostly used in the power industry and high-performance electronics, which requires highly optimized design and advanced materials to prevent breakdown and failure.

[0028] With clear voltage classification, designers can quickly identify and select the most appropriate design strategies and materials, reducing development time and costs.

[0029] 2. Define the interlayer thickness and logic rules of the stack The logical rules for defining the interlayer thickness t of the stack according to different voltage ranges are: When voltage U≤100V, t≥3mil.

[0030] When 1000V≤U≤2200V, t≥U / 500mil.

[0031] When 2200V≤U≤6000V, t≥U / 400mil.

[0032] As shown in Table 1: Table 1 Relationship between different hi-pot voltages (V) and interlayer thickness in withstand voltage test

[0033] This step ensures the interlayer insulation capability of the PCB in high voltage environments to prevent electrical breakdown. At the same time, it also optimizes the use of materials to achieve a cost-effective balance.

[0034] This step improves the voltage resistance of the PCB, enabling it to operate stably at higher voltages and reduces the risk of failure due to breakdown.

[0035] The stack-up structure plays a vital role in PCB design, especially in high voltage applications. Well-defined layer thickness and logical rules are the prerequisites for ensuring reliability. The design of the stack-up thickness not only affects the electrical performance, but also involves thermal management and mechanical stability.

[0036] Defined layer thicknesses are set for each voltage level to ensure insulation and mechanical stability.

[0037] By setting logical rules, it is ensured that the interlayer thickness can be quickly adjusted in different situations.

[0038] Optimization of layer thickness not only affects electrical performance, but also thermal management and mechanical strength.

[0039] Reasonable stack-up design can effectively manage heat, improve heat dissipation efficiency, and reduce the impact of thermal stress on circuit performance.

[0040] In high voltage applications, the thickness of the stack also needs to consider thermal conductivity. By introducing a layer of high thermal conductivity material, the heat dissipation performance of the PCB is enhanced.

[0041] By adjusting the stack thickness and material combination, the PCB's ability to resist vibration and shock can be improved. This is especially important for applications in vehicles or industrial equipment.

[0042] The design of the inner and outer layer spacing of a PCB directly affects its electrical performance and overall size. Optimizing this part of the design can improve overall performance and design flexibility.

[0043] 3. Define the spacing requirements between inner layers Set the inner layer line spacing S 内 Requirements rules to cope with different voltage ranges: When the voltage U≤100V, S 内 ≥3.5mil.

[0044] When 1000V≤U≤2200V, S 内 ≥U / 500+0.5mil.

[0045] When 2200V≤U≤6000V, S 内 ≥U / 400+0.5mil.

[0046] As shown in Table 2: Table 2 Relationship between different hi-pot voltages (V) and the withstand voltage test between inner layers

[0047] Optimizing the spacing design between inner layers can effectively reduce electrical interference and signal crosstalk, and improve signal integrity and transmission efficiency.

[0048] This step ensures stable electrical performance under high-density wiring conditions and is suitable for complex circuit designs.

[0049] High-precision and high-density inner-layer wiring requires strict control of spacing to reduce electromagnetic interference.

[0050] Accurate calculation through spacing formula ensures reliable insulation under different voltages.

[0051] 4. Define the spacing requirements between outer lines Determine the requirements for the outer layer line spacing S: When voltage U≤2200V, Sout≥U / 120mil.

[0052] When 2200V≤U≤10000V, Sout≥U / 100mil.

[0053] As shown in Table 3: Table 3 Relationship between different hi-pot voltages (V) and the withstand voltage test between outer wires

[0054] Optimizing the spacing between outer layer lines helps maintain the mechanical strength and electrical isolation of the overall PCB and reduces the possibility of arcing.

[0055] This step improves the overall reliability of the PCB in high-voltage applications, allowing it to maintain stable performance under dynamic load conditions.

[0056] The outer layer spacing needs to take into account environmental factors such as humidity and dust, which can cause electrical shorts.

[0057] The optimized design of the outer layer also provides more space for marking and welding, making it easier to manufacture and maintain.

[0058] By optimizing the spacing between inner and outer layers, the stable operation of the PCB in various environments is guaranteed to meet diverse industry needs.

[0059] 5. Define the requirements for the spacing between the drilling holes and the wall Drilling hole wall spacing S 孔 Design rules: When voltage U≤2200V, S 孔 ≥U / 120+2mil.

[0060] When 2200V≤U≤10000V, S 孔 ≥U / 100+2mil.

[0061] As shown in Table 4: Table 4 Relationship between different hi-pot voltages (V) and hole wall spacing during withstand voltage test

[0062] This rule ensures the insulation performance between holes and prevents electrical failure caused by hole wall breakdown.

[0063] This step improves the structural integrity and electrical stability of multi-layer PCBs, making them suitable for designs that require higher hole density.

[0064] Drilling technology is a key link in PCB manufacturing, especially in multi-layer PCBs, where precise control of hole wall spacing directly affects product quality and reliability.

[0065] Use advanced drilling equipment and technology to ensure smoothness and consistency of the hole wall.

[0066] Set clear hole-to-wall spacing for different voltage levels to avoid arcing and leakage.

[0067] By improving drilling technology, errors in the production process can be reduced and product consistency and durability can be improved.

[0068] 6. Set the high and low voltage modules of the wiring, and design the wiring circuit diagram Set the PCB wiring design according to the above rules to ensure that both high and low voltage modules meet the design requirements.

