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Die with heating device

A heating device and mold technology, which is applied in the field of molds for thermoplastic or thermosetting processes, can solve the problems of high equipment cost, uneven heating, high power consumption, etc., and achieve the effects of cost reduction, uniform temperature distribution, and simplified mold structure

Inactive Publication Date: 2015-06-24
KUNSHAN YURONG ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the high-frequency furnace itself is an electric energy source. Although there are no safety concerns, the equipment cost is high, and the high-frequency wave is only effective for shallow and flat mold cavities. It is difficult to apply to the surface of the mold core with complex shapes, and there are The problem of uneven heating, that is, uneven temperature distribution on the surface of the mold, and problems such as unstable induction current, long heating time, and high power consumption

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Embodiment Construction

[0058] In order to have a more specific understanding of the technical content, characteristics and effects of the present invention, now in conjunction with the illustrated embodiment, the details are as follows:

[0059] refer to figure 1 , a mold with a heating device provided by the first embodiment of the present invention is mainly composed of an upper mold 10, a lower mold 20, two conductive plates 30 and two conductive wires 40, wherein:

[0060] The upper mold 10 has an upper bonding surface 11 .

[0061] The lower mold 20 has a conductive layer 21 that is conductive and is steel (or aluminum), a lower bonding surface 211 that is arranged on the surface of the conductive layer 21 and faces the upper bonding surface 11, and a lower bonding surface 211 that is positioned on the surface of the conductive layer 21. And opposite to the insulating surface 212 of the lower bonding surface 211, an insulating layer 22 electrically insulatingly bonded to the insulating surface...

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PUM

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Abstract

The invention discloses a die with a heating device. Main points of the invention are as follows: an insulating layer and a conducting layer which are electrically isolated are arranged on an upper die or a lower die or simultaneously arranged on the upper die and the lower die, the surface of the conducting layer is an interface between the die and a material, current is directly switched on the conducting layer so as to allow the current to crowd on the surface of the conducting layer of the upper die, or the lower die, or the upper die, the lower die and the like, and the surface of the conducting layer is preheated to an operating temperature from room temperature. Thus, the die provided by the invention may be only composed of the upper die, the lower die, a current conducting plate and a conductor wire and electrical insulation is carried out on the conducting layer and the insulating layer of the upper die, or the lower die, or the upper die and the lower die so as to achieve effects of the prior art, thereby realizing the purpose of cost reduction; moreover, since current only crowds on the surface of the conducting layer of the upper die, or the lower die, or the upper die and the lower die, uniform distribution of surface temperature of the die can be realized regardless of changing of the shape of the surface of the conducting layer.

Description

technical field [0001] The invention relates to a mold for thermoplastic or thermosetting process, in particular to a mold with a heating device. Background technique [0002] According to Chinese Patent Application No. 200680031567.9 "Equipment for Processing Materials Using Induction Heating", Taiwan Announcement No. I224548 "Mold Instant Preheating Method and Device", and Taiwan Announcement No. I279304 "High Frequency Heating Mold Method and Device" and other patents As shown, heat conduction coils with high-frequency induction magnetic waves are installed inside the mold or on the parting surface of the mold, and the heat conduction coils are connected to the high-frequency power supply system to load high-frequency currents on the heat conduction coils. Heat up to working temperature while confining the heating to the interface between the mold and the material. [0003] However, the high-frequency furnace itself is an electric energy source. Although there are no saf...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C33/02
Inventor 刘忠男张佑严
Owner KUNSHAN YURONG ELECTRONICS
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