Shield can, electronic device, and manufacturing method thereof

A technology for electronic devices and shielding covers, applied in the field of shielding covers, can solve the problems of no determination and no declaration, etc.

Inactive Publication Date: 2015-09-23
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

No determination has been made, and no representation is made, as to whether any of the foregoing would be applicable as prior art with respect to the present disclosure

Method used

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  • Shield can, electronic device, and manufacturing method thereof
  • Shield can, electronic device, and manufacturing method thereof
  • Shield can, electronic device, and manufacturing method thereof

Examples

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Embodiment Construction

[0026] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. The following description includes numerous specific details to aid in understanding, but these details are considered to be examples only. Accordingly, those of ordinary skill in the art will recognize that changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. Also, descriptions of well-known functions and constructions will be omitted for clarity and conciseness.

[0027] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the present disclosure. Therefore, it will be apparent to those skilled in the art that the ...

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Abstract

A shield can for electromagnetic shielding is provided. The shield can includes a shield cover having a bump protruding laterally therefrom, and a shield frame having a connecting part for selectively fixing the bump at a first height or a second height such that the shield frame is fastened to the shield cover. An electronic device includes a substrate, an internal device mounted on the substrate, and the shield can. The shield cover is located over the internal device, and the shield frame is formed vertically on the substrate to surround the internal device.

Description

technical field [0001] The present disclosure relates to a shield can. More particularly, the present disclosure relates to an electronic device having a shield case and a method of manufacturing the same. Background technique [0002] A recent trend in electronic devices, including mobile devices, is to be made smaller and lighter. To meet this trend, electronic components must support high integration and high performance. [0003] Electromagnetic waves are one of many causes that directly affect the performance of electronic components. Typically, electromagnetic radiation (EMR, electromagnetic radiation) consists of electromagnetic waves, which are synchronous oscillations of electric and magnetic fields propagating at the speed of light. In modern technology, EMR is considered as electromagnetic noise emanating from or affecting electronic components. Accordingly, various materials, structures and methods have been investigated to provide electromagnetic shielding. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00B23K1/00
CPCH05K13/0465H05K9/0032H05K9/0007H05K5/0213H05K7/20454H05K7/20445H01L23/42H01L23/552H01L2224/16225H01L2224/73253H01L2924/12044Y10T29/4913Y10T29/49144H01L2924/00
Inventor 宋京训方正济李光燮李世春张世映池润午
Owner SAMSUNG ELECTRONICS CO LTD
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