Surface-mounted power type thermistor element

Abstract

The utility model belongs to the technical field of thermistors, and particularly discloses a surface-mounted power type thermistor element which comprises a substrate, internal electrodes are arranged on two opposite sides of the substrate, transverse sections at the upper ends of the internal electrodes protrude and extend, resistor bodies are arranged on the extending sections on the two sides and a middle gap, and the resistor bodies are arranged on the substrate. L-shaped bends are symmetrically arranged on the two sides of the resistor body, an inner plating layer is arranged on the outer side of the inner electrode in a half-surrounding mode, an outer plating layer is arranged on the outer side of the inner plating layer in a half-surrounding mode, a protective layer is arranged at the upper end of the substrate, a special-shaped containing groove is formed in the lower end of the protective layer, and an inner electrode is arranged in the special-shaped containing groove. The accommodating groove is attached to the resistor body and the upper ends of the internal electrode, the internal plating layer and the external plating layer at the two ends; heat dissipation assemblies are arranged on the remaining two opposite sides of the substrate, each heat dissipation assembly comprises a heat dissipation plate and heat dissipation fins, the heat dissipation plates are fixedly connected with the end face of the substrate, and a plurality of heat dissipation fins are arranged on the outer side end face of each heat dissipation plate at intervals.

Description

Technical Field

[0001] The utility model relates to the technical field of thermistors, in particular to a chip-type power thermistor element. Background Art

[0002] Direct-insert power thermistor is a common power thermistor, which is inserted into the PCB board. It has a high height and occupies a large space. With the miniaturization and flattening of various electrical appliances, direct-insert power thermistor can no longer meet the market demand. In addition, during the installation process of direct-insert power thermistor, two pins need to be inserted into the PCB board first. After soldering, the excess pins need to be trimmed manually, which is time-consuming and has high labor costs. Utility Model Content

[0003] The utility model aims to provide a chip-type power thermistor element to solve the problems raised in the above-mentioned background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip-type power thermistor element, comprising a substrate, internal electrodes are arranged on opposite sides of the substrate, the upper end lateral section of the internal electrode protrudes and extends, and resistors are arranged on the extension sections on both sides and the middle gap, "L"-shaped bends are symmetrically arranged on both sides of the resistor, and the bends are fitted and covered on the protrusions formed by the extension sections of the internal electrodes, the outer half of the internal electrode is surrounded by an internal plating layer, and the outer half of the internal plating is surrounded by an external plating layer, a protective layer is arranged on the upper end of the substrate, and a special-shaped accommodating groove is arranged on the lower end of the protective layer, and the accommodating groove is fitted with the upper ends of the resistor and the internal electrodes, the internal plating layer and the external plating layer at both ends; heat dissipation components are arranged on the remaining opposite sides of the substrate, and the heat dissipation components include a heat dissipation plate and heat dissipation fins, the heat dissipation plate is connected to the end surface of the substrate and fixed, and a plurality of heat dissipation fins are arranged at intervals on the outer end surface of the heat dissipation plate.

[0005] Preferably, the substrate is high-purity alumina.

[0006] Preferably, the protective layer is insulating glass.

[0007] Preferably, the internal electrode is a copper alloy electrode.

[0008] Preferably, the inner plating layer is a nickel plating layer, and the outer plating layer is a zinc plating layer.

[0009] Preferably, the heat sink and heat sink fins of the heat sink assembly are metal copper sheets.

[0010] Compared with the prior art, the beneficial effects of the utility model are as follows: the utility model provides an insulating glass protective layer to cover the resistor body, so that the resistor has good mechanical strength and enhanced reliability. The utility model provides an internal plating layer and an external plating layer on the outer layer of the internal electrode. The three-layer structure electrode ensures that the resistor has good welding ability and heat resistance. The chip power thermistor element of the design occupies a small space and can be fixed by simple soldering during installation, which is convenient and quick, and effectively reduces labor costs. The utility model provides a heat dissipation component to effectively improve the heat dissipation of the resistor. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0012] Figure 2 It is a schematic diagram of the structure of some parts of the utility model;

[0013] Figure 3 This is a schematic diagram of the cross-sectional structure of the utility model;

[0014] Figure 4 This is an exploded view of the utility model.

[0015] In the figure: 1. substrate; 2. internal electrode; 3. internal coating; 4. external coating; 5. protective layer; 501. receiving groove; 6. resistor; 601. bend; 7. heat dissipation component; 701. heat dissipation plate; 702. heat dissipation fins. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0018] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0019] See also Figure 1-4 The utility model provides a technical solution: a chip-type power thermistor element, comprising a substrate 1, internal electrodes 2 are arranged on opposite sides of the substrate 1, the upper end lateral section of the internal electrode 2 is protruding and extended, and a resistor 6 is arranged at the extension sections on both sides and the middle gap, and "L"-shaped bends 601 are symmetrically arranged on both sides of the resistor 6, and the bends 601 are fitted and covered on the protrusions formed by the extension sections of the internal electrode 2, and the outer side of the internal electrode 2 is semi-enclosed by an internal plating layer 3, and the outer side of the internal plating layer 3 An external coating 4 is semi-enclosed, a protective layer 5 is provided on the upper end of the substrate 1, and a special-shaped receiving groove 501 is provided on the lower end of the protective layer 5, and the receiving groove 501 fits the resistor 6 and the upper ends of the internal electrodes 2, the internal coating 3, and the external coating 4 at both ends; the remaining two opposite sides of the substrate 1 are provided with a heat dissipation component 7, and the heat dissipation component 7 includes a heat dissipation plate 701 and heat dissipation fins 702, the heat dissipation plate 701 is connected to the end face of the substrate 1 and fixed, and a plurality of heat dissipation fins 702 are arranged at intervals on the outer end face of the heat dissipation plate 701.

