3results about How to "Improve signal performance" patented technology

This invention provides a method and system for enhancing signal capabilities. The method includes: collecting antenna mutual coupling data of an antenna array according to the current operating frequency band; determining an adjustment mode for adjusting the antenna mutual coupling data based on the collected antenna mutual coupling data and current communication performance characteristic data; and adjusting the antenna array coupling units according to the adjustment mode to adjust the antenna mutual coupling data. This invention solves the problem in related technologies of maintaining excellent transmit and receive communication performance of terminals in various weak signal and extreme scenarios, both indoors and outdoors, thereby improving the transmit and receive communication performance of the terminal.

The application relates to a port expansion circuit and device, and belongs to the technical field of electronic device connection. The port expansion circuit comprises a main power interface module, a first relay module and a slave power interface module, the main power interface module is connected with the first relay module and an external power device, the slave power interface module is connected with the first relay module and an expansion device, and the first relay module performs filtering, shaping and amplification processing on transmitted data signals. The port expansion circuit further comprises a main data interface module, a second relay module and a slave data interface module, which are used for realizing transmission and processing of data signals. The first relay module comprises a biasing submodule and an operational amplification submodule, and the second relay module comprises an isolation transformer, a common-mode inductor and a protocol conversion chip. Through the separation design of power transmission and data transmission, the application realizes effective expansion of the port, improves signal transmission quality and stability, supports multiple interface types, and meets the connection requirements of different devices.

The utility model provides a conductive through hole structure and a substrate. The conductive through hole structure comprises a first plate provided with a first through hole; the first metal layer is positioned on the side wall of the first through hole; the conductive core is located in the first through hole, the soft soldering metal layer wraps the outer side of the conductive core, and the gap between the first metal layer and the conductive core in the first through hole is filled with the soft soldering metal layer. The substrate comprises a conductive through hole structure. According to the conductive through hole structure, the first metal layer, the soft soldering metal layer and the conductive core are arranged in the first through hole, the hole filling mode and hole filling materials of an existing conductive through hole are optimized, double-face laser copper filling or resin hole filling does not need to be used, and the conductive through hole structure with the large depth can be effectively improved. High heat dissipation performance, conduction performance and signal conduction performance can be kept, and for the first through hole with the large or small depth-to-width ratio, a series of quality problems such as great sinking or unevenness or cavities or bubbles cannot be generated.