High-precision digital light processing three-dimensional printer and printing method thereof

A digital light processing and 3D printing technology, applied in processing data acquisition/processing, additive manufacturing, 3D object support structure, etc., can solve the problems of precision decline and volume shrinkage of liquid photosensitive resin, and achieve improved precision and accurate cutting position. Effect

Inactive Publication Date: 2017-06-06
荆门米丰信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The main purpose of the present invention is to provide a solution to the problem that the volume shrinkage of liquid photosensitive resin after curing causes the problem of precision drop.

Method used

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  • High-precision digital light processing three-dimensional printer and printing method thereof
  • High-precision digital light processing three-dimensional printer and printing method thereof
  • High-precision digital light processing three-dimensional printer and printing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0052] like Figure 2 to Figure 4 As shown, the digital light processing 3D printer with automatic compensation function in this embodiment includes a frame 10, a projector light source, a photosensitive resin tank 20, a printing platform 30, a screw drive mechanism 40 and a control system. The photosensitive resin tank 20 is filled with photosensitive resin for light curing and molding. The photosensitive resin tank 20 is arranged in the frame 10. Driven by the screw drive mechanism 40, the printing platform 30 can move in the photosensitive resin tank 20. The printing platform 30 Used to carry three-dimensional objects. The frame 10 forms a closed chamber, so that the light-curing molding process of the photosensitive resin can be placed in a closed environment, and to a certain extent, the irritating exhaust gas generated during the curing process of the photosensitive resin can be prevented from diffusing into the surrounding environment.

[0053] The control system can o...

no. 2 example

[0068] The structure of the 3D printer of this embodiment is basically the same as that of the 3D printer of the first embodiment, and only the differences will be described in detail below.

[0069] like Figure 7 As shown, the first light source 50 is disposed below the bottom plate 21 of the photosensitive resin tank 20 , and the first light source 50 is preferably a digital light processing light source, such as a projector light source. On a side close to the first light source 50, the printing platform 30 has a lower surface 34 for carrying a three-dimensional object.

[0070] The printing platform 30 also includes a spacer 31, the lower surface of the spacer 31 forms a bearing surface (lower surface 34), the bearing surface is a transparent bearing surface, and a second light source 33 is arranged in the spacer 31, and the second light source 33 is preferably Handles light sources for digital light. The second light source 33 is close to the bearing surface, which hel...

no. 3 example

[0079] This embodiment provides a digital light processing three-dimensional printer, which includes a frame 10 , a photosensitive resin tank 20 and a printing platform 30 . The photosensitive resin tank 20 is arranged in the frame 10, and the printing platform 30 for carrying printed objects can move in the photosensitive resin tank 20, and the movement mode of the printing platform 30 can be realized by the transmission mode of the motor and the screw rod.

[0080] The digital light processing three-dimensional printer of this embodiment also includes a cutting mechanism, such as Figure 10 As shown, the cutting mechanism has a push-pull device 60 and a cutting blade 61 connected together. One end of the push-pull device 60 is connected to the side wall 22 of the photosensitive resin tank 20. The push-pull device 60 has a rod that can be stretched in the horizontal direction. The end of the piece is connected to the cutting blade 61. The other end of the push-pull device 60...

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PUM

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Abstract

The invention relates to a high-precision digital light processing three-dimensional printer and a printing method thereof. The high-precision digital light processing three-dimensional printer comprises a frame, a photosensitive resin groove and a printing platform for bearing a printing object; the photosensitive resin groove is formed in the frame and contains liquid photosensitive resin; the printing platform can move in the photosensitive resin groove; a first illuminant is arranged below the photosensitive resin groove; a controller is electrically connected with the printing platform, and comprises a processor and a calibration module; and data of fine adjustment distances is set in the calibration module. Through the fine adjustment distances set in the calibration module, the movement height to be compensated is calculated, and the precision of moving the printing platform upwards by a spacing distance is improved.

Description

technical field [0001] The invention relates to a three-dimensional printer, in particular to a digital light processing three-dimensional printer and a printing method thereof. Background technique [0002] Three-dimensional printing, also known as additive manufacturing or layered modeling, is the process of using a digital model to process a physical object. During the processing, the printed object is built by adding materials layer by layer. [0003] The methods of three-dimensional rapid prototyping mainly include the following types: stereolithography or photocuring (Stereolithography, SLA), layered object manufacturing (Laminated object manufacturing, LOM), selective laser melting (Selective laser Melting, SLM), fused deposition modeling (Fused deposition modeling, FDM). [0004] Digital Light Processing (DLP) is a new type of projection technology based on Digital Micromirror Device (DMD, also known as digital micro device). The digital micromirror chip is a semico...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/135B29C64/20B29C64/30B29C64/393B33Y30/00
CPCB33Y30/00
Inventor 郭鑫
Owner 荆门米丰信息科技有限公司
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