2results about How to "Improve signal performance" patented technology

This invention provides a method and system for enhancing signal capabilities. The method includes: collecting antenna mutual coupling data of an antenna array according to the current operating frequency band; determining an adjustment mode for adjusting the antenna mutual coupling data based on the collected antenna mutual coupling data and current communication performance characteristic data; and adjusting the antenna array coupling units according to the adjustment mode to adjust the antenna mutual coupling data. This invention solves the problem in related technologies of maintaining excellent transmit and receive communication performance of terminals in various weak signal and extreme scenarios, both indoors and outdoors, thereby improving the transmit and receive communication performance of the terminal.

The utility model provides a conductive through hole structure and a substrate. The conductive through hole structure comprises a first plate provided with a first through hole; the first metal layer is positioned on the side wall of the first through hole; the conductive core is located in the first through hole, the soft soldering metal layer wraps the outer side of the conductive core, and the gap between the first metal layer and the conductive core in the first through hole is filled with the soft soldering metal layer. The substrate comprises a conductive through hole structure. According to the conductive through hole structure, the first metal layer, the soft soldering metal layer and the conductive core are arranged in the first through hole, the hole filling mode and hole filling materials of an existing conductive through hole are optimized, double-face laser copper filling or resin hole filling does not need to be used, and the conductive through hole structure with the large depth can be effectively improved. High heat dissipation performance, conduction performance and signal conduction performance can be kept, and for the first through hole with the large or small depth-to-width ratio, a series of quality problems such as great sinking or unevenness or cavities or bubbles cannot be generated.