A kind of halogen-free thermosetting epoxy adhesive and its application
A thermosetting, epoxy adhesive technology, used in epoxy resin adhesives, modified epoxy resin adhesives, adhesives, etc., can solve the problem of shortening the service life of E-PAPER, slow curing speed of epoxy adhesive at low temperature, and inability to UV light. Complete penetration and other problems to achieve the effect of improving storage stability, excellent crack resistance, and preventing glue overflow
Active Publication Date: 2018-09-07
深圳百丽春新材料科技有限公司
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Problems solved by technology
Among them, the adhesion between UV-curable adhesive and PET substrate is average, and its moisture resistance and high temperature resistance are poor.
Chinese patent CN104619804A provides a UV-curable epoxy adhesive, which has good chemical resistance and high-temperature reliability; however, there may be black or other dark inks on the edge of the E-PAPER frame, which makes the UV light unable to penetrate completely. The glue in the shadow part cannot be cured or is not completely cured, thus shortening the service life of E-PAPER
However, the general epoxy adhesive has good adhesion, but it needs medium and high temperature curing, and the shrinkage rate is relatively large; while the low temperature curing speed of thermosetting epoxy adhesive is slow and the viscosity stability is poor
Method used
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Embodiment 1
[0037] A halogen-free thermosetting epoxy adhesive, comprising the following raw materials by weight:
[0038]
[0039]
Embodiment 2
[0041] A halogen-free thermosetting epoxy adhesive, comprising the following raw materials by weight:
[0042]
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Abstract
The invention provides a halogen-free thermosetting epoxy adhesive. The halogen-free thermosetting epoxy adhesive comprises, by weight, 0-60 parts of epoxy resin, 5-15 parts of a filler, 1-5 parts of a latent curing agent, 0.5-3 parts of a thixotropic agent, 15-35 parts of a flexibilizer, 0.01-1 part of an antifoaming agent, 0.01-1 part of a coupling agent and 0.01-1 part of a dispersant. The halogen-free thermosetting epoxy adhesive can be applied in E-Paper edge sealing. The epoxy adhesive provided by the invention has the advantages of no halogen, realization of low-temperature rapid solidification, excellent bonding strength and flexibility, high heat resistance, low heat expansion coefficient and high water resistance.
Description
technical field [0001] The invention relates to the technical field of thermosetting epoxy adhesives, in particular to a halogen-free thermosetting epoxy adhesive and its application. Background technique [0002] The scientific name of electronic paper is Electronic Paper (referred to as E-Paper), also known as Digital Paper (Digital Paper), Paper-Like Display (Paper-Like Display), is an electronic display device with a visual effect similar to paper, easy to read, convenient Features such as portability and low power consumption. E-PAPER is generally made of flexible substrate materials. Flexible substrate materials are generally polyethylene terephthalate (PET) or polymethyl methacrylate (PMMA). These two flexible materials are relatively difficult in plastic substrates. attached. [0003] In the early stage of development, E-PAPER used double-sided adhesive tape for edge sealing to achieve the sealing effect. The initial bonding strength of double-sided tape is strong...
Claims
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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/10C09J11/04C09J11/06C09J11/08
CPCC08K2201/014C08L2201/08C08L2201/22C08L2205/035C09J11/04C09J11/06C09J11/08C09J163/00C08L63/00C08L63/10C08K13/02C08K3/36C08K5/5435
Inventor 叶明浩潘自鼎
Owner 深圳百丽春新材料科技有限公司
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