Circuit board through-hole plating activator, and preparation method thereof
An activator and circuit board technology, which is applied in the fields of printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of high cost, outdated formula, and performance indicators that cannot keep up with the pace of PCB development, and achieve stable activity and excellent activation effect Effect
Pending Publication Date: 2018-12-04
惠州市荣安达化工有限公司
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Problems solved by technology
[0002] Printed circuit board (PCB) is an important part to realize the overall function of electronic components, and is the foundation of the electronic and electrical industry, and one of the most important processes for making PCB is hole wall metallization, because the PCB substrate is a non-metallic material, Non-conductive, the metallization of the hole wall is to electrically conduct the two ends of the drilled PCB board, and as a connection between the outer layer and the inner layer. The overall reaction can be divided into two types: electroless copper plating and direct electroplating. Mode, need to use colloidal palladium activator activation reaction in the electroless copper plating process, what the colloidal palladium activator that sells at present adopts is traditional production process, and formula is outdated, and the content of palladium chloride in the formula is 3g / L, and cost Expensive, and various performance indicators can no longer keep up with the pace of PCB development
Method used
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[0020] In order to further understand the content of the invention, features and effects of the present invention, the following examples are listed below for illustration.
[0021] Components and proportioning amounts (parts by weight) are as follows, A component: sodium chloride 25, hydrochloric acid solution 2, hydroquinone 1, palladium chloride 0.75, deionized water 71.25; B component: stannous chloride 16.2 , hydrochloric acid solution 2.8, deionized water 81.
[0022] Preparation steps:
[0023] a. Add deionized water to A reaction kettle, start stirring, add sodium chloride, after completely dissolving, slowly add hydrochloric acid, then add hydroquinone, after completely dissolving, add palladium chloride until completely dissolving, start Heating, when the temperature rises to 80 degrees, keep the temperature constant for half an hour, turn off the heating, keep stirring, and obtain the component A solution.
[0024] b. Add deionized water into the reaction kettle B...
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Abstract
The invention discloses a circuit board through-hole plating activator, and a preparation method thereof. The circuit board through-hole plating activator comprises a component A and a component B; the component A comprises, by weight, 24 to 28 parts of sodium chloride, 1.5 to 2.5 parts of a hydrochloric acid solution, 0.8 to 1.5 parts of hydroquinone, 0.6 to 0.9 part of palladium chloride, and 65to 72 parts of deionized water; the component B comprises, by weight, 15 to 18 parts of stannous chloride, 2.5 to 3.3 parts of a hydrochloric acid solution, and 76 to 82 parts of deionized water. Optimization of the formula component ratio is capable of maintaining the content of palladium chloride in the circuit board through-hole plating activator to be about 1.5g / L. Compared with conventionalcolloid palladium activator, the palladium chloride content is reduced by 40 to 50%. The activation effect of the circuit board through-hole plating activator in electroless plating chemical copper technology is better than that of conventional colloid palladium activator, and the activity is stable.
Description
technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to an activator for perforated electroplating of circuit boards and a preparation method thereof. Background technique [0002] Printed circuit board (PCB) is an important part to realize the overall function of electronic components, and is the foundation of the electronic and electrical industry, and one of the most important processes for making PCB is hole wall metallization, because the PCB substrate is a non-metallic material, Non-conductive, the metallization of the hole wall is to electrically conduct the two ends of the drilled PCB board, and as a connection between the outer layer and the inner layer. The overall reaction can be divided into two types: electroless copper plating and direct electroplating. Mode, need to use colloidal palladium activator activation reaction in the electroless copper plating process, what the colloidal palladium act...
Claims
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IPC IPC(8): C23C18/18C23C18/38H05K3/42
CPCC23C18/1879C23C18/38H05K3/422
Inventor黄昌希刘平
Owner惠州市荣安达化工有限公司