Base plate anode fixed-point coating device

Abstract

A fixed-point coating device for a substrate anode belongs to the technical field of anode coating, and comprises a substrate frame and a support frame detachably connected in the substrate frame, a mask plate is positioned and placed on the support frame, a driving substrate is placed on the mask plate, and the driving substrate is positioned on the support frame. A plurality of through holes opposite to the plurality of chip display areas on the driving substrate are formed in the mask plate, and the positive electrode fixed-point film plating device has the beneficial effects that the positive electrode fixed-point film plating device is simple in structure and convenient to use, can realize fixed-point film plating of the positive electrode, avoids the condition of overflow plating, and improves the film plating precision and efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of anode coating, in particular to a substrate anode fixed-point coating device. Background Art

[0002] In the prior art, the anode coating technology is basically to coat the entire surface of one side of the driving substrate, and then complete the preparation of the anode through processes such as dry etching. For example, the patent with publication number CN112103402A discloses a method for preparing an OLED anode, first cleaning the silicon substrate with deionized water, then forming an anode layer on the silicon substrate, then evenly spin-coating an alkali-soluble anti-emission coating and a positive photoresist layer on the anode layer, then photolithography and development of the photoresist layer and the anti-reflection coating to obtain a pixel pattern, then using an etching gas to bombard the bottom of the anode layer that is not protected by the photoresist layer and the anti-emission coating, and then using a developer to remove the photoresist layer and the anti-reflection coating to form anode pixels, and finally cleaning and drying the silicon substrate.

[0003] However, for small driver substrates, such as AR glasses, electronic watch screens, etc., the external chip terminals cannot be plated, and precise anodizing is required on the chip display area. However, the existing full-surface anodizing process has the problems of insufficient precision and overflow plating, and cannot meet the preparation requirements. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a substrate anode fixed-point coating device, which has a simple structure and is easy to use. It can realize the fixed-point coating of the anode, avoid overflow coating, and improve the coating accuracy and efficiency.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model to solve its technical problem is: the substrate anode fixed-point coating device includes a substrate frame and a detachable supporting frame connected thereto, a mask plate is positioned on the supporting frame, a driving substrate is placed on the mask plate, and a plurality of through holes are provided on the mask plate corresponding to the plurality of chip display areas on the driving substrate.

[0006] A positioning groove I is provided at the bottom of the substrate frame, and the supporting frame is placed in the positioning groove I.

[0007] A plurality of fixing ears are respectively arranged at intervals on both sides of the support frame along the length direction thereof, and the fixing ears are connected to the substrate frame through a bolt assembly after being overlapped on the substrate frame.

[0008] The fixing ears are configured as L-shaped ears, and the outer ends of the fixing ears are overlapped and fixed to the edge of the substrate frame.

[0009] The bottom of the support frame is provided with a positioning groove II, and the mask plate is positioned and placed in the positioning groove II.

[0010] The inner edge of the support frame is provided with one or more notches for facilitating the placement of the mask plate.

[0011] A pressing cover plate is attached to the driving substrate.

[0012] The beneficial effects of the utility model are:

[0013] The utility model collects the size of the driving substrate and manufactures a mask plate including through holes of corresponding sizes, and improves the structure of the existing substrate frame of the coating machine. A support frame can be detachably installed on the substrate frame to stably support the corresponding mask plate. After the driving substrate is placed on the mask plate, the driving substrate is pressed by a pressing cover plate, and point coating can be performed on the chip display area on the driving substrate through methods such as magnetron sputtering, thereby avoiding overflow coating and improving coating accuracy and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The following is a brief description of the contents expressed in each of the drawings of the utility model specification and the marks in the drawings:

[0015] Figure 1 It is a top view of the substrate anode fixed-point coating device of the utility model;

[0016] Figure 2 for Figure 1 AA section view;

[0017] Figure 3 for Figure 1 Schematic diagram of the structure of the middle mask plate;

[0018] The markings in the above figures are: 1. substrate frame, 11. positioning groove I, 2. support frame, 21. fixing ear, 22. positioning groove II, 23. notch, 3. mask plate, 31. through hole, 4. driving substrate, 5. bolt assembly, 6. clamping cover plate. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. The following embodiments are used to illustrate the utility model but are not used to limit the scope of the utility model.

