2results about How to "Not damaged by high temperature" patented technology

This invention relates to the field of cable protection conduit technology, specifically a flame-retardant and impact-resistant protective conduit for communication and power cables. The conduit includes a flame-retardant structure comprising an outer tube layer, the inner wall of which is fitted with a heat-resistant outer tube. An impact-resistant protective structure is provided on the inner wall of the inner mounting layer, including a cable mounting bracket outer tube located on the inner wall of the inner mounting layer. One end of the outer tube layer has a conduit interface structure. This flame-retardant and impact-resistant protective conduit for communication and power cables exhibits significant flame-retardant effects, effectively preventing flame spread, avoiding pipe combustion and dripping, and effectively absorbing impacts from external collisions and compression. It can withstand various external impacts such as outdoor construction, vehicle collisions, and heavy object compression. Furthermore, it improves splicing and connection efficiency, is suitable for large-scale cable laying projects, and can significantly shorten the construction cycle.

The invention discloses a carrier wafer system with a high-temperature heat insulation structure, which is characterized by comprising a wafer main body, a temperature measuring device, a battery, a main control circuit, a box and a supporting structure, a customized high-temperature heat insulation structure is arranged in the box, the interior of the high-temperature heat insulation structure is divided into a battery independent cavity and a main control circuit cavity which are mutually independent, the battery is loaded in the battery independent cavity in a sealed mode, and the main control circuit is loaded in the main control circuit cavity in a sealed mode; the box is fixedly connected to the surface of the wafer main body through the supporting structure, and the temperature measuring device is arranged on the surface of the wafer main body and is electrically connected with the main control circuit. The device is good in stability, successfully solves the problems of inconvenience in temperature measurement, influence on a gas flow field, long cooling time and the like in the prior art, and provides a more efficient and accurate temperature measurement solution for the field of semiconductor processing.