[0020] Furthermore, the substrate 1 is made of high-purity aluminum oxide.

[0021] Furthermore, the protective layer 5 is insulating glass.

[0022] Furthermore, the internal electrode 2 is a copper alloy electrode.

[0023] Furthermore, the inner plating layer 3 is a nickel plating layer, and the outer plating layer 4 is a zinc plating layer.

[0024] Furthermore, the heat sink 701 and the heat sink fins 702 of the heat sink assembly 7 are metal copper sheets.

[0025] Working principle: The utility model provides a chip-type power thermistor element, including a substrate 1, internal electrodes 2 are arranged on opposite sides of the substrate 1, the upper end lateral section of the internal electrode 2 protrudes and extends, and a resistor 6 is arranged at the extension sections on both sides and the middle gap, and "L"-shaped bends 601 are symmetrically arranged on both sides of the resistor 6, and the bends 601 are fitted and covered on the protrusions formed by the extension sections of the internal electrode 2, and the outer half of the internal electrode 2 is provided with an internal plating layer 3, and the outer half of the internal plating layer 3 is provided with an external plating layer 4, a protective layer 5 is arranged on the upper end of the substrate 1, and a special-shaped receiving groove 501 is arranged at the lower end of the protective layer 5, and the receiving groove 501 fits the resistor 6 and the upper ends of the internal electrodes 2, the internal plating layer 3, and the external plating layer 4 at both ends; the remaining opposite sides of the substrate 1 are provided with a heat dissipation component 7 The heat dissipation component 7 includes a heat dissipation plate 701 and heat dissipation fins 702. The heat dissipation plate 701 is connected to the end face of the substrate 1 and fixed. A plurality of heat dissipation fins 702 are arranged at intervals on the outer end face of the heat dissipation plate 701. Copper has good heat dissipation performance. The heat dissipation plate 701 absorbs the heat generated by the substrate 1 during operation, and the heat dissipation plate 701 then transfers the heat through the heat dissipation fins 702 to improve the heat dissipation performance of the resistor. The utility model provides an insulating glass protective layer 5 to cover the resistor body 6, so that the resistor has good mechanical strength and enhances reliability. The utility model provides an internal plating layer 3 and an external plating layer 4 on the outer layer of the internal electrode 2. The three-layer structure electrode ensures that the resistor has good welding ability and heat resistance. The surface-mount power thermistor element of the design occupies a small space and can be fixed by simple soldering during installation. It is convenient and quick, and effectively reduces labor costs.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip power thermistor element, characterized in that: The invention comprises a substrate (1), wherein internal electrodes (2) are arranged on opposite sides of the substrate (1), the upper lateral section of the internal electrode (2) protrudes and extends, and resistors (6) are arranged on the extended sections on both sides and in the middle gap, and "L"-shaped bends (601) are symmetrically arranged on both sides of the resistor (6), and the bends (601) are fitted and covered on the protrusions formed by the extended sections of the internal electrode (2), the outer half of the internal electrode (2) is surrounded by an internal plating layer (3), and the outer half of the internal plating layer (3) is surrounded by an external plating layer (4), and the substrate (1) is provided with a plurality of A protective layer (5) is provided at the end, and a special-shaped receiving groove (501) is provided at the lower end of the protective layer (5), and the receiving groove (501) is fitted to the resistor (6) and the upper ends of the internal electrodes (2), the internal plating layer (3), and the external plating layer (4) at the two ends; a heat dissipation component (7) is provided on the remaining two opposite sides of the substrate (1), and the heat dissipation component (7) includes a heat dissipation plate (701) and heat dissipation fins (702), the heat dissipation plate (701) is connected to the end face of the substrate (1) and fixed, and a plurality of heat dissipation fins (702) are arranged at intervals on the outer end face of the heat dissipation plate (701).

2. A chip power thermistor element according to claim 1, characterized in that: The substrate (1) is high-purity aluminum oxide.

3. A chip power thermistor element according to claim 1, characterized in that: The protective layer (5) is insulating glass.

4. A chip power thermistor element according to claim 1, characterized in that: The internal electrode (2) is a copper alloy electrode.

5. A chip power thermistor element according to claim 1, characterized in that: The inner plating layer (3) is a nickel plating layer, and the outer plating layer (4) is a zinc plating layer.

6. A chip power thermistor element according to claim 1, characterized in that: The heat dissipation plate (701) and the heat dissipation fins (702) of the heat dissipation assembly (7) are metal copper sheets.

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