Method for fabricating and orienting semiconductor wafers

A semiconductor and wafer technology, applied in the field of manufacturing semiconductor wafers, can solve problems such as the influence of plasma density and chemical substance distribution

Active Publication Date: 2016-08-03
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Plasma density and chemical species distribution for etch processes can also be negatively affected by notches
Additional costs are associated with compensating for these degradations in process performance

Method used

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  • Method for fabricating and orienting semiconductor wafers
  • Method for fabricating and orienting semiconductor wafers
  • Method for fabricating and orienting semiconductor wafers

Examples

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Embodiment Construction

[0033] With reference to the drawings, in which, in order to facilitate the understanding of the drawings, similar reference numerals designate similar elements, and various embodiments of a multi-gate semiconductor device and a method of forming the same are described. The drawings are not drawn to scale.

[0034] The following description is provided as an open teaching of a representative set of examples. Many changes can be made to the embodiments described herein and still obtain beneficial results. Some of the desired benefits discussed below can be obtained by selecting some of the features or steps discussed herein without using other features or steps. Thus, a variety of modifications and changes, as well as a subset of the features and steps described herein, are possible, and even satisfactory under certain circumstances. Therefore, the following description is provided as illustrative and not restrictive.

[0035] It is intended to read the description of the exempla...

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Abstract

A method of orienting a semiconductor wafer. The method includes: rotating the wafer about a central axis; exposing a plurality of edge portions of the rotating wafer to light having a predetermined wavelength from one or more light sources; detecting subsurface marks; and orienting the wafer using the detected subsurface marks as a reference. The present invention also provides methods for manufacturing semiconductor wafers.

Description

Technical field [0001] The present invention relates generally to semiconductor manufacturing, and more specifically, to methods for manufacturing semiconductor wafers. Background technique [0002] Semiconductor wafers are traditionally formed with notches to orient the wafers and provide a reference for wafer processing machines. The process used to form the notches usually involves grinding the surface of the wafer or ingot. These processes have a negative impact on semiconductor process performance. For example, the uniformity of the thickness of the photoresist coating on the wafer surface or the thickness of the chemical mechanical polishing (CMP) film may be deteriorated due to the presence of notches. The plasma density and chemical species distribution used in the etching process may also be negatively affected by the notch. Additional costs are associated with compensating for these degradations in process performance. Notches are also a source of particles that cau...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01L21/268H01L23/544H01L21/68
CPCH01L21/268H01L21/67282H01L21/681H01L23/544H01L2223/54426H01L2223/54493H01L2924/0002H01L2924/00H01L21/02H01L21/683
Inventor林金明陈万来黄嘉宏杨棋铭林进祥
OwnerTAIWAN SEMICON MFG CO LTD