Circuit connection structure of circuit board and semiconductor product with circuit connection structure

Abstract

The utility model discloses a circuit connection structure of a circuit board and a semiconductor product with the circuit connection structure, and the circuit connection structure comprises a metal pad arranged on a substrate of the circuit board and a metal lead or a reballing connected with the metal pad, a recess extending towards the direction of the surface, connected with the substrate, of the metal pad is formed in the surface, connected with the metal wire or the ball, of the metal pad, and the metal wire or the ball is suitable for being connected into the recess. The recesses are arranged at the joints of the metal pads and the metal wires or the balls, so that the contact area between the metal pads and the metal wires or the balls is increased, the bonding strength between the metal wires or the balls and the metal pads is improved, and the yield and reliability of the circuit board and the semiconductor product are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a circuit connection structure of a circuit board and a semiconductor product having the same. Background Art

[0002] In the copper foil substrate and semiconductor manufacturing process, the metal circuits and metal pads on the substrate are used to allow current to flow. The connection between the substrate and the entire product system relies on the connection of metal wires or implant balls. The strength of the adhesion between the metal wires and the metal pads on the circuits on the substrate is directly related to the yield and reliability of the product. Figures 1 to 3 As shown, the surface of the metal pad connected to the metal wire or the implant ball is flat, and the metal pad and the metal wire or the implant ball are directly connected together by soldering. The industry practice is to solve the connection reliability between the metal pad and the metal wire or the implant ball by selecting suitable materials to match the materials between the line connection structures. The process is simple and the cost is low. However, the defects of this line connection structure are that the bonding strength between the metal pad and the metal wire or the implant ball is low, and the connection reliability is poor. The connection structure may easily cause the metal wire or the implant ball to partially or completely fall off from the metal pad during the process of semiconductor packaging into products or during use or transportation due to external forces, thereby affecting the electrical connection performance of the product or even failing to form an electrical connection, resulting in a reduction in product yield. The present utility model is derived from this. Utility Model Content

[0003] In view of at least one of the above-mentioned technical problems, the purpose of the present utility model is to provide a circuit connection structure of a circuit board and a semiconductor product having the same.

[0004] The technical solution of the utility model is:

[0005] One of the purposes of the utility model is to provide a circuit connection structure of a circuit board, comprising a metal pad arranged on a substrate of the circuit board and a metal wire or a planting ball connected to the metal pad, wherein a depression extending toward a side where the metal pad is connected to the substrate is provided on one side of the metal pad connected to the metal wire or the planting ball, a rough structure is formed on the bottom surface of the depression, and the metal wire or the planting ball is suitable for being connected in the depression and combined with the rough structure.

[0006] Optionally, the rough structure includes a plurality of convex portions that are arranged at intervals and extend protruding toward the opening direction of the depression and / or a plurality of concave portions that are arranged at intervals and extend away from the opening direction of the depression.

[0007] Optionally, the cross-section of the convex portion or the concave portion is triangular, conical or arc-shaped.

[0008] Optionally, the convex portions or concave portions are irregularly formed on the bottom surface of the depression.

[0009] Optionally, the cross-section of the recess is arc-shaped or square-shaped.

[0010] Optionally, one end of the metal wire or the implant ball connected to the metal pad fills the entire recess or fills more than half of the space of the recess.

[0011] Another object of the present invention is to provide a circuit board, comprising a substrate and the above-mentioned circuit connection structure.

[0012] Another object of the present utility model is to provide a semiconductor product, comprising a circuit board and a packaging shell, wherein the circuit board comprises any of the circuit connection structures described above or the circuit board is the circuit board described above.

[0013] Compared with the prior art, the advantages of the utility model are:

[0014] The circuit connection structure of the circuit board of the utility model increases the contact area between the metal pad and the metal wire or the planting ball by setting a depression at the connection between the metal pad and the metal wire or the planting ball, thereby enhancing the bonding strength between the metal wire or the planting ball and the metal pad, thereby improving the yield and reliability of the circuit board and semiconductor products. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0016] Figure 1 This is a schematic diagram of the structure of the substrate and the metal pad of the circuit board before the improvement of the embodiment of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the circuit connection structure (connection between metal wires and metal pads) of the circuit board before improvement in the embodiment of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the circuit connection structure (connection between the ball planting and the metal pad) of the circuit board before the improvement of the embodiment of the utility model;

[0019] Figure 4 A schematic structural diagram of an implementation of a circuit connection structure of a circuit board (only the substrate and the metal pad are shown) according to an embodiment of the utility model;

[0020] Figure 5 A schematic structural diagram of another implementation of the circuit connection structure of the circuit board of the embodiment of the utility model (only the substrate and the metal pad are shown);

[0021] Figure 6 This is a structural schematic diagram of another implementation of the circuit connection structure of the circuit board of the embodiment of the utility model (only the substrate and the metal pad are shown).

[0022] Among them: 1. substrate; 2. metal pad; 3. depression; 4. protrusion. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the utility model. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the utility model.

