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Packaging structure and packaging method of fingerprint identification chip

A fingerprint recognition and packaging structure technology, applied in character and pattern recognition, acquisition/organization of fingerprints/palmprints, instruments, etc., can solve problems such as reducing the accuracy of fingerprint recognition and electrical signal crosstalk

Inactive Publication Date: 2017-08-15
CHINA WAFER LEVEL CSP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Preparing so many pixels for a fingerprint recognition that is only pressed by one finger can easily cause crosstalk between electrical signals between adjacent pixels and reduce the accuracy of fingerprint recognition

Method used

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  • Packaging structure and packaging method of fingerprint identification chip
  • Packaging structure and packaging method of fingerprint identification chip
  • Packaging structure and packaging method of fingerprint identification chip

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Embodiment Construction

[0115] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0116] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0117] refer to Figure 1a , Figure 1a It is a structural schematic diagram of a package structure of a fingerprint identification chip provided by an embodiment of the present invention. The package structure inc...

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Abstract

The invention discloses a packaging structure and a packaging method of a fingerprint identification chip. The packaging structure comprises the fingerprint identification chip and a semiconductor cover plate for covering the first surface; fingerprint identification chip comprises a first surface and a second surface which are arranged oppositely; a plurality of pixel points used for collecting fingerprint information are on the first surface; a plurality of through holes are formed in the semiconductor cover plate; and the pixel points are exposed from the bottoms of the corresponding through holes. According to the technical scheme, the semiconductor cover plate is arranged on the first surface of the fingerprint identification chip; multiple through holes, in one-to-one correspondence with the pixel points of the fingerprint identification chip, are formed in the semiconductor cover plate; and the through holes are used for exposing the corresponding pixel points, so that the problem of crosstalk between adjacent pixel points can be lowered, and accuracy of fingerprint identification is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a packaging structure and packaging method of a fingerprint recognition chip. Background technique [0002] With the continuous advancement of science and technology, more and more electronic devices are widely used in people's daily life and work, which brings great convenience to people's daily life and work, and has become an indispensable tool for people today. . With the increasing functions of electronic devices, more and more important information is stored in electronic devices, and the identity verification technology of electronic devices has become a main direction of research and development of electronic devices. [0003] Due to the uniqueness and invariance of fingerprints, fingerprint identification technology has many advantages such as good security, high reliability and simple use. Therefore, fingerprint identification technology has become...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/498G06K9/00H01L21/50H01L21/56H01L21/60
CPCH01L23/4985H01L24/85H01L21/50H01L21/56H01L23/3121H01L2224/8536H01L2224/85G06V40/1306
Inventor 王之奇
Owner CHINA WAFER LEVEL CSP
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