Biochip and manufacturing method thereof
By setting multiple reaction zones in the biochip and using the design of the wall structure and protrusions, the problem of overflow of the solution to be tested is solved, high capacity and efficient biomaterial detection is achieved, and operation convenience and detection accuracy are improved.
Patent Information
- Application Number
- CN202311580733.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-12
- Filing Date
- 2023-11-24
- Publication Date
- 2025-03-14
AI Technical Summary
In general biochips, the space of the solution to be tested is limited, and overflow problems are prone to occur, especially when dealing with a large number of solutions to be tested.
By setting multiple reaction zones in the biochip and using the design of the wall structure and protrusions, a third opening is formed to increase the storage volume of the solution to be tested, avoid overflow, and simplify the process.
It effectively avoids the overflow problem of the solution to be tested, increases the capacity of the biochip for the solution to be tested, improves the margin and convenience of operation, and realizes simultaneous detection of a variety of biological materials, reducing the risk of cross-contamination.
Smart Images
Figure CN119615378A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a semiconductor chip and a manufacturing method thereof, and in particular to a biochip and a manufacturing method thereof. Background Art
[0002] In a general biochip, the space that can accommodate the test solution is usually limited by the size of the reaction area. Therefore, once the test solution is large in amount or there is an error in adding the test solution, the test solution may easily overflow. Summary of the invention
[0003] The present invention is directed to a biochip and a manufacturing method thereof, which can avoid the overflow problem of the test solution and can cope with a larger amount of the test solution. Thus, when a plurality of reaction areas are provided in the biochip, the plurality of reaction areas can be used to detect different types of biological materials respectively, and there is no need to worry about the cross contamination problem caused by the overflow of the test solution between different reaction areas, thereby achieving the effect of simultaneously detecting multiple biological materials.
[0004] According to an embodiment of the present invention, a biochip can be used to detect biological materials in a solution to be tested. The biochip includes a substrate, an insulating layer, a semiconductor layer, a dielectric layer, a metal layer and a protective layer. The insulating layer is arranged on the substrate. The semiconductor layer is arranged on the insulating layer and has a reaction area. The dielectric layer is arranged on the semiconductor layer and has a first opening. The metal layer is arranged on the dielectric layer and includes a source, a drain and a wall structure. The source and the drain are electrically connected to the semiconductor layer respectively. The wall structure surrounds the first opening, the source and the drain. The protective layer is arranged on the metal layer and has a flat portion, a protruding portion, a second opening and a third opening. The flat portion surrounds and defines the second opening. The protruding portion is arranged corresponding to the wall structure, and the protruding portion surrounds and defines the third opening. The second opening connects the third opening and the first opening to expose the reaction area.
[0005] In the biochip according to the embodiment of the present invention, the source, drain and wall structure are separated from each other, and the source and drain are electrically insulated from the wall structure.
[0006] In the biochip according to the embodiment of the present invention, in the above three-dimensional view of the biochip, the wall structure does not completely surround the first opening.
[0007] In the biochip according to the embodiment of the present invention, in the above three-dimensional view of the biochip, the wall structure completely surrounds the first opening.
[0008] In the biochip according to the embodiment of the present invention, the minimum distance between the wall structure and the source electrode is 0.1 micrometer to 5 micrometers.
[0009] In the biochip according to the embodiment of the present invention, in the above three-dimensional view of the biochip, the third opening is larger than the second opening.
[0010] In the biochip according to the embodiment of the present invention, the protrusion completely surrounds the first opening and the second opening.
[0011] In the biochip according to the embodiment of the present invention, the solution to be tested is disposed in the first opening, and the upper surface of the solution to be tested is between the upper surface of the protruding portion and the upper surface of the flat portion.
[0012] In the biochip according to an embodiment of the present invention, the metal layer further comprises a source extension pad and a drain extension pad, and the biochip further comprises a first adapter pad and a second adapter pad. The first adapter pad and the second adapter pad are respectively arranged on the insulating layer. The source is electrically connected to the source extension pad through the first adapter pad, and the drain is electrically connected to the drain extension pad through the second adapter pad.