[0020] In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] The specific implementation scheme of the utility model is as follows: Figure 1-Figure 3 As shown, the utility model provides a substrate anode fixed-point coating device, including a substrate frame 1 and a support frame 2 detachably connected therein, a mask plate 3 is positioned and placed on the support frame 2, a driving substrate 4 is placed on the mask plate 3, a chip array is arranged on the driving substrate 4, each chip is arranged with a display area and a non-display area, and an anode needs to be prepared on the display area, and a plurality of through holes 31 are arranged on the mask plate 3 that are opposite to the display areas of the plurality of chips on the driving substrate 4. The utility model collects the size of the driving substrate 4 and manufactures a mask plate 3 including through holes 31 of corresponding sizes, and improves the structure of the substrate frame of the existing coating machine, and the support frame 2 is detachably installed on the substrate frame 1, which can stably support the corresponding mask plate 3, and after the driving substrate 4 is placed on the mask plate 3, the chip display area on the driving substrate 4 can be fixed-point coated by magnetron sputtering and other methods, thereby avoiding the situation of overflow coating and improving the coating accuracy and efficiency.

[0023] Specifically, the substrate frame 1 is configured as a rectangular frame, a positioning groove Ⅰ11 is provided at the bottom of the substrate frame 1, a support frame 2 is placed in the positioning groove Ⅰ11, and the support frame 2 is configured as a rectangular frame to position and support the mask plate 3.

[0024] A plurality of fixing ears 21 are arranged at intervals on both sides of the support frame 2 along the length direction thereof, and a plurality of threaded holes are arranged on the edge of the substrate frame 1. After the plurality of fixing ears 21 are overlapped on the substrate frame 1, they are connected to the corresponding threaded holes on the substrate frame 1 through the bolt assembly 5. The fixing ears 21 are arranged as L-shaped ears, and the outer ends of the fixing ears 21 are overlapped and fixed on the edge of the substrate frame 1, so that the installation and removal of the entire support frame 2 are more convenient and quick.

[0025] The bottom of the support frame 2 is provided with a positioning groove II 22, in which the mask plate 3 is positioned and placed, and the mask plate 3 can be stably supported and positioned. The inner edge of the support frame 2 is provided with one or more notches 23 for conveniently taking and placing the mask plate 3, making the positioning and placement of the mask plate 3 more convenient.

[0026] In addition, a clamping cover plate 6 is attached to the driving substrate 4, and the clamping cover plate 6 is set as an aluminum cover plate. In order to ensure the stability of clamping, a positioning frame can also be attached to the clamping cover plate 6 so that the edge of the positioning frame is connected to the substrate frame 1, thereby ensuring the stability of the positioning of the driving substrate 4.

[0027] The method of using the above substrate anode fixed-point coating device is as follows: the support frame 2 is installed on the substrate frame 1 by the bolt assembly 5, the mask plate 3 is placed in the positioning groove II 22 of the support frame 2, and then the driving substrate 4 to be coated is placed on the mask plate 3, so that the chip display area on the driving substrate 4 is aligned with the corresponding through hole 31 on the mask plate 3, and then the pressing cover plate 6 is attached to the driving substrate 4, and the positioning of the driving substrate 4 is completed. ITO is deposited at the corresponding position on the driving substrate 4 by magnetron sputtering or vapor deposition to form the required anode.

[0028] In summary, the utility model has a simple structure and is easy to use, can realize fixed-point plating of the anode, avoids overflow plating, and improves the plating accuracy and efficiency.

[0029] The above description is only used to illustrate some principles of the utility model. This specification is not intended to limit the utility model to the specific structure and application scope shown and described. Therefore, all corresponding modifications and equivalents that may be used belong to the patent scope applied for the utility model.

Claims

1. A substrate anode fixed-point coating device, characterized in that: It comprises a substrate frame and a detachably connected supporting frame therein, wherein a mask plate is positioned on the supporting frame, a driving substrate is placed on the mask plate, and a plurality of through holes corresponding to a plurality of chip display areas on the driving substrate are arranged on the mask plate.

2. The substrate anode fixed-point coating device according to claim 1 is characterized in that: A positioning groove I is provided at the bottom of the substrate frame, and the supporting frame is placed in the positioning groove I.

3. The substrate anode fixed-point coating device according to claim 1 is characterized in that: A plurality of fixing ears are respectively arranged at intervals on both sides of the support frame along the length direction thereof, and the fixing ears are connected to the substrate frame through a bolt assembly after being overlapped on the substrate frame.

4. The substrate anode fixed-point coating device according to claim 3 is characterized in that: The fixing ears are configured as L-shaped ears, and the outer ends of the fixing ears are overlapped and fixed to the edge of the substrate frame.

5. The substrate anode fixed-point coating device according to claim 1 is characterized in that: The bottom of the support frame is provided with a positioning groove II, and the mask plate is positioned and placed in the positioning groove II.

6. The substrate anode fixed-point coating device according to claim 5 is characterized in that: The inner edge of the support frame is provided with one or more notches for facilitating the placement of the mask plate.

7. The substrate anode fixed-point coating device according to claim 1 is characterized in that: A pressing cover plate is attached to the driving substrate.

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