Vapor chamber having support posts with inner-sintering structure

Abstract

The invention discloses a vapor chamber having support posts with an inner-sintering structure. The vapor chamber is characterized in that: upper cover plate sintering capillary wicks and lower cover plate sintering capillary wicks are arranged in a cavity between an upper cover plate and a lower cover plate, a plurality of support posts and a plurality of stress absorption rings having a sinking structure are distributed at the inner bottom of the lower cover plate, the upper cover plate sintering capillary wicks and the lower cover plate sintering capillary wicks are provided with a plurality of mounting holes through which the support posts penetrate; and a plurality of bosses which are naturally formed during sintering, and correspondingly matched with sinking positions of the stress absorption rings are distributed on the lower surface of the lower cover plate sintering capillary wicks. The vapor chamber has the advantages that: the stress absorption rings of the vapor chamber can effectively absorb deformation; the regional support post distribution eliminates the influence of the support posts on the enhanced boiling structure of the lower cover plate; capillary porosity wicks in the support posts shorten the refluxing path of liquid working medium in condensing section, separate raising vapor generated by enhanced boiling and reflux falling liquid working medium in the vapor chamber, avoid a shearing effect generated by the contact between a vapor interface and a liquid working medium interface and improve heat-transfer capability.

Description

technical field

[0001] The invention relates to a soaking plate for heat dissipation of electronic components, in particular to a soaking plate with an inner sintered structure support column. Background technique

[0002] As the degree of circuit integration becomes higher and higher, the packaging density and operating frequency continue to increase, which increases the heat generated by electronic components per unit volume and the energy consumption of a single chip, and the design of the compact structure of the equipment makes heat dissipation more difficult. There is an urgent need to solve the technical problem of high-efficiency heat dissipation. Traditional cooling methods such as natural air convection, air forced convection, and liquid natural convection have been difficult to meet the needs of further development in the electronics field; special cooling methods such as liquid forced convection and gas / liquid phase change have become the current and future trend...

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