[0013] According to an embodiment of the present invention, a method for manufacturing a biochip includes the following steps: providing a substrate; forming an insulating layer on the substrate; forming a semiconductor layer on the insulating layer, wherein the semiconductor layer has a reaction area; forming a dielectric layer on the semiconductor layer, wherein the dielectric layer has a first opening; forming a metal layer on the dielectric layer, wherein the metal layer includes a source, a drain and a wall structure, the source and the drain are electrically connected to the semiconductor layer respectively, and the wall structure surrounds the first opening, the source and the drain; and forming a protective layer on the metal layer, wherein the protective layer has a flat portion, a protruding portion, a second opening and a third opening. The flat portion surrounds and defines the second opening. The protruding portion is arranged corresponding to the wall structure, and the protruding portion surrounds and defines the third opening. The second opening connects the third opening and the first opening to expose the reaction area.
[0014] Based on the above, in a biochip and a manufacturing method thereof according to an embodiment of the present invention, a protrusion can be formed simultaneously in the step of forming a protective layer by setting a wall structure, thereby having the effect of simplifying the process. Since the protrusion can be a closed figure surrounding the first opening, the solution to be tested can be confined within the third opening to prevent the solution to be tested from overflowing outside the third opening. Compared with a general biochip, the biochip of this embodiment can increase the volume of the solution to be tested that the biochip can accommodate by setting the third opening to prevent the solution to be tested from overflowing and can cope with a larger amount of solution to be tested, and improve the operating margin and convenience of the biochip. Thus, when a plurality of reaction zones are provided in the biochip of this embodiment, a plurality of reaction zones can be used to detect different types of biological materials respectively, and there is no need to worry about cross contamination between different reaction zones due to overflow of the solution to be tested, thereby achieving the effect of simultaneously detecting multiple biological materials. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figures 1 to 4 A three-dimensional schematic diagram showing a method for manufacturing a biochip according to an embodiment of the present disclosure;
[0016] Figure 5 Shown as Figure 4 A schematic cross-sectional view of a biochip along a section line II';
[0017] Figure 6 Shown as Figure 4 A schematic cross-sectional view of a biochip along section line II-II';
[0018] Figures 7 to 10 A three-dimensional schematic diagram showing a method for manufacturing a biochip according to another embodiment of the present disclosure;
[0019] Fig.11 Shown as Fig.10 Schematic diagram of the cross section of the biochip along the section line III-III'.
[0020] Description of Reference Numerals
[0021] 100, 100a: Biochip
[0022] 110: Substrate
[0023] 120: Semiconductor layer
[0024] 120a: First transfer pad
[0025] 120b: Second transfer pad
[0026] 121: Reaction area
[0027] 122: Source region
[0028] 123: Drain region
[0029] 130, 130a: dielectric layer
[0030] 131, 132, 133, 134, 135, 136: Opening
[0031] 140, 140a: Metal layer
[0032] 141, 141a: Wall structure
[0033] 1411: Part 1
[0034] 1412: Part 2
[0035] 142, 1511, 1521, 200a: upper surface
[0036] 150: Protective layer
[0037] 151: Flat part
[0038] 152, 152a: protrusion
[0039] 200: Solution to be tested
[0040] 210: Biomaterials
[0041] 220: Liquid
[0042] G1, G2: Minimum spacing
[0043] IL: Insulation layer
[0044] O1: First opening
[0045] O11, O21, O31: Sidewall
[0046] O2: Second opening
[0047] O3: The third opening
[0048] P1, P2, P3, P4: Endpoints
[0049] SD1: Source
[0050] SD1a: Source extension pad
[0051] SD2: Drain
[0052] SD2a: Drain extension pad
[0053] T1: Thickness
[0054] Z: Normal direction DETAILED DESCRIPTION
[0055] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.
[0056] Figures 1 to 4 A three-dimensional schematic diagram of a method for manufacturing a biochip according to an embodiment of the present disclosure is shown. Figure 5 Shown as Figure 4 Schematic diagram of the cross section of the biochip along the section line II'. Figure 6 Shown as Figure 4 A schematic cross-sectional view of a biochip along section line II-II'. For the sake of clarity and convenience of illustration, Figure 4 The semiconductor layer 120 , the metal layer 140 , and the test solution 200 in the biochip 100 are omitted from illustration.
