A memory device adjusts verify voltage intervals to optimize program operations and reduce distribution degradation.
Applying only the pre-programming phase of the erase process destroys data in NAND cells, eliminating multi-phase wait times and garbage collection overhead.
Enhanced erase verify level prevents deep erasure in 3D NAND flash, reducing wear and programming time.
A semiconductor memory device detects unstable CAM cells by measuring threshold voltage differences against read voltages.
A flash memory programming method applies a seeding voltage between incrementing pulse steps to adjust subsequent voltage magnitudes.
A DDR test controller generates internal signals from existing pads to enable testing without dedicated strobe hardware.
A voltage generation circuit uses a code determination module to select valid trimming codes for operation voltage output.
A Content Addressable Memory cell uses parallel-coupled flash memory cells to store data based on combined threshold voltages.
An oxide semiconductor channel reduces leakage current to retain data without power, eliminating write cycle limits and high voltage requirements.
Decoding operations on individual word lines identify damaged areas in rewritable non-volatile memory modules.
Dividing SRAM arrays into subarrays with local IO blocks eliminates global bit lines, reducing access time and CPU area.
A fuse voltage generator produces setting data voltage only when an enable signal activates, controlled by a logic circuit.
A read amplifier uses a substrate effect to increase potential barriers and reduce leakage currents in EEPROM memory cells.
A circuit applies variable supply voltages to SRAM pullup transistors during write operations.
A semiconductor memory device uses separate temperature estimation units to control refresh periods for individual memory sub-regions.
Connecting unselected plane bit lines to a reference voltage prevents capacitive coupling and maintains threshold stability.
A voltage clamping circuit limits global bit line levels to enable selective drift recovery operations.
A semiconductor memory device uses a bouncing detection circuit to compare common source line voltage against a reference signal.
A semiconductor memory device executes arithmetic operations during data read to generate write data.
A non-volatile memory controller uses complementary cell pairs to determine erased or programmed states for accurate data output.
A NAND flash memory method biases unselected word lines with reduced pass voltage to prevent program disturb during programming operations.
Segmenting PCRAM write operations into independent set and reset pulses reduces current consumption and prevents data state deterioration during programming.
A non-volatile memory device generates a low read pass voltage by dividing the source voltage for unselected word lines during initialization.
Adaptive keeper circuit compensates read voltage in sense amplifiers for Via-ROM memory cells.
Single-plane tests identify specific failing blocks within multi-plane storage operations, preventing blanket retirement of functional memory cells.
Calibration uses a single page to adjust thresholds, reducing latency while maintaining accuracy across the group.
A capacitive sense NAND memory apparatus uses series-connected field-effect transistors to store user data while coupling channels for signal detection.
A scalable gate logic non-volatile memory array configures interconnection matrices through threshold voltage programming.
Adaptive wordline start voltage reduces over-programming risks and improves data retention in multi-level cell NAND flash memory devices.
A memory system overwrites data using distinct demarcation configurations to bypass erase cycles.
A monolithic serial NOR flash memory device uses a wide input-output bus to transfer data across multiple pins simultaneously.
A segmented e-fuse test device measures programming current through a dedicated transistor and fuse array structure.
Integrated fault detecting logic monitors decoding stages to identify compromised levels without external ROM or timing signals.
A wordline-to-wordline stress routine reduces state widening in multi-level flash memory cells.
Adaptive erase control reduces column leakage from over-erased cells by dynamically switching between parallel and serial Fowler-Nordheim procedures.
A semiconductor memory device merges NOR and NAND arrays under a single controller to access data via cell or page units.
A fuse circuit uses a shared current blocking module to prevent dc current flow during initial setting.
A semiconductor memory device uses peripheral circuitry to program and reprogram second source select transistors for precise threshold voltage adjustment.
Segmenting blocks into strings with local quality markers improves utilization efficiency while maintaining data integrity.
A memory component refresh mechanism adjusts thresholds based on write operations to identify and refresh proximate cells.
Index programming maintains per-cell voltage records to skip intermediate verify steps, resolving the trade-off between programming precision and speed.
Internal logic gates verify anti-fuse programming states without external readout, eliminating test machine delays and improving accuracy.
Pre-charging the word line to a higher voltage level reduces start-up time and improves reading accuracy without increasing layout area.
A nonvolatile memory controller performs common write operations on multiple pages to accelerate data throughput.
A nonvolatile memory device uses a control logic circuit to read fast pages with one voltage and normal pages with multiple voltages.
Gate control circuit manages pipe transistor gates in unselected memory blocks to block leakage current paths.
ISPP voltage adjustment stabilizes program states in ferroelectric 3D flash memory, resolving interference with selected word lines.
Staggered erase voltage application detects word line bridge defects, preventing operational degradation from reduced wiring distances.