Semiconductor refrigerating air-cooled refrigerator

A semi-conductor and cooling air technology, which is applied in the direction of refrigerators, refrigeration and liquefaction, household refrigeration equipment, etc., can solve the problems of unfavorable environmental sustainable development, complex structural pipelines, and refrigerant pollution, so as to achieve no vibration and noise, and promote Effect of cold circulation and easy installation

Pending Publication Date: 2018-09-21
AUCMA
View PDF8 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problems of direct cooling refrigeration are: complex structure and pipeline, difficult installation, heavy box and difficult to carry, and refrigerant is a source of pollution, which is not conducive to sustainable development of the environment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor refrigerating air-cooled refrigerator
  • Semiconductor refrigerating air-cooled refrigerator
  • Semiconductor refrigerating air-cooled refrigerator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0037] Such as figure 1 , figure 2 As shown, a semiconductor refrigeration air-cooled refrigerator includes a box shell assembly 1, an inner tank assembly 2, an electrical box assembly 3, a circulating fan assembly 5, a wire tube cooling assembly 6, and a semiconductor refrigeration assembly 7;

[0038] Case assembly 1, such as image 3 As shown, it includes a box body front plate 11 fixedly connected into a box structure, a box body rear plate 12 and a box body...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a semiconductor refrigerating air-cooled refrigerator. The semiconductor refrigerating air-cooled refrigerator comprises a box shell assembly, a liner assembly, an electrical box assembly, a circulating fan assembly, a threaded tube heat-dissipation assembly and a semiconductor refrigerating assembly; the liner assembly is mounted in the box shell assembly, the periphery ofthe box shell assembly is fixed in slots of a refrigerator opening in the liner assembly, the electrical box assembly is fixed in a stretching hole of the box shell assembly through a buckle, the semiconductor refrigerating assembly is fixed on the right side of a liner body, and cold conduction plates of semiconductor refrigerating plates face wards; the circulating fan assembly is arranged overthe semiconductor refrigerating assembly, and a step in the circulating fan assembly is in lap joint to a liner step in the liner assembly; and the threaded tube heat-dissipation assembly is fixed onthe box shell assembly. The semiconductor refrigerating air-cooled refrigerator has the beneficial effects that refrigeration is implemented through the semiconductor refrigerating plates, and a traditional compressed refrigerating mode is changed; and by reasonable arrangement of an air inlet channel and an air outlet channel of a refrigerator box, cold circulation in the refrigerator box is promoted, and a good refrigerating effect is achieved.

Description

technical field [0001] The invention relates to the technical field of refrigerators, in particular to a semiconductor refrigeration air-cooled refrigerator. Background technique [0002] At present, the traditional refrigerators basically use the compressor to provide power to drive the refrigerant to circulate in the refrigeration system, and the evaporator is pasted around the inner tank, and most of them adopt the direct cooling refrigeration method. The problems of direct cooling refrigeration are: complex structural pipelines, difficult installation, bulky cabinets that are not easy to transport, and refrigerant is a source of pollution, which is not conducive to sustainable development of the environment. Contents of the invention [0003] In order to solve the above technical problems, the present invention provides a semiconductor refrigeration air-cooled refrigerator. [0004] To achieve the above object, the present invention adopts the following technical solu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): F25D11/00F25D17/06F25D19/00F25B21/02
CPCF25B21/02F25D11/00F25D17/06F25D19/003
Inventor 张济南杜成刚寇德龙董智理
Owner AUCMA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap