A review method, system and storage medium for layout data

A technology of layout data and layout, applied in the review method of layout data, systems and storage media, can solve problems such as low design efficiency, large memory usage, and reduced review efficiency, so as to save import time, improve efficiency, and reduce hardware The effect of resource demand

Active Publication Date: 2020-11-17
北京华大九天科技股份有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, to review the DRC (Design Rule Check) results of the chip, each designer needs to spend the same amount of time to complete the process of importing the layout data from the hard disk, which is inefficient and takes up a lot of memory.
[0004] Although multiple people can review through the traditional method of shared desktop such as VNC, due to the limitation of one desktop, all personnel cannot perform parallel operations at the same time, which also greatly reduces the efficiency of review

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A review method, system and storage medium for layout data
  • A review method, system and storage medium for layout data
  • A review method, system and storage medium for layout data

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0034] figure 1 It is a flow chart of the review method of layout data according to the present invention, and the following will refer to figure 1 , to describe the review method of layout data in the present invention in detail.

[0035] In step 101, the imported layout data of the pre-reviewed layout is preprocessed in memory to obtain core data of the pre-reviewed layout and share the core data.

[0036] In this step, the review system receives the layout data of the pre-reviewed layout imported by the first reviewer from a storage device such as a hard disk, sorts the layout data in the memory according to the position information of the graphics, and sorts th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A layout data review method and system and a storage medium are disclosed. The method comprises the following steps: pre-processing the imported layout data of a pre-review layout in a memory to obtain the core data of the pre-review layout and share the core data; building virtual addresses based on where the core data resides and accessing the core data through user space. The layout data reviewmethod, and system and the storage medium of the invention reasonably distribute and utilize the memory to directly access the memory data through the mapping of the virtual addresses, so as to improve the speed and efficiency of the large layout data import, browse and edit cooperated by multiple persons, and are particularly suitable for the layout data review of large-scale integrated circuitsby multiple persons.

Description

technical field [0001] The invention relates to the technical field of EDA design, in particular to a layout data review method, system and storage medium. Background technique [0002] With the development of semiconductor manufacturing technology and the expansion of integrated circuit design scale, more wiring layers and graphics are included in the chip layout, and the amount of data that needs to be processed is also increasing. Resource utilization presents challenges. [0003] It takes longer for designers to open layout data and consumes more memory. Especially in scenarios like team design, where multiple designers are required to open, browse and even edit the same layout at the same time. For example, when reviewing the DRC (Design Rule Check) results of a chip, every designer needs to spend the same amount of time to complete the process of importing layout data from the hard disk, which is inefficient and takes up a lot of memory. [0004] Although multiple p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G06F9/50G06F9/54
CPCG06F9/5016G06F9/544
Inventor 王阳苏毅
Owner 北京华大九天科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap