Flat-panel display apparatus

Abstract

The present invention reduces the amount of thermally conductive members used to fix the display panel on the metal chassis member arranged on the back side of the self-luminous flat display panel not only in the surface direction but also in the thickness direction. Furthermore, the present invention provides a technology for dissipating heat from a display panel while maintaining high efficiency and suppressing cost increases. For this reason, the present invention uses a hot-melt adhesive filled with a thermally conductive imparting agent having adhesiveness at room temperature as a thermally conductive member, and uses a plurality of discretely formed thermally conductive members having a thickness of 0.3 to 0.8 mm. The heat conduction unit fixes the display panel and the chassis part.

Description

technical field The present invention relates to a flat display device using a flat display panel in which self-luminous pixels are arranged between opposing substrates, and more particularly, to a display device in which efforts are made to efficiently dissipate heat from the display panel. Background technique Examples of self-luminous flat display panels include plasma panels (hereinafter abbreviated as "PDP"), electron emission element display panels, organic EL panels, and the like. In addition, there are also LED display panels in which LED elements are arranged two-dimensionally, for example. In a display device using a self-luminous panel such as a flat display panel, efforts are made to efficiently dissipate heat generated by the panel. Especially because the heat generation of PDP is large, so in the display device that uses PDP, generally, on the back side of PDP, metallic chassis member (usually as metal is aluminum) is arranged, and has adhesive force (adhesiv...

AI Technical Summary

Problems solved by technology

At this time, air bubbles exist between the thermally conductive member and the PDP, or between the thermally conductive member and the chassis member, which reduces the adhesion between the thermally conductive member and the PDP or the thermally conductive member and the chassis member, and reduces the thermal conductivity.

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