Electronic assembly with electrically conductive connection

An electronic component, electrical contact technology, applied in the direction of conductive connection, connection, electrical components, etc., can solve the problems of contact dual corrosion, high space, lack of mechanical stability, etc., to achieve the effect of safe electrical connection

Active Publication Date: 2015-08-12
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These solutions contain drawbacks regarding complexity and construction and thus cost, or temperature sensitivity (e.g. adhesives in EMV seals), corrosion of the contact pair, e.g. lack of mechanical stability under strong mechanical stress, and Partially different disadvantages requiring higher space

Method used

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  • Electronic assembly with electrically conductive connection
  • Electronic assembly with electrically conductive connection
  • Electronic assembly with electrically conductive connection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] according to figure 1 An electronic assembly 1 with a first metal housing part 11 and a second metal housing part 12 is shown. The two metal housing parts 11 , 12 form the housing 10 for the electronics module 1 in the assembled state.

[0017] In order to safely ensure the electrically conductive connection of the housing parts 11, 12 to each other and the subsequent connection to the grounding system / earth system and to meet the legal requirements relating to electromagnetic compatibility, according to figure 2 The first housing part 11 has a first joint surface 21 and a second joint surface 21'. The first joint surface 21 and the second joint surface 21' each have a contact device 2 which is designed to cooperate with the first counter joint surface 22 and the second counter joint plane 22' in the assembled state, so that the contact device 2 The insulating layer surrounding the housing parts 11 , 12 is exposed at a position where an electrical contact exists betw...

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PUM

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Abstract

The invention relates to an electronic assembly comprising at least a first metal housing part and a second metal housing part which are designated to form a housing of the electronic assembly in an assembling state, wherein, the first housing part comprises at least one joint surface, and the second housing part comprises at least one corresponding joint surface, the joint surface and the corresponding joint surface are overlapped one another in the assembling state. At least one joint surface comprises a contact means which is designated to cooperate with the corresponding joint surface so that the position of the contact means exposes an insulating layer around the housing parts, and an electrical contact exists between the two housing parts.

Description

technical field [0001] The invention relates to an electronic assembly comprising at least one first metal housing part and a second metal housing part, which is designed in an assembled state to form a housing for the assembly, wherein the first housing part has At least one joint surface, and the second housing part has at least one corresponding joint surface, the joint surface and the counter joint surface overlap each other in the assembled state. Background technique [0002] In order for electronic components to have the necessary electromagnetic compatibility during installation and subsequent operation, especially in automation technology, certain rules must be observed. The conductive connection of metal housing parts and the connection to the grounding system / earth system must be securely secured in order to comply with the legal requirements regarding electromagnetic compatibility (interference immunity and interference emission). [0003] Solutions known to the...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K9/00H05K5/04H01R4/26
CPCH05K9/0009H05K9/0049
Inventor托比亚斯·格拉莫拉奥利弗·曼库特帕特里克·迈尔乌尔夫·施泰因
OwnerSIEMENS AG