[0057] Please refer to Figures 4 to 6The biochip 100 of this embodiment may include a substrate 110, an insulating layer IL, a semiconductor layer 120, a dielectric layer 130, a metal layer 140, and a protective layer 150. The insulating layer IL is disposed on the substrate 110. The semiconductor layer 120 is disposed on the insulating layer IL and has a reaction area 121. The dielectric layer 130 is disposed on the semiconductor layer 120 and has a first opening O1. The metal layer 140 is disposed on the dielectric layer 130 and includes a source SD1, a drain SD2, and a wall structure 141. The source SD1 and the drain SD2 are electrically connected to the semiconductor layer 120, respectively. The wall structure 141 surrounds the first opening O1, the source SD1, and the drain SD2. The protective layer 150 is disposed on the metal layer 140 and has a flat portion 151, a protruding portion 152, a second opening O2, and a third opening O3. The flat portion 151 surrounds and defines the second opening O2. The protrusion 152 is disposed corresponding to the wall structure 141 and surrounds and defines the third opening O3. The second opening O2 connects the third opening O3 and the first opening O1 to expose the reaction area 121. In addition, the biochip 100 of this embodiment can be used to detect the biomaterial 210 in the test solution 200.
[0058] The following is an explanation of the manufacturing method of the biochip 100 of this embodiment. The manufacturing method of the biochip 100 of this embodiment may include the following steps:
[0059] First, please refer to Figure 1 , providing a substrate 110. In the present embodiment, the substrate 110 may be a silicon substrate or a silicon wafer. For example, the substrate 110 may be a P-type silicon substrate, but is not limited thereto.
[0060] Next, please continue to refer to Figure 1 , an insulating layer IL is formed on the substrate 110. In this embodiment, the insulating layer IL may be, for example, a gate oxide layer, but is not limited thereto.
[0061] Next, please continue to refer to Figure 1 , forming a semiconductor layer 120 on the insulating layer IL. In the present embodiment, the semiconductor layer 120 has a reaction region 121, a source region 122 and a drain region 123. The reaction region 121 is located between the source region 122 and the drain region 123. In the present embodiment, the material of the semiconductor layer 120 may include polysilicon or other suitable semiconductor materials, but is not limited thereto. In some embodiments, the semiconductor layer 120 may be regarded as a channel in a transistor structure, so when the threshold voltage of the semiconductor layer 120 is exceeded, the channel may be opened and current may pass through.
[0062] In some embodiments, a recognition unit (not shown) may be disposed on the reaction region 121 of the semiconductor layer 120 to specifically recognize and bind to the biomaterial 210 in the test solution 200. Specifically, one end of the recognition unit may be connected and fixed to the reaction region 121, and the other end of the recognition unit may be used to recognize and bind to the biomaterial 210. The recognition unit may be a chemical molecule or a biological molecule. For example, the recognition unit may be an antibody, an antigen, a nucleic acid, a carbohydrate, or a combination thereof, but is not limited thereto, as long as the recognition unit can specifically recognize and bind to the biomaterial 210.
[0063] Then, please refer to Figure 2 , a dielectric layer 130 is formed on the semiconductor layer 120. The dielectric layer 130 has a first opening O1, an opening 131, and an opening 132. The first opening O1 can expose the reaction region 121 and a portion of the insulating layer IL, and the first opening O1 has a sidewall O11. The opening 131 can expose a portion of the source region 122, and the opening 132 can expose a portion of the drain region 123.
[0064] Then, please refer to Figure 3 , forming a metal layer 140 on the dielectric layer 130. In the present embodiment, the metal layer 140 may cover a portion of the dielectric layer 130 and expose another portion of the dielectric layer 130. The metal layer 140 may include a source SD1, a drain SD2, and a wall structure 141. The source SD1 may be disposed on the dielectric layer 130 and in the opening 131, and the drain SD2 may be disposed on the dielectric layer 130 and in the opening 132, so that the source SD1 and the drain SD2 may be electrically connected to the source region 122 and the drain region 123 of the semiconductor layer 120, respectively. The source SD1, the drain SD2, and the wall structure 141 are disposed on the same layer, and the source SD1, the drain SD2, and the wall structure 141 are physically separated from each other. The source SD1 and the drain SD2 may be electrically insulated from the wall structure 141.
