5results about How to "High precision temperature control" patented technology

The utility model belongs to the technical field of semiconductors, and discloses a wafer bearing device and wafer testing equipment. The wafer bearing device comprises a bearing disc, a cooling member and a heating member. One side of the bearing disc is used for bearing wafers, and the bearing disc is provided with a plurality of adsorption holes used for adsorbing and fixing the wafers; the cooling piece is fixedly arranged on the other side of the bearing disc, and a cooling flow channel allowing cooling liquid to circularly flow is defined between the cooling piece and the bearing disc; the heating member is arranged on one side, far away from the bearing disc, of the cooling member and is used for heating the wafer. When the bearing device is used, heat generated by the heating piece can be transmitted into the bearing disc only through the one-layer structure of the cooling piece during transmission, so that the temperature control precision of the bearing disc is effectively improved, and when automatic control is carried out according to an actual control program, the temperature difference amplitude of the bearing disc can be kept at + / -0.5 DEG C or even lower; therefore, the bearing disc can keep good temperature uniformity in the wafer testing process.

The utility model relates to a rotor refrigerating plant of vacuum centrifuge, including mounting seat, semiconductor refrigeration subassembly and fluid passage, semiconductor refrigeration subassembly is used to form refrigeration end and heat -generating end, the heat -generating end is pasted with mounting seat, the refrigeration end is used to radiate refrigeration to rotor, the mounting seat is used to bear semiconductor refrigeration subassembly and conduction heat, fluid passage sets up in mounting seat, fluid passage is used to flow circulation refrigerant and take away the heat of mounting seat, the utility model discloses a clever combination of the refrigeration of semiconductor refrigeration subassembly and fluid passage circulation refrigerant heat dissipation, forms stable temperature difference in vacuum environment, utilizes heat radiation and exchanges heat to give rotor cooling, has solved the rotor refrigeration heat dissipation problem of vacuum centrifuge.

This pulsed electric field processing device is provided with: a pulsed power supply that generates a pulsed voltage; a pair of electrodes to which a pulsed voltage is applied to generate a pulsed electric field; a processing chamber that is disposed between the electrodes and generates a pulsed electric field in a space in which a liquid object to be processed flows; a temperature calculation unit (42) that calculates a processing temperature, which is the temperature of the object to be processed in the processing chamber, on the basis of a preset correction value and a resistance value obtained from the pulse voltage and a pulse current flowing in the object to be processed in the processing chamber when the pulse voltage is applied; and a power supply control unit (41) that controls the pulsed power supply on the basis of the processing temperature and a preset target temperature.

The invention relates to the technical field of semiconductor manufacturing, and discloses a rapid temperature adjusting and cooling system for an electrostatic chuck (ESC), which comprises a cooling liquid management module, a low-temperature cooler is connected through a low-temperature cooling unit, a temperature monitor is arranged in the low-temperature cooler, and temperature data of cooling liquid in the low-temperature cooler is monitored in real time; a normal-temperature cooling unit is connected with a normal-temperature cooler, a temperature monitor is arranged in the normal-temperature cooler to monitor temperature data of cooling liquid in the normal-temperature cooler in real time, and a mixing adjusting module is connected with a mixing cavity to receive cooling liquid from the low-temperature cooler and the normal-temperature cooler and mix the cooling liquid. The intelligent control module is connected with the mixing adjusting module, deploys a temperature monitor, monitors temperature data of cooling liquid in a mixing chamber, calculates a temperature demand difference and then outputs a control instruction to adjust the temperature of the cooling liquid in the mixing chamber according to a calculation result, and the operation execution module takes an electrostatic chuck (ESC) as a carrier, receives the mixed cooling liquid and sends the mixed cooling liquid to the mixing adjusting module. And the etching operation and the Decuck operation are executed.

The invention discloses a temperature numerical value compensation method and system of a temperature controller, and relates to the technical field of electric digital processing. The method comprises the following steps: constructing a master-slave temperature control system, and setting voltage compensation models corresponding to a plurality of temperature controllers; the temperature controller is set to obtain a voltage compensation time sequence according to the voltage compensation model in the working process, and the voltage measurement time sequence and the voltage compensation time sequence are transmitted to the main control module; the main control module generates a voltage output time sequence according to the voltage measurement time sequence and the voltage compensation time sequence, corrects a fitting parameter group and sends the fitting parameter group to the temperature controller; and the temperature controller updates the stored voltage compensation model according to the fitting parameter group. According to the invention, the stored voltage compensation model is updated through the temperature controller according to the fitting parameter group, so that the compensation parameter is always matched with the current state of the electronic component of the temperature controller, thereby ensuring that the temperature controller can still keep high-precision temperature control under the condition that the electronic component is aged.