Ceramic packaging shell structure of microwave device

Abstract

The utility model provides a ceramic packaging shell structure of a microwave device, which relates to the field of electronic component packaging and comprises a ceramic shell, a connecting hole and mounting holes are arranged in the ceramic shell, the mounting holes are symmetrically arranged on two sides of the connecting hole, a packaging sheet is connected in the connecting hole, a welding seat is arranged on the lower side of the ceramic shell, and the welding seat is connected with the mounting holes. A lower notch is formed in the outer side of the welding seat, an inner groove cavity is formed in the welding seat, a welding ring is connected to the lower end of the welding seat, a sealing metal sheet is connected to the lower side of the welding ring, a longitudinally-penetrating pin electrode is arranged in the inner groove cavity, and the upper end of the pin electrode is connected with a packaging sheet through a wire; and the outer end of the pin electrode is connected with the inner cavity wall of the inner groove cavity through a metal rod. According to the utility model, the problems that the existing ceramic packaging shell of the microwave power device is single in structure and is made of excessive metal materials, so that the weight of the ceramic packaging shell is increased, and the heat dissipation efficiency is low are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component packaging, in particular to a ceramic packaging shell structure of a microwave device. Background Art

[0002] As the output power of solid-state microwave devices continues to increase, the heat generated during their operation also continues to increase. In terms of packaging, it is necessary to continuously improve the heat dissipation capacity of the shell, so as to achieve the timely conduction of the waste heat generated by the device during operation to the system's radiator, so as to avoid the phenomenon of device performance degradation or even failure due to heat accumulation. After searching, the prior art (application number: CN202122595175.X) records "a through-type ceramic shell for high-power solid-state microwave power devices, including a metal frame, a metal heat sink, a metal lead and a ceramic insulator. The metal frame is connected to the metal heat sink, and the ceramic insulator is embedded in the slot of the metal frame. The metal lead penetrates the blind cavity structure ceramic insulator and realizes airtight packaging. The shell uses zirconium-copper alloy to penetrate the ceramic insulator to prepare the transmission port, which realizes a significant reduction in resistance pass-through and radio frequency loss; the copper-based alloy is nested in the diamond copper material structure to achieve the packaging and heat dissipation requirements of narrow pulse high-power solid-state microwave devices. The metal shell can realize the airtight packaging of high-power solid-state microwave power devices within 12GHz, greatly improving the performance of the device."

[0003] However, although the ceramic packaging shell of the microwave power device in the prior art can achieve the effect of heat dissipation after packaging, it still has some shortcomings: the existing ceramic packaging shell of the microwave power device has a single structure, and the metal frame and metal heat sink involved greatly increase the weight of the packaged microwave device, which in turn leads to an increase in the weight of the electrical equipment installed with the device; secondly, the thermal conductivity of metal is not as good as that of ceramic, which will greatly reduce the heat dissipation efficiency of the device. Utility Model Content

[0004] In order to overcome the defects of the prior art, a ceramic packaging shell structure of a microwave device is provided to solve the problems that the ceramic packaging shell structure of the existing microwave power device is single, too much metal material is used, resulting in increased weight and low heat dissipation efficiency.

[0005] To achieve the above-mentioned purpose, a ceramic packaging shell structure of a microwave device is provided, comprising: a ceramic shell, a connection hole and a mounting hole are opened inside the ceramic shell, and the mounting holes are symmetrically arranged on both sides of the connection hole, and a packaging sheet is connected to the connection hole, a welding seat is provided on the lower side of the ceramic shell, and a lower recess is provided on the outer side of the welding seat, and an inner groove cavity is provided inside the welding seat, a welding ring is connected to the lower end of the welding seat, and a sealing metal sheet is connected to the lower side of the welding ring, a pin electrode is longitudinally penetrated inside the inner groove cavity, and the upper end of the pin electrode is connected to the packaging sheet through a wire, and the outer end of the pin electrode is connected to the inner cavity wall of the inner groove cavity through a metal rod.

[0006] Furthermore, the ceramic housing is configured as a rectangular plate structure, and a packaging area of ​​a rectangular structure is provided in the middle of the rectangular plate, and the connection hole is opened inside the packaging area.

[0007] Furthermore, the packaging sheet is configured as a T-shaped structure made of metal material, and the packaging sheet is fixed in the connection hole through a metallization layer arranged inside the connection hole, and the upper end surface of the packaging sheet is flush with the ceramic housing.

[0008] Furthermore, a metal sleeve is provided on the inner wall of the mounting hole, and an inner thread is provided on the inner wall of the metal sleeve.

[0009] Furthermore, the pin electrode is suspended and fixed in the inner groove cavity, and the front and rear ends of the pin electrode both exceed the edge of the ceramic shell.