[0065] In the present embodiment, in the three-dimensional view of the biochip 100, the wall structure 141 may surround the first opening O1, the source SD1 and the drain SD2, and the wall structure 141 does not completely surround the first opening O1. Specifically, in the present embodiment, the wall structure 141 may include a first portion 1411 and a second portion 1412. The first portion 1411 has an end point P1 and an end point P2, and the second portion 1412 has an end point P3 and an end point P4. There is a minimum spacing G1 between the end point P1 and the source SD1, between the end point P3 and the source SD1, between the end point P2 and the drain SD2, and between the end point P4 and the drain SD2. The minimum spacing G1 may be, for example, 0.1 micrometers (μm) to 5 micrometers, so that the minimum spacing G1 can be filled and piled up by the protective layer 150 formed subsequently to become a part of the protrusion 152, but it is not limited thereto. When the minimum spacing G1 is less than 0.1 microns, there is a risk of short circuit or bridge between the wall structure 141 and the source SD1 (or drain SD2); when the minimum spacing G1 is greater than 5 microns, the protective layer formed subsequently cannot fill the gap, resulting in a gap in the annular protrusion 152. For example, when the thickness T1 of the protective layer 150 is 1 micron, the minimum spacing G1 can be 1.2 microns, so that the protective layer 150 formed subsequently can fill the minimum spacing G1. In addition, in this embodiment, the contour shape of the first portion 1411 and the second portion 1412 can be a U-shape, but is not limited thereto.
[0066] Then, please refer to Figures 4 to 6 , forming a protective layer 150 on the metal layer 140. In the present embodiment, the protective layer 150 has a flat portion 151, a protruding portion 152, a second opening O2 and a third opening O3. The flat portion 151 may cover another portion of the dielectric layer 130 exposed by the metal layer 140, and the flat portion 151 may be disposed adjacent to the metal layer 140. The flat portion 151 may surround and define the second opening O2. The flat portion 151 has an upper surface 1511 facing away from the dielectric layer 130. In the present embodiment, the thickness T1 of the protective layer 150 may be, for example, 1 micron to 3 microns, but is not limited thereto.
[0067] The second opening O2 may connect the third opening O3 and the first opening O1 to expose the reaction region 121, and the second opening O2 may correspond to and overlap the first opening O1 in the normal direction Z of the substrate 110. The second opening O2 has a sidewall O21. The sidewall O21 of the second opening O2 may be substantially aligned with the sidewall O11 of the first opening O1, but is not limited thereto.
[0068] The protrusion 152 is disposed on the metal layer 140 and the flat portion 151, and the protrusion 152 may correspond to and overlap the wall structure 141, the source SD1, and the drain SD2 in the normal direction Z of the substrate 110. The protrusion 152 may surround and define the third opening O3, and the protrusion 152 may be disposed to form the third opening O3. The protrusion 152 may completely surround the first opening O1 and the second opening O2. The protrusion 152 has an upper surface 1521 facing away from the metal layer 140. The upper surface 1521 of the protrusion 152 may be higher than the upper surface 1511 of the flat portion 151 in the normal direction Z of the substrate 110.
[0069] In some embodiments, the protrusion 152 can be regarded as a three-dimensional structure in which the protective layer 150 protrudes from the upper surface 142 of the metal layer 140 (i.e., the surface of the dielectric layer 130 facing away from the metal layer 140) and is continuous. In some embodiments, in the top view of the biochip 100, the shape of the protrusion 152 can be regarded as a closed ring without a gap to prevent the test solution 200 from flowing out.
