High-power LED chip heat dissipation structure

A technology of LED chip and heat dissipation structure, which is applied in lighting and heating equipment, cooling/heating device of lighting device, light source, etc. Effect of liquefaction speed and expansion of droplet formation efficiency

Active Publication Date: 2019-11-29
JIAGNSU PUYA LIGHTING TECH PUBLIC CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat dissipation of actual LED lamps is far from this requirement, so that the life of LED lamps has become a major issue affecting their performance
[0003] For high-power chips, if you want to increase the power, you mainly use heat pipes, air cooling and other means to dissipate heat. However, these structures are often complicated and not suitable for industrial production. The yield rate is low, and the cost is too high to lose the practical significance of energy saving.

Method used

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  • High-power LED chip heat dissipation structure
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Embodiment Construction

[0028] The present invention will be further described in detail through the examples below, so that those skilled in the art can implement it with reference to the description.

[0029] It should be understood that terms such as "having", "comprising" and "including" used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0030] combine Figure 1-2 As shown, there are the following examples:

[0031] A heat dissipation structure for a high-power LED chip, comprising:

[0032] The outer shell 100 is provided with an array of LED chips 200 on its bottom outer surface;

[0033] A partition case 300, which is arranged inside the housing 100, a first cavity 330 is formed between the first surface 310 of the partition case and the side wall 110 of the housing, the second surface 320 of the partition case and the The top inner wall 120 of the housing forms a second cavity 340, the second surface 320 of the partition shell itsel...

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Abstract

The invention relates to a large-power LED chip heat dissipation structure which comprises an outer shell, a separation shell, a liquid drop structure and work liquid. The outer surface of the bottomof the outer shell is provided with arrayed LED chips, and the separation shell is arranged inside the outer shell; a first cavity is constituted between the first surface of the separation shell andthe side wall of the outer shell, and a second cavity is constituted between the second surface of the separation shell and the inner wall of the top of the outer shell; the second surface of the separation shell constitutes a third cavity, and a fourth cavity is constituted between the second surface of the separation shell and the inner wall of the bottom of the outer shell; the liquid drop structure is arranged inside the fourth cavity, and the work liquid is arranged inside the first cavity; and the work liquid is gasified after entering the fourth cavity from the liquid drop structure, and the gasified work liquid sequentially passes through the third cavity and the second cavity and returns to the first cavity. According to the scheme, the novel large-power LED chip heat dissipationstructure is designed.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a high-power LED chip heat dissipation structure. Background technique [0002] People are paying more and more attention to the heat dissipation of LEDs. This is because the light decay or life of LEDs is directly related to its junction temperature. If the heat dissipation is not good, the junction temperature will be high and the lifespan will be short. Lowering the life by 10°C will prolong the life by 2 times. The actual heat dissipation of LED lamps is far from this requirement, so that the life of LED lamps has become a major issue affecting their performance. [0003] For high-power chips, if you want to increase the power, you mainly use heat pipes, air cooling and other means to dissipate heat. However, these structures are often complicated and not suitable for industrial production. The yield rate is low, and the cost is too high to lose the practical significance of energy savin...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): F21V29/51F21Y115/10
CPCF21V29/51F21Y2115/10
Inventor陈旭陈德军
OwnerJIAGNSU PUYA LIGHTING TECH PUBLIC CO LTD