Photosensitive compositions and compounds used therein

A technology of photosensitive composition and photosensitive material, which is applied in the field of photosensitive composition and the compounds used in it, can solve the problems of poor adhesion strength and increased defects, and achieve the effect of small possibility and improvement of pattern adhesion strength

Active Publication Date: 2017-05-31
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the adhesion strength between the film of photosensitive material and the underlying substrate becomes poor during processing, thus increasing the possibility of defects due to the loss of part of the image

Method used

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  • Photosensitive compositions and compounds used therein
  • Photosensitive compositions and compounds used therein
  • Photosensitive compositions and compounds used therein

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0105] 10 mol of 3-glycidyloxypropyltrimethoxysilane (KBM-403 produced by Shinetsu, Co., Ltd.) was diluted in propylene glycol monomethyl ether acetate. The solution was kept at 50°C, and 10 mol of N-methallylamine (Aldrich) was added slowly to allow the reaction to proceed. After the obtained solution was subjected to column separation, the solvent was removed by using vacuum distillation to obtain a compound represented by the following formula 5:

[0106] [Formula 5]

[0107]

[0108] pass 1 H-NMR confirmed structure: 5.17, 5.15, 5.83 (-CH=CH 2 ),2.27(CH 3 ), 2.0(-OH), 3.55(-OCH 3 )

Embodiment 2

[0110]Except that 3-glycidyloxypropyltriethoxysilane (KBE-403 produced by Shinetsu, Co., Ltd.) was used instead of 3-glycidyloxypropyltrimethoxy in Synthesis Example 1 Synthesis Example 2 was the same as Synthesis Example 1 except for silane (KBM-403 produced by Shinetsu, Co., Ltd.). Thus, a compound represented by the following formula 6 was obtained:

[0111] [Formula 6]

[0112]

[0113] pass 1 H-NMR confirmed structure: 5.17, 5.15, 5.83 (-CH=CH 2 ),2.27(CH 3 ),2.0(-OH),1.22,3.83(-OCH 2 CH 3 )

Embodiment 3

[0115] Synthesis Example 3 was the same as Synthesis Example 1 except that N-ethylallylamine (Aldrich) was used instead of N-methallylamine (Aldrich) in Synthesis Example 1. Thus, a compound represented by the following formula 7 was obtained:

[0116] [Formula 7]

[0117]

[0118] pass 1 H-NMR confirmed structure: 5.17, 5.15, 5.83 (-CH=CH 2 ),2.40,2.62(-CH 2 CH 3 ), 2.0(-OH), 3.55(-OCH 3 )

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Abstract

The present invention relates to a photosensitive composition and a compound used therein. The composition provided by the present invention can form a thin film with improved bonding strength of a pattern.

Description

[0001] Cross-references to related applications [0002] This application claims priority and benefit to Korean Patent Applications No. 10-2011-0070644 and No. 10-2012-0056628 filed in the Korean Intellectual Property Office on July 15, 2011 and May 29, 2012, respectively, which The entire content is hereby incorporated by reference into this specification. technical field [0003] The present application relates to photosensitive compositions and compounds used in the photosensitive compositions. Background technique [0004] A variety of photosensitive materials can be used to make filters for liquid crystal display diodes. For example, pigment-dispersed photosensitive materials can be used to form colored pixels. In addition, a black matrix, which is a black partition that shields light as a light-shielding film, can be prepared by using a solution in which a black pigment, carbon black, perylene black, titanium dioxide, or the like is dispersed in a photosensitive mat...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): G03F7/075G03F7/004G03F7/027
CPCC07D213/643C08F297/00G03F7/0007G03F7/0233G03F7/0295G03F7/031G03F7/033G03F7/0388
Inventor李健雨
OwnerLG CHEM LTD