[0070] The third opening O3 may be connected to the second opening O2, and the third opening O3 may correspond to and overlap the second opening O2 in the normal direction Z of the substrate 110. The third opening O3 has a side wall O31. The side wall O31 of the third opening O3 does not cut into the side wall O21 of the second opening O2. In addition, in the three-dimensional view of the biochip 100, the third opening O3 may be larger than the first opening O1, the second opening O2, and the reaction area 121.
[0071] Next, please continue to refer to Figure 5 and Figure 6 , the test solution 200 may include a biological material 210 and a liquid 220. The test solution 200 may include, for example, a body fluid such as serum, and the biological material 210 may include, for example, a microorganism or a biological molecule, but is not limited thereto. The microorganism may include, for example, bacteria, viruses, or a combination thereof, and the biological molecule may include, for example, nucleic acid (including deoxyribonucleic acid, RNA, or a combination thereof), nucleotide, protein, carbohydrate, lipid, or a combination thereof, but is not limited thereto.
[0072] In this embodiment, the solution to be tested 200 may be disposed in the first opening O1, the second opening O2, and the third opening O3, and the upper surface 200a of the solution to be tested 200 may cover the upper surface 1511 of the flat portion 151 in the third opening O3. In the normal direction Z of the substrate 110, the upper surface 200a of the solution to be tested 200 may be higher than the upper surface 1511 of the flat portion 151, and the upper surface 200a of the solution to be tested 200 may be between the upper surface 1521 of the protrusion 152 and the upper surface 1511 of the flat portion 151.
[0073] In this embodiment, by setting the wall structure 141, the protrusion 152 can be formed simultaneously in the step of forming the protective layer 150. Therefore, there is no need for additional process steps (such as increasing the number of masks or increasing the stacking, etc.) to manufacture the protrusion 152 that can be used to form the third opening O3, which has the effect of simplifying the process.
[0074] In this embodiment, since the wall structure 141 can surround the first opening O1, the source SD1 and the drain SD2, the protrusion 152 disposed above the wall structure 141 can be a closed shape (for example, a closed rectangle, but not limited thereto) surrounding the first opening O1, so as to confine the solution 200 to be tested in the third opening O3 and prevent the solution 200 to be tested from overflowing to the outside of the third opening O3. Figure 5 and Figure 6 As shown. For example, when the solution 200 to be tested added to the first opening O1 overflows the second opening O2 (or when the upper surface 200a of the solution 200 to be tested added to the first opening O1 is higher than the upper surface 1511 of the flat portion 151), the protrusion 152 can confine the solution 200 to be tested within the third opening O3 and prevent the solution 200 from overflowing, so as to prevent the solution 200 from overflowing into another adjacent reaction area and interfering with the detection result of another biological material. Therefore, compared with a general biochip, the biochip 100 of this embodiment can increase the volume of the solution 200 to be tested that can be accommodated by the biochip 100 through the provision of the third opening O3, so as to cope with a larger amount of solution 200 to be tested, and improve the operation margin and convenience of the biochip 100. Thus, the biochip 100 of this embodiment can be provided with multiple reaction zones to simultaneously detect different biological materials without worrying about overflow of the test solutions in the multiple reaction zones and causing the risk of cross contamination between the multiple reaction zones, thereby achieving the effect of simultaneously detecting multiple biological materials.
[0075] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the previous embodiments, and the following embodiments will not be repeated.
[0076] Figures 7 to 10 A three-dimensional schematic diagram of a method for manufacturing a biochip according to another embodiment of the present disclosure is shown. Fig.11 Shown as Fig.10 A schematic cross-sectional view of a biochip along section line III-III'. For the sake of clarity and convenience of illustration, Fig.10 The semiconductor layer 120 , the first transfer pad 120 a , the second transfer pad 120 b , the metal layer 140 a , and the solution 200 to be tested in the biochip 100 a are omitted from illustration.
[0077] Please also refer to Figures 1 to 6 as well as Figures 7 to 11 , since the biochip 100a of this embodiment is Figures 1 to 6 The biochip 100 in the embodiment is similar to that in the embodiment of the present invention. Figures 1 to 6 The components in the embodiments can be made of the same materials or methods, so the following description of the same and similar parts in the two embodiments will not be repeated, and the differences between the two embodiments will be mainly described.
