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Resin sealing device and resin sealing method

A resin sealing device and resin sealing technology, applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of difficult connector heating and prolonging the warm-up time, so as to suppress the temperature difference and prevent sudden The effect of heating or excessive heating and shortening the time required for preheating

Active Publication Date: 2017-01-18
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in Patent Document 1, heating is performed in a shape from one side, so it is difficult to uniformly heat the cylindrical connector portion over its entire circumference.
Furthermore, if it is necessary to heat the resin-made connector part with a large heat capacity to the required temperature in a short time, there is a possibility that the circuit board and the like are heated rapidly to cause cracks on the circuit board. Therefore, in order to prevent For cracks in the circuit board, it is necessary to extend the preheating time

Method used

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  • Resin sealing device and resin sealing method
  • Resin sealing device and resin sealing method
  • Resin sealing device and resin sealing method

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Embodiment Construction

[0056] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0057] figure 1 It is a schematic plan view of a resin sealing device according to an embodiment of the present invention.

[0058] The resin sealing device of this embodiment includes a carry-in unit 1 , two molding units 2 , and a carry-out unit 3 . The carrying-in unit 1 receives the following object to be sealed (not shown) to be resin-sealed from the previous step. The molding unit 2 forms a resin sealed body by resin-sealing the body to be sealed received from the carry-in unit 1 . The carry-out unit 3 performs specific post-processing on the sealed resin body received from the molding unit 2 to complete individual packages, and sends these packages out.

[0059] The carrying-in unit 1 includes: a receiving unit 4, which receives the body to be sealed; a preheating unit 5, which preheats the body to be sealed; a tray cooling unit 6, which cools the tr...

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Abstract

In the present invention, two heating means are provided, each having a heating surface for heating an object to be sealed, and the object to be sealed is heated from both sides thereof by both heating surfaces, which face each other. Both heating means have a convex-shaped heating part protruding in the direction of approaching the object to be sealed. Both heating means are configured so as to vary, in localized fashion, the degree of heating of the object to be sealed, so as to pre-heat appropriately for each portion of the object to be sealed. Pre-heating to a temperature suited for resin sealing is thereby performed efficiently even when the object to be sealed has a special shape or has portions having different material properties.

Description

technical field [0001] The present invention relates to a resin sealing device and a resin sealing method for sealing a body to be sealed with resin. A resin sealing device and a resin sealing method. Background technique [0002] Conventionally, for example, using a molding die for resin sealing, a process of sealing a lead frame on which a semiconductor chip is mounted, a circuit board, or the like to be sealed with resin is performed. In this case, the molding die is heated to about 180°C. In contrast, the sealed body such as the circuit board is at room temperature. Therefore, in order to reduce the temperature difference between the two, for example, place the sealed body on the mold surface of the molding die In this state, preheating is carried out for a fixed period of time, and thereafter, a fluid resin is filled into a cavity constituted by a molding die and cured, thereby performing resin sealing. [0003] When preheating the object to be sealed such as a circui...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56B29C45/14
CPCB29C45/14655B29C2045/14877H01L21/565H01L2924/0002H01L2924/00
Inventor 浦谷隆文川口恒男白泽贤典竹内慎尾张弘树高田直毅
Owner TOWA
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