[0010] Furthermore, the ceramic shell is configured as a T-shaped structure as a whole, and the lower notch is located at a vertical angle of the outer edge of the upper end of the welding seat.

[0011] The beneficial effects of the utility model are:

[0012] 1. The ceramic shell is set as a ceramic structure as a whole, so that the contact area with the air is greatly increased through the porous structure of the ceramic material itself, thereby greatly enhancing the heat dissipation effect, and the ceramic material has good corrosion resistance and stability;

[0013] 2. The packaging area, connection holes and packaging sheet opened in the ceramic shell are used to facilitate the packaging and fixing of the microwave device on the packaging sheet, and the packaging sheet of the T-shaped structure is stably connected to the connection hole through the metallization layer, and then the pin electrode is welded to the circuit board after being welded and fixed on the welding seat through the connection of the wire and the pin electrode to achieve electrical connection;

[0014] 3. Use welding rings and sealing metal sheets to achieve direct welding and fixing with the circuit board. The mounting holes and metal sleeves facilitate the effect of reinforcing the ceramic shell with bolts. The lower recess and the inner groove cavity that passes through the welding seat can further increase the contact area between the ceramic shell and the air, thereby improving the heat dissipation efficiency. At the same time, the welding seat and the ceramic shell are set as an integrally connected ceramic structure, and the upper and lower layers of the packaging sheet are in contact with the external air, thereby enhancing the heat dissipation effect of the microwave device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the top structure of an embodiment of the utility model.

[0016] Figure 2 This is a schematic diagram of a top view of the structure of a ceramic housing without a packaging sheet installed in an embodiment of the utility model.

[0017] Figure 3 The figure is a schematic diagram of the cross-sectional structure of a ceramic shell according to an embodiment of the present utility model.

[0018] In the figure: 1, ceramic shell; 11, mounting hole; 111, metal sleeve; 112, lower notch; 113, inner groove cavity; 12, pin electrode; 121, wire; 122, metal rod; 13, packaging area; 131, metallization layer; 14, packaging sheet; 15, connecting hole; 16, welding seat; 17, welding ring; 18, sealing metal sheet. DETAILED DESCRIPTION

[0019] Reference Figures 1 to 3 As shown, the utility model provides a ceramic packaging shell structure of a microwave device, including: a ceramic shell 1.

[0020] Specifically, a connecting hole 15 and a mounting hole 11 are provided inside the ceramic shell 1, and the mounting holes 11 are symmetrically arranged on both sides of the connecting hole 15, and a packaging sheet 14 is connected to the connecting hole 15, a welding seat 16 is provided on the lower side of the ceramic shell 1, and a lower recess 112 is provided on the outer side of the welding seat 16, and an inner groove cavity 113 is provided inside the welding seat 16, a welding ring 17 is connected to the lower end of the welding seat 16, and a sealing metal sheet 18 is connected to the lower side of the welding ring 17, a pin electrode 12 is longitudinally penetrated inside the inner groove cavity 113, and the upper end of the pin electrode 12 is connected to the packaging sheet 14 through a wire 121, and the outer end of the pin electrode 12 is connected to the inner cavity wall of the inner groove cavity 113 through a metal rod 122.

[0021] In this embodiment, ceramic shell 1 is shaped by a mold and then ceramic powder is added, compacted, and then sintered by a chain sintering furnace to make the ceramic powder particles molten to form the shape of the product. Then, a metallization layer 131 is formed on the inner wall of the connecting hole 15 through a metallization process.

[0022] As a preferred implementation, the metallization layer 131 is used to facilitate welding and fixing of the packaging sheet 14 .

[0023] As a preferred implementation, the welding ring 17 is provided to achieve a welding effect on the one hand, and the air flow at the bottom of the welding seat 16 is achieved through the ring hole inside the welding ring 17 on the other hand, thereby enhancing the heat dissipation effect.

[0024] Reference Figure 2 and Figure 3 The ceramic shell 1 is set as a rectangular plate structure, and a rectangular packaging area 13 is provided in the middle of the rectangular plate. At the same time, a connecting hole 15 is opened inside the packaging area 13. The packaging sheet 14 is set as a T-shaped structure of a metal material, and the packaging sheet 14 is fixed in the connecting hole 15 through a metallization layer 131 arranged on the inner side of the connecting hole 15. At the same time, the upper end surface of the packaging sheet 14 is flush with the ceramic shell 1, and a metal sleeve 111 is provided on the inner hole wall of the mounting hole 11, and an internal thread is provided on the inner wall of the metal sleeve 111.

[0025] As a preferred implementation, by providing the mounting hole 11 and the metal sleeve 111, after the welding seat 16 is welded, a three-point support installation is achieved by bolting on both sides thereof, thereby enhancing the stability of the structure.

