1results about How to "Reduce ash" patented technology

This utility model relates to the field of circuit board technology and discloses a circuit board with a built-in heat dissipation and airflow guiding structure. The circuit board includes a circuit board body with a copper heat-conducting strip embedded inside. A heat dissipation base is connected to the front end of the circuit board body, and a guide pipe is connected to the outside of the heat dissipation base. A heat dissipation fin holder is connected to the front end of the guide pipe, and a cooling fan is mounted on the top of the heat dissipation fin holder. A connector is mounted on the left side of the circuit board body, and a CPU module is mounted on the front end of the circuit board body. This utility model, by setting up a heat dissipation and airflow guiding structure, allows heat to be transferred through the heat dissipation base to the guide pipe and heat dissipation fin holder during use. Then, by activating the cooling fan, the heat on the heat dissipation fin holder is dissipated, thus achieving the heat dissipation and airflow guiding function.