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Lighting device

A light source module and optical structure technology, applied in the direction of light source, electric light source, light source combination, etc., can solve the problems of poor heat dissipation, difficulty in manufacturing LED modules, poor waterproof effect, etc., and achieve low manufacturing cost, light weight, and small size Effect

Active Publication Date: 2016-02-24
SUZHOU LEKIN SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a disadvantage that it is difficult to manufacture LED modules in different ways according to different power consumption
[0007] In addition, the existing LED street lamps have poor heat dissipation performance and poor waterproof effect

Method used

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Experimental program
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Embodiment Construction

[0050]The thickness or size of each layer is exaggerated, omitted, or schematically shown for the purpose of convenience and clear description. The size of each component does not necessarily indicate its actual size.

[0051] It will be understood that when an element is referred to as being "on" or "under" another element, it can be directly on / under the element, and one or more intervening elements may also be present. When an element is referred to as being "on" or "under", "under the element" and "on the element" can be included based on the element.

[0052] Hereinafter, detailed technical features to be implemented will be described in detail with reference to the accompanying drawings.

[0053] figure 1 is a perspective view of a lighting device according to an embodiment. figure 2 is an exploded perspective view of the lighting device.

[0054] Such as figure 1 and figure 2 As shown, the lighting device according to this embodiment includes a light source modu...

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Abstract

Disclosed is a light source module. The light source module includes: a board having an electrically-insulated property and a heat-dissipating property; a light emitter including a substrate disposed on the board and multiple light emitting apparatuses disposed on the substrate; an optical structure covering the light emitter and including a lens and an external frame, wherein the lens is disposed on the light emitting apparatuses of the light emitter and the external frame surrounds the external circumferential surface of the substrate; an insulating structure surrounding the external circumferential surface of the external frame of the optical structure; and a housing disposed on the board and covering the external frame of the optical structure and the insulating structure, wherein the housing includes an opening through which light passing the lens of the optical structure may pass. The change in the structure of the module may greatly improve the heat dissipation and watertightness, reduce dimensions, weight, and manufacture cost.

Description

[0001] This application is an application for an invention patent with an application date of February 10, 2012, an application number of 201210030687.4, and an invention title of "LED lighting equipment including modules that can be changed according to power consumption and having improved heat dissipation and water resistance" Divisional application. technical field [0002] Embodiments relate to light emitting diode (LED) lighting. Background technique [0003] In general, a light emitting diode (LED) is a semiconductor light emitting device that emits light when an electric current flows through it. LEDs include PN junction diodes composed of optical semiconductor materials such as GaAs, GaN. The region of light emitted by the LED varies from a red region (630nm to 700nm) to a blue-violet region (400nm), and also includes a blue region, a green region, and a white region. [0004] Compared with conventional lighting devices such as incandescent lamps and fluorescent l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S8/00F21V29/76F21V29/77F21V5/04F21V31/04F21Y115/10F21W131/103
CPCF21S8/00F21V5/04F21V31/04F21S8/08F21V31/00F21W2131/103F21K9/00F21V29/71F21V29/763F21V29/773F21Y2113/00F21K9/64F21S2/005F21V29/503F21V31/005
Inventor 金光洙申瑛镐梁艺瑟朴起满诸扶冠
Owner SUZHOU LEKIN SEMICON CO LTD
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