[0026] Reference Figure 1 and Figure 3 The pin electrode 12 is suspended and fixed in the inner groove cavity 113, and the front and rear ends of the pin electrode 12 exceed the edge of the ceramic shell 1. The ceramic shell 1 is set as a T-shaped structure as a whole, and the lower notch 112 is located at a vertical angle of the outer edge of the upper end of the welding seat 16.

[0027] As a preferred implementation, by setting the outer end of the pin electrode 12 to exceed the edge of the ceramic housing 1, it is convenient to connect the pin electrode 12 to the circuit board.

[0028] As a preferred implementation, the ceramic housing 1 is arranged as a T-shaped structure as a whole, so that an overhead part is presented after installation, and then cooperates with the lower recess 112 to increase the air circulation area, thereby improving the heat dissipation effect.

[0029] When in use, the ceramic shell is set as a ceramic structure as a whole, so that the contact area with the air is greatly increased through the porous structure of the ceramic material itself, thereby greatly enhancing the heat dissipation effect, and the ceramic material has good corrosion resistance and stability; the packaging area, connection holes and packaging sheets opened in the ceramic shell are used to facilitate the packaging and fixing of the microwave device on the packaging sheet, and the packaging sheet with a T-shaped structure is stably connected to the connection hole through the metallization layer, and then the pin electrode is welded to the circuit board through the connection of the wire and the pin electrode to achieve electrical connection after the welding seat is welded and fixed; the welding ring and the sealing metal sheet are used to achieve direct welding and fixing with the circuit board, and the ceramic shell is conveniently connected by bolts through the mounting holes and the metal sleeve, and the contact area between the ceramic shell and the air is further increased through the lower notch and the inner groove cavity that passes through the welding seat, thereby improving the heat dissipation efficiency. At the same time, the welding seat and the ceramic shell are set as an integrally connected ceramic structure, and the upper and lower layers of the packaging sheet are in contact with the external air, thereby enhancing the heat dissipation effect of the microwave device.

[0030] The ceramic packaging shell structure of the microwave device of the utility model can effectively solve the problems of the existing microwave power device ceramic packaging shell having a single structure, using too much metal material, resulting in increased weight and low heat dissipation efficiency. It improves the structure of the existing ceramic packaging shell on the basis of the existing microwave device ceramic packaging shell structure technology, and the main body adopts ceramic material to achieve lightweight packaging shell, enhance the packaging stability of the microwave device, and improve the heat dissipation efficiency.

Claims

1. A ceramic package shell structure for a microwave device, comprising: A ceramic shell (1), characterized in that: a connection hole (15) and a mounting hole (11) are provided inside the ceramic shell (1), and the mounting holes (11) are symmetrically arranged on both sides of the connection hole (15), and a packaging sheet (14) is connected to the connection hole (15); a welding seat (16) is provided on the lower side of the ceramic shell (1), and a lower notch (112) is provided on the outer side of the welding seat (16); an inner groove cavity (113) is provided inside the welding seat (16), a welding ring (17) is connected to the lower end of the welding seat (16), and a sealing metal sheet (18) is connected to the lower side of the welding ring (17); a pin electrode (12) is provided inside the inner groove cavity (113) and passes through the inner groove cavity (113); the upper end of the pin electrode (12) is connected to the packaging sheet (14) through a wire (121), and the outer end of the pin electrode (12) is connected to the inner cavity wall of the inner groove cavity (113) through a metal rod (122).

2. The ceramic package shell structure of a microwave device according to claim 1, characterized in that: The ceramic housing (1) is configured as a rectangular plate structure, and a packaging area (13) of a rectangular structure is provided in the middle of the rectangular plate, while the connection hole (15) is opened inside the packaging area (13).

3. The ceramic package shell structure of a microwave device according to claim 1, characterized in that: The packaging sheet (14) is provided as a T-shaped structure made of metal material, and the packaging sheet (14) is fixed in the connection hole (15) through a metallization layer (131) provided inside the connection hole (15), and the upper end surface of the packaging sheet (14) is flush with the ceramic housing (1).

4. The ceramic package shell structure of a microwave device according to claim 1, characterized in that: A metal sleeve (111) is provided on the inner wall of the mounting hole (11), and an inner thread is provided on the inner wall of the metal sleeve (111).

5. The ceramic package shell structure of a microwave device according to claim 1, characterized in that: The pin electrode (12) is suspended and fixed in the inner groove cavity (113), and the front and rear ends of the pin electrode (12) both exceed the edge of the ceramic shell (1).

6. The ceramic package shell structure of a microwave device according to claim 1, characterized in that: The ceramic housing (1) is configured as a T-shaped structure as a whole, and the lower notch (112) is located at a vertical angle of the outer edge of the upper end of the welding seat (16).

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