[0078] Specifically, the manufacturing method of the biochip 100a of this embodiment may include the following steps:
[0079] First, please refer to Figure 7 , a substrate 110 is provided, and a semiconductor layer 120, a first transfer pad 120a, and a second transfer pad 120b are formed on the insulating layer IL. The semiconductor layer 120, the first transfer pad 120a, and the second transfer pad 120b are disposed on the same layer, and the semiconductor layer 120, the first transfer pad 120a, and the second transfer pad 120b are physically separated from each other. In the present embodiment, the material of the first transfer pad 120a and the second transfer pad 120b may include polysilicon or other suitable semiconductor materials, but is not limited thereto.
[0080] Then, please refer to Figure 8 , a dielectric layer 130a is formed on the semiconductor layer 120, the first transfer pad 120a and the second transfer pad 120b. The dielectric layer 130a has a first opening O1, an opening 131, an opening 132, an opening 133, an opening 134, an opening 135 and an opening 136. The opening 133 and the opening 134 can respectively expose different portions of the first transfer pad 120a, and the opening 135 and the opening 136 can respectively expose different portions of the second transfer pad 120b.
[0081] Then, please refer to Fig. 9, forming a metal layer 140a on the dielectric layer 130a. In the present embodiment, the metal layer 140a may include a source SD1, a drain SD2, a wall structure 141a, a source extension pad SD1a, and a drain extension pad SD2a. The source SD1 may be disposed on the dielectric layer 130a and in the opening 134 and the opening 131, so that the source SD1 may be electrically connected to the first transfer pad 120a and the source region 122 of the semiconductor layer 120, respectively. The source extension pad SD1a may be disposed on the dielectric layer 130a and in the opening 133, so that the source extension pad SD1a may be electrically connected to the first transfer pad 120a. The drain SD2 may be disposed on the dielectric layer 130a and in the opening 132 and the opening 135, so that the drain SD2 may be electrically connected to the drain region 123 of the semiconductor layer 120 and the second transfer pad 120b, respectively. The drain extension pad SD2a may be disposed on the dielectric layer 130a and in the opening 136 so that the drain extension pad SD2a may be electrically connected to the second transfer pad 120b. In other words, the source SD1 may be electrically connected to the source extension pad SD1a through the first transfer pad 120a, and the drain SD2 may be electrically connected to the drain extension pad SD2a through the second transfer pad 120b.
[0082] In the present embodiment, in the three-dimensional view of the biochip 100a, the wall structure 141a can completely surround the first opening O1. There is a minimum spacing G2 between the wall structure 141a and the source SD1, between the wall structure 141a and the source extension pad SD1a, between the wall structure 141a and the drain SD2, and between the wall structure 141a and the drain extension pad SD2a. The minimum spacing G2 can be, for example, greater than 0 microns, but is not limited thereto. In addition, in the present embodiment, the outline shape of the wall structure 141a can be a rectangle, but is not limited thereto.
[0083] Then, please refer to Fig.10 and Fig.11 , forming a protection layer 150 on the metal layer 140a. In the present embodiment, the protection layer 150 has a flat portion 151, a protruding portion 152a, a second opening O2, and a third opening O3. The protruding portion 152a may be disposed corresponding to the wall structure 141a, the source SD1, the drain SD2, the source extension pad SD1a, and the drain extension pad SD2a in the normal direction Z of the substrate 110. The protruding portion 152a may surround and define the third opening O3, and the configuration of the protruding portion 152a may be used to form the third opening O3. The protruding portion 152a may completely surround the first opening O1 and the second opening O2.
[0084] In the biochip 100a of this embodiment, since the wall structure 141a is a closed annular structure without a gap, it can be ensured that the protrusion 152a of the protection layer 150 formed on the wall structure 141a should also be a closed annular structure without a gap.
[0085] In the biochip 100a of this embodiment, since the source SD1 and the drain SD2 need to transmit or receive signals through the first transfer pad 120a and the second transfer pad 120b respectively, the signal strength will be attenuated. Figures 1 to 6 The source SD1 and the drain SD2 of the biochip 100 do not need to transmit or receive signals through the setting of the transfer pad, thereby avoiding the risk of signal attenuation.
