A method for forming a double-sided complex cavity of a multilayer ceramic substrate

Abstract

The invention discloses a forming method of a double-faced complex cavity of a multilayer ceramic substrate. The forming method of the double-faced complex cavity comprises the steps that a plurality of upper ceramic substrate bodies or lower ceramic substrate bodies are fixed, an isolation layer and a hard back plate layer are sequentially arranged at the bottoms of the upper ceramic substrate bodies or the lower ceramic substrate bodies, and an isolation layer and a soft filling layer are laid on the upper portions of the upper ceramic substrate bodies or the lower ceramic substrate bodies; then pre-laminating is conducted to obtain ceramic substrate pre-laminated pieces; the upper ceramic substrate pre-laminated pieces and the lower ceramic substrate pre-laminated pieces are superimposed; and a hard filling block is taken out after final laminating. The ceramic substrate is divided into two sub modules containing a one-faced cavity, and the upper ceramic substrate bodies and the lower ceramic substrate bodies are subjected to laminating treatment correspondingly, and then, the double-faced cavity is obtained by conducting superimposed laminating , so that the interior of the bottom face cavity is more flat, bending of the overall substrate cannot occur, product integration and precision are greatly improved, and assembly can be more facilitated.

Description

technical field [0001] The invention relates to the technical field of manufacturing technology of a multilayer ceramic substrate, in particular to a method for forming a double-sided complex cavity of a multilayer ceramic substrate. Background technique [0002] Multilayer co-fired ceramic circuit substrates have been widely used in aviation, aerospace, communications, automotive electronics and other fields due to their high integration density, good reliability, and excellent high-frequency performance. Fabrication of complex cavity is the main step to achieve high-density integration of multilayer co-fired ceramic circuit substrates, and it is also one of the difficulties in the fabrication of substrate technology, especially the processing and molding of double-sided complex cavities. [0003] At present, the production method of double-sided cavity is mostly realized by silica gel filling and protection. Silicone is directly filled in the laminated raw porcelain cavity...

AI Technical Summary

Problems solved by technology

[0005] 1) The material of the hard silicone rubber punch filled in the cavity on the bottom surface is different from that of the ceramic sheet, and the compression rates of the two during the lamination process are different, which makes the compression synchronicity somewhat different. During the lamination process, the hard silicone rubber punch cannot be in perfect contact with the inner wall of the bottom cavity, which makes the internal force of the cavity unbalanced and easily causes the bottom of the bottom cavity to be uneven

This situation is particularly prominent when the cavity on the bottom surface is deep, which affects the assemblability of components during high-density integration;

[0006] 2) Since the punch at the bottom is a whole piece of silicone rubber, there is an upper cavity on the upper layer, which makes the thickness distribution of the upper layer uneven, which makes the rigidity of each position of the upper ceramic substrate vary greatly, and the pressure is greater during lamination. In this way, the back of the green porcelain cannot obtain good rigid support during lamination, which will easily lead to the overall bending or elongation of the substrate and the change of the plane size, thereby reducing the overall flatness of the substrate and the control accuracy of the sintering shrinkage rate. The performance is particularly prominent when the layout is large

[0008] It can also be seen from the prior art that at present, the double-sided cavity molding of the ceramic substrate is carried out as a whole, that is, the entire ceramic substrate is processed to construct the molding cavity, and it is not divided into separate modules for processing molding method

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