[0069] Through reasonable wiring design, efficient current distribution and minimal energy loss are ensured, thus improving the working efficiency of PCB.

[0070] This method provides a complete design framework, enabling designers to identify potential problems at an early stage and reduce late-stage design modifications.

[0071] Material selection Material Description: Use epoxy resin, modified epoxy resin and polyphenylene ether resin system to meet the requirements of high dielectric strength and good insulation performance.

[0072] Epoxy resins and modified epoxy resins are preferred due to their excellent electrical strength and thermal stability.

[0073] Polyphenylene ether resin provides good chemical resistance and mechanical strength.

[0074] Nanofillers and reinforcing fibers are introduced to improve the overall performance and reliability of the material.

[0075] Through material composite technology, the pressure resistance and heat resistance of PCB are further improved.

[0076] These materials show good stability and chemical corrosion resistance at high temperatures, making them suitable for harsh working environments, improving the durability and applicability of PCBs, especially in new energy vehicles and green energy conversion equipment.

[0077] By introducing high-performance materials, PCB can adapt to more severe working environments and extend the service life of the product.

[0078] Simulation test and quality inspection After the design is completed, simulation tests are carried out to predict the performance of the PCB under high voltage, and professional quality inspection and verification steps are carried out to ensure that the product meets the design specifications.

[0079] Use advanced electromagnetic field simulation software to predict how your PCB will perform under different voltage and environmental conditions.

[0080] Test results are used for feedback and design optimization to improve the efficiency and accuracy of product development.

[0081] Introduce intelligent detection systems on the production line to monitor key parameters in the manufacturing process in real time.

[0082] Combined with automated testing equipment, we ensure that every PCB meets strict quality standards.

[0083] Through strict simulation testing and quality control, we can reduce product failure rate and improve customer satisfaction.

[0084] By combining simulation and actual measurement, the weak links in the design can be identified in advance, reducing the risk of failure in actual application. This improves product reliability and user confidence, and provides a guarantee for subsequent mass production.

[0085] This method not only optimizes electrical performance, but also takes into account material selection, mechanical strength, and manufacturability of the design. This comprehensive approach ensures excellent performance in high-voltage, high-density applications, and is suitable for new energy vehicles, solar energy, wind energy and other industries, promoting the development of green energy technology. Through systematic design rules and verification steps, the design efficiency and product quality of PCBs are significantly improved, setting new standards for the industry.

[0086] The implementation of this approach brings advantages in several aspects and offers rich potential for future development.

[0087] Comprehensive advantages: Improves design flexibility, allowing PCB to better adapt to different market needs.

[0088] The material and production costs are reduced, and unnecessary waste is reduced through optimized design.

[0089] Improved product reliability and provided higher value to users.

[0090] Future development: With the continuous advancement of electronic technology, PCB design will rely more on intelligent and automated tools.

[0091] Breakthroughs in materials science will provide PCBs with higher performance and more functionality.

[0092] By combining with other technologies, such as IoT and AI, PCB will become an essential component of intelligent systems.

[0093] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0094] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0095] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

[0096] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for estimating the voltage withstand capability of a PCB energy board, characterized in that: The method comprises: Confirm the maximum operating voltage U required by the product; Define the interlayer thickness and logic rules of the stack, and limit the minimum thickness t of the high-voltage power layer and the adjacent shielding layer to meet the logic rules; Define the spacing requirement rules between inner layer lines and limit the spacing S between inner layer lines 内 Satisfy the requirements rules; Define the outer layer line spacing requirement rules and limit the outer layer line spacing S 外 Satisfy the requirements rules; Define the drilling hole wall spacing requirement rules and limit the drilling hole wall spacing S 孔 Satisfy the requirements rules; Set the high and low voltage modules of the wiring and design the circuit diagram.

2. The method according to claim 1, characterized in that The logic rules include: When the voltage U≤100V, the minimum thickness of the high voltage power layer and the adjacent shielding layer t≥3mil; When the voltage is 1000V≤U≤2200V, the minimum thickness of the high voltage power layer and the adjacent shielding layer is t≥U / 500mil; When 2200V≤U≤6000V; the thickness of the minimum high-voltage power layer and the adjacent shielding layer is t≥U / 400mil.

3. The method according to claim 2, characterized in that The inner layer line spacing requirements include: When the voltage U≤100V, the line spacing S 内 ≥3.5mil; When the voltage is 1000V≤U≤2200V, the line spacing S 内 ≥U / 500+0.5mil; When the voltage is 2200V≤U≤6000V, the line spacing S 内 ≥U / 400+0.5mil.

4. The method according to claim 3, characterized in that The outer layer line spacing requirement rules include: When the voltage U≤2200V, the line spacing S 外 ≥U / 120mil; When the voltage is 2200V≤U≤10000V, the line spacing S 外 ≥U / 100mil.

5. The method according to claim 4, characterized in that The drilling hole wall spacing requirements include: When the voltage U≤2200V, the drilling hole wall spacing S 孔 Should meet ≥U / 120+2mil; When the voltage is 2200V≤U≤10000V, the drilling hole wall spacing S 孔 ≥U / 100+2mil.

6. The method according to claim 1, characterized in that The materials involved in the steps include epoxy resin, modified epoxy resin and polyphenylene ether resin system.

7. The method according to claim 1, characterized in that The method also includes performing simulation tests to predict the performance of the PCB under high voltage.

8. The method according to claim 1, characterized in that The method also includes quality testing and verification.

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