[0002] In electronic devices for communication and transmission, the interior is composed of several
active components and passive components. The so-called passive components are such as magnetic components, resistors, etc., and magnetic components (such as transformers, inductors, etc.) , which has the characteristic of generating a
magnetic field immediately after the introduction of current, and the magnetic element is also one of the very important components in today's
electronic equipment. It must be done, and in order to make the magnetic components more easily arranged on the circuit board during the process, the magnetic components are also packaged into a form similar to an
integrated circuit chip; please refer to US Patent No. US6937454B2 Integratedddeviceprovidingovercurrentandovervoltageprotectionandcommon-modefilteringtodatabusinterface, which mainly discloses a A kind of
electronic component, comprises a base board that is used for
surface bonding and is connected to the main
printed circuit board that forms
bus interface circuit, again,
electronic component also comprises a common mode rejection filter and at least one
circuit protection component assembled on the base board, Wherein, the substrate has several connection electrodes, and the several connection electrodes include a filter
electrode connected to the common mode rejection filter and a protection
electrode connected to the
circuit protection element, and the connection electrodes can be used to connect the electronic components mechanically or electrically The connection method is connected to the main
printed circuit board. It can be seen from the previous case that although the existing magnetic components (this is called electronic components) can effectively reduce the overall volume of the magnetic components; however, the existing methods still have shortcomings, please cooperate refer to figure 1 As shown in the figure, the existing electrical component is shown in the figure, such as the magnetic component 10 in the figure, which is mainly composed of a substrate 101 and a magnetic element 102, wherein the magnetic element 102 is electrically assembled on The substrate 101, as can be seen from the figure, after the substrate 101 and the magnetic element 102 are assembled, the unused area of the substrate 101 (block B as shown in the figure) accounts for the whole The area has a certain ratio. Moreover, this block is not used when the magnetic member 10 is implemented. Therefore, if the manufacturing cost is considered, the unused block B of the substrate 101 should be discarded to reduce the number of manufacturing substrates 101. The amount of raw materials required at the time, to avoid the waste of raw materials for manufacturing, please refer to figure 2 As shown in the figure, the
schematic diagram of the
electrical connection of the existing electrical components is shown in the figure. As shown in the figure, the user wants to install the magnetic component 10 on a circuit board 11. Usually, the magnetic component 10 will first perform the board operation (IRReflow , surface adhesion operation), so that the substrate 101 can be accurately connected to an
electrical connection portion 111 of the circuit board 11, however, the
tin liquid used in the upper board operation process often cannot smoothly enter the substrate 101 and the
electrical connection. Between the connecting parts 111, the magnetic member 10 cannot be firmly adhered to the circuit board 11 after being solidified by the liquid
tin. Therefore, the structure of the existing magnetic member 10 still needs to be improved.