Stacking mold with ejecting rods

Abstract

The invention discloses a stacking mold with ejecting rods. The stacking mold comprises a body, a cavity and a plurality of ejecting rods, wherein the cavity is positioned at the top part of the body; the plurality of ejecting rods are positioned at the bottom part of the body. The stacking mold is characterized in that the ejecting rods extend out of the bottom part of the body and are arranged at the bottom part of the body by return pins; the cavity is provided with ejecting rod holes corresponding to the positions of the ejecting rods. The stacking mold disclosed by the invention has the advantages that the plurality of ejecting rods are arranged at the bottom part of the body in a manner of axisymmetric arrangement, so that the ejecting force can be uniformly applied to an injection molding product and the action of the ejecting force on the injection molding product is softer; simultaneously arc-shaped end surfaces arranged at the free ends of the ejecting rods are smoother, so that the surface of the injection molding product can not be scratched or the structure of the injection molding product can not be damaged; the other ends of the ejecting rods are connected at the bottom part of the body by the return pins and is rotatably vertical or parallel to the bottom part of the body, so that the use is convenient.

Description

technical field [0001] The invention relates to an injection mold, in particular to a stack mold with ejector pins for a notebook computer. Background technique [0002] The housing of electronic products is usually molded by thermocompression molding. When the housing is injected, the smaller structure and the part with lines have higher requirements for injection molding, and the process of heating, exhaust, cooling and ejection is required during injection molding. , Each process will produce unqualified conditions such as structure, which will affect the positional deviation and misalignment of the mutual ferrules and screw holes of each shell. The cooling process requires fast and low temperature, and the ejection process also requires a suitable angle and tools. During the ejection process, there are often cases where the ejector pin is scratched and the injection molded product will be damaged. Therefore, molds with reasonable and compact structural design, which can...

AI Technical Summary

Problems solved by technology

[0002] The housing of electronic products is usually molded by thermocompression molding. When the housing is injected, the smaller structure and the part with lines have higher requirements for injection molding, and the process of heating, exhaust, cooling and ejection is required during injection molding. , Each process will produce unqualified conditions such as structure, which will affect the position deviation and misalignment of the mutual ferrules and screw holes of each shell

The cooling process requires fast and low temperature, and the ejection process also requires a suitable angle and tools. During the ejection process, the ejector pin is often scratched and the injection molded product will be damaged.

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