3results about How to "Heat conduction" patented technology

The utility model relates to the technical field of alcohol recovery equipment, in particular to an alcohol recovery device which comprises a heating tank and a recovery tank arranged on the left side of the heating tank, a liquid inlet valve port and a controller are fixedly installed on the rear side of the heating tank respectively, a condenser is arranged on the top of the heating tank, a return pipe is arranged on the outer side of the condenser, and a liquid outlet valve port is arranged on the return pipe. A heating mechanism is arranged in the heating tank, a liquid outlet valve port and a nitrogen inlet are fixedly formed in the left end of the recycling tank, a pressure sensor is arranged on the rear side of the recycling tank, a lining layer is arranged in the recycling tank, and a PTFE composite layer, an aluminum foil layer and a polyvinyl alcohol composite layer are arranged in the lining layer. According to the alcohol recovery device, the structural design in the heating mechanism is utilized, and under the combination of the electric heating pipe and the heat conduction layer, generated heat can be uniformly conducted to the inner side of the heating tank, so that the heating time is effectively shortened, and the energy consumption of the device is prevented from being increased.

This utility model discloses a projection device, including a housing, a light source assembly, a display control chip, and a beam splitter assembly. The housing has an inner cavity and a light outlet. The light source assembly is disposed in the housing and located in the inner cavity. The display control chip is disposed in the housing and located in the inner cavity, with the emission end of the display control chip corresponding to the light outlet. The beam splitter assembly is disposed in the housing and located in the inner cavity, and is separated from the display control chip and the light source assembly by a gap. The beam splitter assembly includes a reflective surface and an emission surface. The reflective surface faces the incident ends of the light source assembly and the display control chip, respectively. The light source assembly outputs light towards the reflective surface. Part of the light irradiating the reflective surface is reflected and output to the incident end of the display control chip. Part of the light irradiating the reflective surface passes through the beam splitter assembly and is emitted from the emission surface. This design ensures a compact structure while optimizing heat dissipation and stable and reliable operation.

This application discloses a circuit board heat dissipation device and a laser device, relating to the field of circuit board heat dissipation technology. The disclosed circuit board heat dissipation device, housed within a sealed device, includes: an insulating heat sink plate, which is attached to the component arrangement surface of the circuit board. Components on the circuit board are arranged on the insulating heat sink plate and connected to the circuit board's wiring surface. The component arrangement surface is the plastic surface of the circuit board, and the wiring surface is the copper wire surface. A chip heat dissipation unit is attached to each chip to be cooled on the circuit board. A heat dissipation control unit has a first end connected to the chip to be cooled and the power input of the circuit board, a second end connected to the first end of the insulating heat sink plate and the first end of the chip heat dissipation unit, and a third end connected to a heat dissipation position on the sealed device. This control unit controls the insulating heat sink plate to dissipate heat from the components and the chip heat dissipation unit to dissipate heat from the chips to be cooled. This application achieves circuit board heat dissipation while ensuring the circuit board's sealing.