[0024] See also Figures 4 to 6 The circuit connection structure of the circuit board of the embodiment of the utility model includes a metal pad 2 arranged on the substrate 1 of the circuit board and a metal wire or a planting ball arranged above the metal pad 2 and connected to the metal pad 2. Among them, the end surface of the metal pad 2 connected to the metal wire or the planting ball of the embodiment of the utility model is not as Figures 1 to 3 As shown in the prior art, it is a plane, but as Figures 4 to 6 The side shown in the figure is connected to the metal pad 2 and the substrate 1. Figure 4 The recess 3 extending downward is shown, and the metal wire or the implant ball is suitable for connecting in the recess 3. In the embodiment of the utility model, the recess 3 is provided at the connection between the metal pad 2 and the metal wire or the implant ball, thereby increasing the contact area between the metal pad 2 and the metal wire or the implant ball, thereby enhancing the bonding strength between the metal wire or the implant ball and the metal pad 2, and improving the yield and reliability of the circuit board and the semiconductor product.

[0025] More specifically, Figure 5 and Figure 6 As shown, in order to further enhance the bonding strength between the metal wire or the implant ball and the metal pad 2, a rough structure combined with the metal wire or the implant ball is provided on the bottom surface of the recess 3. As for the rough structure, an optional embodiment is as follows: Figure 5 and Figure 6 As shown, the rough structure is a plurality of intervals arranged toward the opening direction of the recess 3, that is, Figure 5 and Figure 6 The convex portion 4 shown in the figure protrudes upward and extends. The arrangement of the convex portion 4 can further increase the contact area between the metal pad 2 and the metal wire or the implant ball. In another optional embodiment, the rough structure can also be formed on the bottom surface of the recess 3. A plurality of recesses (not shown) are arranged at intervals and face away from the opening direction of the recess 3, that is, concave downward. In another optional embodiment, the rough structure includes the convex portion 4 and the concave portion mentioned above, and the convex portion 4 and the concave portion can be arranged alternately. For the convex portion 4, its cross section can be selected as follows: Figure 5 The triangle or cone shown or Figure 6The arc shape shown. Similarly, the cross section of the recess can also be selected as an inverted triangle or an inverted cone or an arc shape, etc. Optionally, the convex portion 4 and / or the concave portion on the bottom surface of the recess 3 are irregularly arranged on the bottom surface of the recess 3, which can reduce the difficulty of manufacturing. For the triangular or conical convex portion 4, the existing conventional wet etching process is used to form it, and for the arc-shaped convex portion 4, the existing conventional chemical plating growth can be used. The specific description and limitation are not made in detail, and it is easy for those skilled in the art to know and implement it, which is not the innovation of the present utility model.

[0026] For depression 3, if Figures 4 to 6 As shown, its cross section can be arc-shaped. Alternatively, the cross section of the recess 3 can also be square or other shapes (not shown). The shape is relatively regular and easy to make. It can also be formed by wet etching.

[0027] For the connection between the metal wire or the planting ball and the recess 3, it is preferred that the end of the metal wire or the planting ball connected to the metal pad 2 fills the entire recess 3. The connection area is larger and the bonding force is stronger. As an alternative, the metal wire or the planting ball can also fill only part (preferably more than half) of the space of the recess 3. While ensuring strong bonding force, the cost can be appropriately reduced.

[0028] The present invention also provides a circuit board (not shown) comprising a substrate 1 and the circuit connection structure of the above embodiment, wherein the substrate 1 is a copper foil substrate.

[0029] The present utility model embodiment also provides a semiconductor product (not shown), including a circuit board and a package shell, wherein the circuit board is the circuit board of the above embodiment or includes the circuit connection structure of the above embodiment. The package shell is not described or limited, and is not an innovation of the present utility model. The circuit connection structure is used to connect the substrate 1 and the entire product system, so that the circuit board is electrically connected to the entire product system.

[0030] It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and do not constitute a limitation on the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the claims attached to the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the attached claims, or the equivalent forms of such scope and boundaries.

Claims

1. A circuit connection structure of a circuit board, characterized in that: It includes a metal pad arranged on a substrate of a circuit board and a metal wire or a planting ball connected to the metal pad, wherein a depression extending toward a side where the metal pad is connected to the substrate is provided on one side of the metal pad connected to the metal wire or the planting ball, a rough structure is formed on the bottom surface of the depression, and the metal wire or the planting ball is suitable for being connected in the depression and combined with the rough structure.

2. The line connection structure according to claim 1, characterized in that: The rough structure includes a plurality of convex portions which are arranged at intervals and extend protrudingly toward the opening direction of the depression and / or a plurality of concave portions which are arranged at intervals and extend away from the opening direction of the depression.

3. The line connection structure according to claim 2, characterized in that: The cross section of the convex portion or the concave portion is triangular, conical or arc-shaped.

4. The line connection structure according to claim 2, characterized in that: The convex portion or the concave portion is formed on the bottom surface of the depression.

5. The line connection structure according to claim 1, characterized in that: The cross section of the recess is arc-shaped or square-shaped.

6. The line connection structure according to any one of claims 1 to 5, characterized in that: One end of the metal wire or the implant ball connected to the metal pad fills the entire recess or fills more than half of the space of the recess.

7. A circuit board, characterized in that: It comprises a substrate and the circuit connection structure according to any one of claims 1 to 6.

8. A semiconductor product, characterized in that: It comprises a circuit board and a packaging shell, wherein the circuit board comprises the circuit connection structure according to any one of claims 1 to 6 or the circuit board is the circuit board according to claim 7.

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