6results about How to "Improve signal performance" patented technology

The invention discloses an ODT parameter optimization method and device, electronic equipment and a storage medium, and relates to the field of circuit simulation, and the method comprises the steps: determining target memory particles from a target memory link, and building an active link simulation model for the target memory link; based on the active link simulation model, respectively performing weight simulation on each memory particle on the target memory link, and determining an influence proportion of each memory particle on the target memory particle eye diagram; and according to the influence ratio, performing optimization simulation on each memory particle in sequence under the ODT parameters with different resistance values, and determining the optimal ODT parameter of each memory particle. According to the systematic optimization process, the ODT setting precision of each particle can be improved, the performance of the whole memory link can be optimized, the problem of determining the optimal parameter combination is solved, and the signal integrity and the system stability of the DDR5 memory are effectively improved.

This invention provides a method and system for enhancing signal capabilities. The method includes: collecting antenna mutual coupling data of an antenna array according to the current operating frequency band; determining an adjustment mode for adjusting the antenna mutual coupling data based on the collected antenna mutual coupling data and current communication performance characteristic data; and adjusting the antenna array coupling units according to the adjustment mode to adjust the antenna mutual coupling data. This invention solves the problem in related technologies of maintaining excellent transmit and receive communication performance of terminals in various weak signal and extreme scenarios, both indoors and outdoors, thereby improving the transmit and receive communication performance of the terminal.

The present invention relates to the field of antenna technology, and specifically to a satellite navigation signal enhancement antenna, comprising an antenna body and an adjustment component, wherein two supports are respectively fixedly connected to a support seat, a rotating shaft is respectively rotatably connected to the two supports, a connecting seat is fixedly connected to the rotating shaft, and a gear is fixedly connected to the rotating shaft; a translation member is arranged on the support seat, a rack is arranged on the translation member, and the rack and the gear are meshed; the adjustment component comprises a support seat, two supports, a rotating shaft, a connecting seat, a gear, a translation member and a rack; a satellite navigation signal is received through the antenna body, and when the position of the satellite navigation signal changes, the rack is driven to translate through the translation member, the rack drives the gear to rotate, and the gear drives the rotating shaft and the connecting seat to rotate, so that the antenna body rotates, thereby being able to adjust the angle of the antenna body, so that the antenna body is in the best position for receiving the satellite navigation signal, thereby enhancing the effect of signal transmission.

The utility model discloses a large span tunnel blasting construction seismometry device, including tunnel support structure main part, seismometry platform, vibration sensor and background host, tunnel support structure main part internal bottom end is uniformly provided with seismometry platform, and the top of seismometry platform is equipped with mounting piece, and the seismometry platform is equipped with mounting block, and the backstage host is equipped with the vibration sensor. Vibration sensors are mounted on the mounting blocks correspondingly, a main antenna is arranged on one side of each vibration sensor through a support, and a background host is arranged on one side of the tunnel supporting structure body. According to the tunnel supporting structure, the tunnel supporting structure main body, the mounting pieces, the vibration measuring platforms, the mounting blocks, the clamping blocks, the threaded grooves, the external threads and the vibration sensors are installed, the positions of the vibration measuring platforms on the tunnel supporting structure main body and settlement and convergence points of a tunnel are located at the same normal position, and the three vibration measuring points can be monitored at the same time; therefore, the three groups of monitoring data have relevance, and the vibration measurement accuracy is improved.

The application relates to a port expansion circuit and device, and belongs to the technical field of electronic device connection. The port expansion circuit comprises a main power interface module, a first relay module and a slave power interface module, the main power interface module is connected with the first relay module and an external power device, the slave power interface module is connected with the first relay module and an expansion device, and the first relay module performs filtering, shaping and amplification processing on transmitted data signals. The port expansion circuit further comprises a main data interface module, a second relay module and a slave data interface module, which are used for realizing transmission and processing of data signals. The first relay module comprises a biasing submodule and an operational amplification submodule, and the second relay module comprises an isolation transformer, a common-mode inductor and a protocol conversion chip. Through the separation design of power transmission and data transmission, the application realizes effective expansion of the port, improves signal transmission quality and stability, supports multiple interface types, and meets the connection requirements of different devices.

The utility model provides a conductive through hole structure and a substrate. The conductive through hole structure comprises a first plate provided with a first through hole; the first metal layer is positioned on the side wall of the first through hole; the conductive core is located in the first through hole, the soft soldering metal layer wraps the outer side of the conductive core, and the gap between the first metal layer and the conductive core in the first through hole is filled with the soft soldering metal layer. The substrate comprises a conductive through hole structure. According to the conductive through hole structure, the first metal layer, the soft soldering metal layer and the conductive core are arranged in the first through hole, the hole filling mode and hole filling materials of an existing conductive through hole are optimized, double-face laser copper filling or resin hole filling does not need to be used, and the conductive through hole structure with the large depth can be effectively improved. High heat dissipation performance, conduction performance and signal conduction performance can be kept, and for the first through hole with the large or small depth-to-width ratio, a series of quality problems such as great sinking or unevenness or cavities or bubbles cannot be generated.