[0086] In summary, in the biochip and its manufacturing method of one embodiment of the present invention, by setting the wall structure, the protrusion can be formed simultaneously in the step of forming the protective layer, so that the process is simplified. Since the protrusion can be a closed figure surrounding the first opening, the solution to be tested can be confined within the third opening to prevent the solution to be tested from overflowing outside the third opening. Compared with the general biochip, the biochip of this embodiment can increase the volume of the solution to be tested that the biochip can accommodate by setting the third opening to prevent the solution to be tested from overflowing and can cope with a larger amount of solution to be tested, and improve the operation margin and convenience of the biochip. Thereby, when a plurality of reaction areas are provided in the biochip of this embodiment, the plurality of reaction areas can be used to detect different kinds of biological materials respectively, and there is no need to worry about the problem of cross contamination caused by the overflow of the solution to be tested between different reaction areas, thereby achieving the effect of detecting multiple biological materials at the same time.
[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A biochip for detecting biological materials in a solution to be tested, characterized in that: include: substrate; An insulating layer, disposed on the substrate; A semiconductor layer, disposed on the insulating layer and having a reaction area; A dielectric layer, disposed on the semiconductor layer and having a first opening; A metal layer is disposed on the dielectric layer and comprises: A source electrode and a drain electrode, electrically connected to the semiconductor layer respectively; and a wall structure surrounding the first opening, the source electrode and the drain electrode; and a protection layer disposed on the metal layer and having a flat portion, a protruding portion, a second opening and a third opening; wherein the flat portion surrounds and defines the second opening, the protruding portion is arranged corresponding to the wall structure, and the protruding portion surrounds and defines the third opening, The second opening connects the third opening and the first opening to expose the reaction area.
2. The biochip according to claim 1, characterized in that: The source, the drain and the wall structure are separated from each other, and the source and the drain are electrically insulated from the wall structure.
3. The biochip according to claim 1, characterized in that: In the three-dimensional view of the biochip, the wall structure does not completely surround the first opening.
4. The biochip according to claim 1, characterized in that: In the stereoscopic view of the biochip, the wall structure completely surrounds the first opening.
5. The biochip according to claim 1, characterized in that: The minimum distance between the wall structure and the source electrode is 0.1 micrometer to 5 micrometers.
6. The biochip according to claim 1, characterized in that: In the stereoscopic view of the biochip, the third opening is larger than the second opening.
7. The biochip according to claim 1, characterized in that: The protrusion completely surrounds the first opening and the second opening.
8. The biochip according to claim 1, characterized in that: The solution to be tested is disposed in the first opening, and an upper surface of the solution to be tested is between an upper surface of the protruding portion and an upper surface of the flat portion.
9. The biochip according to claim 1, characterized in that: The metal layer further includes a source extension pad and a drain extension pad, and the biochip further includes: The first transfer pad and the second transfer pad are respectively arranged on the insulating layer, The source is electrically connected to the source extension pad through the first transfer pad, and the drain is electrically connected to the drain extension pad through the second transfer pad.
10. A method for manufacturing a biochip, wherein the biochip is used to detect biological materials in a solution to be tested, characterized in that: The manufacturing method comprises: providing a substrate; forming an insulating layer on the substrate; forming a semiconductor layer on the insulating layer, wherein the semiconductor layer has a reaction area; forming a dielectric layer on the semiconductor layer, wherein the dielectric layer has a first opening; forming a metal layer on the dielectric layer, wherein the metal layer comprises: A source electrode and a drain electrode, electrically connected to the semiconductor layer respectively; and A wall structure surrounding the first opening, the source electrode and the drain electrode; and forming a protection layer on the metal layer, wherein the protection layer has a flat portion, a protruding portion, a second opening and a third opening; wherein the flat portion surrounds and defines the second opening, the protruding portion is arranged corresponding to the wall structure, and the protruding portion surrounds and defines the third opening, The second opening connects the third opening and the first opening to expose the reaction area.